ISTFA, "International Symposium for Testing and Failure Analysis" et "IEE proc. IGBT propulsion drives", London, mai 2002.
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Titre : ISTFA, International Symposium for Testing and Failure Analysis et IEE proc. IGBT propulsion drives, London, mai 2002.
Cité dans : [DATA224] Liste alphabétique des conférences, août 2016.
Cité dans :[99DIV081] Dates des congrès sur les Convertisseurs Statiques, avril 2013.
Site : http://www.asminternational.org/istfa
Date : 2-8 November 2003
Congrès : 29th International Symposium for Testing and Failure Analysis
Lieu : Santa Clara, California
Site : http://www.asminternational.org/istfa
Date : November 3 - 7, 2002.
Lieu : Phoenix Civic Plaza, in Phoenix, Arizona USA.
Congrès : 28th International Symposium for Testing and Failure Analysis.
Abstracts : by March 25, 2002.
Manuscripts : by July 15, 2002.
Feedback : by August 5th
Final : by August 19, 2002.
Lien : ISTFA/istfa2002/default.htm - le 10 mai 2002.
Site : http://www.asminternational.org/istfa
Date : 2001, 11-15 November.
Lieu : Santa Clara, California
Congrès : 27th International Symposium for Testing and Failure Analysis.
Lien : ISTFA/ISTFA01.htm - le 10 mai 2002.
Publisher : ASM International Stock Status: In Stock
Product_Code : 02203z
ISBN/ISSN : 0-87170-746-2
Format : Book & CD
This proceedings volume presents in-depth coverage of the latest developments and the most advanced techniques for microelectronics failure analysis.
Contents :
Advanced techniques * Packaging * Backside analysis * Scanning probe microscopy * Focused ion beam (FIB) techniques * Failure analysis of micro-electromechanical systems (MEMS) * Yield improvement * Discretes * Defect-based testing * Case histories
Pages : Approx. 550
Date : 12-15 November 2000
Lieu : Bellevue WA
Congrès : 26th International Symposium for Testing and Failure Analysis.
Lien : ISTFA/ISTFA00.htm - le 10 mai 2002.
Publisher: ASM International Stock Status: In Stock
Product_Code : 02202Z
ISBN/ISSN : 0-87170-701-2
Format : Book & CD
This proceedings presents in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components. The book covers the full spectrum of failure analysis topics, but with special emphasis on backside (flipchip) failure analysis and the diagnosis of high-end microchip failures by analyzing the silicon.
Audience: Personnel involved in the failure analysis of microelectronic components, materials scientists and materials engineers, electrical engineers, and researchers
Contents: Advanced Techniques * Packaging * Testing and Yield Enhancement * Backside Analysis * New Techniques * Case Histories * Focused Ion Beam Analysis * Scanning Probe Microscopy Analysis
Pages : 577
Date : 14-18 November 1999
Lieu : Santa Clara, California
Congrès : 25 International Symposium for Testing and Failure Analysis (Book and CD ROM)
Lien : ISTFA/ISTFA99.htm - le 10 mai 2002.
Publisher : ASM International Stock Status: In Stock
Product_Code : 02201Z
ISBN/ISSN : 0-87170-646-6
CONTENTS :
Microelectronic Devices
Basics of Failure Analysis
Advanced Techniques
FA-Laboratory Management
FIB x Case Histories
EOS/ESD
FA of Discrete Components
Testing
Backside Analysis
NOTE : The CD-ROM's PDF-file format can be accessed using Adobe Acrobat Reader 4.0 or higher
Published : 1999
Congrès : 24th International Symposium for Testing and Failure Analysis
Info : ASM Publication, 413 pp., 1998.
ISBN : 0871706695
Lieu : Dallas, TX,
Date : 15-19 November 1998
Lien : ISTFA/ISTFA98.htm - le 10 mai 2002.
Contents :
Defect and Failure Verification, Characterization and Localization
De-Processing
Testing, Inspection, and Sample Preparation
ESD Damage
Failure-Analysis Techniques
Backside Analysis
Focused Ion-Beam Systems
Discrete Electronic Devices
Packaging
Military Applications Case Histories
[1] : [DATA148] ISTFA'98, 24th International Symposium for Testing and Failure Analysis, Dallas, TX, 15-19 November 1998.
Congrès : 23rd International Symposium for Testing and Failure Analysis
Congrès : 22nd International Symposium for Testing and Failure Analysis
Congrès : 21th International Symposium for Testing and Failure Analysis
Site :
Lieu :
Résumé :
Notification :
Date :
[1] : [SHEET339] W. WU, P. SCACCO, M. HELD, P. JACOB, Electrical Overstress Failure in Power Insulated Gate Bipolar Transistors Modules, 21th International Symposium for Testing and Failure Analysis, 1995, pp 159-162.
[2] : [ART225] P. MALBERTI, M. CIAPPA, R. CATTOMIO, A power-cycling-induced failure mechanism of IGBT multichip modules, Proc. ISTFA, 163-168, Santa Clara, USA, 1995.
Congrès : 20th International Symposium for Testing and Failure Analysis
Site :
Lieu :
Résumé :
Notification :
Date :
[1] : [SHEET359] P. JACOB, M. HELD, P. SCACCO, W. WU, Reliability testing and analysis of IGBT power semiconductor modules, Proceeding of the 20th International Symposium for Testing and Failure Analysis, 1994, pp. 319-325.
[2] : [SHEET354] P. JACOB, M. HELD, P. SCACCO, W. WU, Reliability testing and analysis of IGBT power semiconductor modules, IEE proc. IGBT propulsion drives, London, pp. 4.1-4.5, 1995.
Congrès : 19
Date : 1993
Congrès : 18
Date : 1992
Congrès : 17th International Symposium for Testing and Failure Analysis
Date : 1991
Lieu : Los Angeles, USA.
[1] : [ART224] K. OHGA, Failure analysis of bonding wires in power transistor modules, Proc. ISTFA, 237-247, Los Angles, USA, 1991.
Congrès : 16
Date : 1990
Congrès : 15
Date : 1989
[1] : [SHEET394] S. SUMI, K. OHGA, K. SHIRAI, Thermal fatigue failures of large scale package type power transistor modules, ISTFA Symposium, 1989, pp 309-322.
Congrès : xx International Symposium for Testing and Failure Analysis
Site :
Lieu :
Résumé :
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Date :
[1] : [SHEET161] D. POTE, G. THOME, T. GUTHRIE, An overview of infrared thermal imaging techniques in the reliability and failure analysis of power transistors, 1987.
Congrès : 13
Date : 1987
Congrès : 12
Date : 1986
Congrès : 11
Date : 1985
Congrès : 10
Date : 1984
Congrès : 9
Date : 1983
Congrès : xx International Symposium for Testing and Failure Analysis
Site :
Lieu :
Résumé :
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Congrès : 7
Date : 1981
Congrès : 6
Date : 1980
Congrès : 5
Date : 1979
Congrès : 4
Date : 1978
Congrès : 3
Date : 1977
Congrès : 2
Date : 1976
Congrès : 1
Date : 1975
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