International Reliability Physics Symposium

General Chair's Welcome
Technical Program Chair's Message
Arrangements Chair's Information
Printable Preliminary Program ver dtd 2/19/02, 323k pdf right click to save to disk

TUTORIALS      (a printable list of all the tutorial abstracts)

Sunday, April 7, First Day Tutorial Listings • Emphasis on reliability fundamentals

Sunday, April 7, 7:00 p.m. - 11:00 p.m. • SER Panel Discussion Workshop

Monday, April 8, Second Day Tutorial Listings • Emphasis on advanced relability topics

PAPERS

Tuesday - Thursday, April 9, 10, & 11
• Technical Program at-a-glance (pdf) • Detailed Technical Program Abstracts (html, rev. 22Feb02)

• Tuesday Morning & Afternoon
  • Opening: Keynote Address Bernie Meyerson
  • Session 1 – Non Volatile Memories
    parallel sessions

  Session 2A – Dielectrics I Session 2B – Hot Carriers

  Session 2C – MEMS Session 2D – Assembly & Packaging

• Tuesday Evening at Union Station (connected via underground passage to hotel)
  • Symposium Reception & Awards Presentation
  • Talk by Inventor of IC, Jack Kilby
  • Poster Presentations
• Wednesday Morning & Afternoon - parallel sessions

  Session 3A – ESD/Latchup Session 3B – Compound Semiconductor I

  Session 3C – Failure Analysis Session 3D – Product Reliability

  
  

  Session 4A – Compound Semiconductor II Session 4B – Device & Process

  Session 4C – Product Reliability II Session 4D – Interconnects

• Wednesday Evening, April 10, Workshop Program
  (informal gatherings on selected topics, Srikanth Krishnan, Workshop Chair s-krishnan1@ti.com )
• Thursday Morning & Afternoon
  • Session 5 – Process Induced Damage
  • Panel Discussion: Product Qualification in the 21^st Century
  • SPECIAL TOPIC: Germicidal Irradiation of the US Mail: Can ICs Survive while Bacteria Perish?
    Three papers are in preparation dealing with irradiation of US mail to kill anthrax spores and the survivability of semiconductors at those radiation levels . Check back for updates.
  • Session 6 – Dielectrics II

Symposium Registration Fees: 
Advance Member $350 ; Advance Nonmember $400
Door Member $400 ; Door Nonmember $450
Tutorial Registration Fees: 
Combined Sunday & Monday – Advance $460 ; Door $500
Sunday or Monday – One day only: Advance $260 ;  Door $300

Registration Information and forms, Hotel Information

Equipment Demonstration Exhibit Program Information (under construction)

Press Releases

Technical Program Chair's public home page
   includes abstract submission guidelines,
   Author Kit,  +   FAQ's,  and    2002 IRPS Call for Papers and Call for Posters   pdf   (Submission deadlines passed)

Site pictures by W.R. Tonti

Information for committee members   requires password

IRPS is sponsored by the IEEE Electron Device Society and the IEEE Reliability Society

IRPS PROCEEDINGS / VIDEOS (for sale) / HISTORY

Link for downloading Adobe AcrobatReader

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