Proceedings of the 26th International Symposium for Testing and Failure Analysis held 12-15 November 2000 in Bellevue WA

This proceedings presents in-depth coverage of the latest developments and the most advanced techniques for testing and failure analysis of microelectronic components. The book covers the full spectrum of failure analysis topics, but with special emphasis on backside (flipchip) failure analysis and the diagnosis of high-end microchip failures by analyzing the silicon.

The CD-ROM provides the complete content in searchable Adobe Acrobat® PDF format.

Audience: Personnel involved in the failure analysis of microelectronic components, materials scientists and materials engineers, electrical engineers, and researchers

Contents: Advanced Techniques * Packaging * Testing and Yield Enhancement * Backside Analysis * New Techniques * Case Histories * Focused Ion Beam Analysis * Scanning Probe Microscopy Analysis

Published: 2000
Pages: 577

Failure Analysis of Tungsten Stud Defects from the CMP Process

K. Takagi, Y. Kohno ITES Co., Ltd. Shiga, Japan; S. Nukii, IBM Japan, Ltd.

Integrated Circuit SNR improvement using Dielectric Altering
Compound, Laser Trim, and FIB system.

B.J. Dutt, J.J. Kroutch, Jr., K.N. Hooghan, R.J. Jenkins, M.J. Toth
Lucent Technologies, Allentown, Pennsylvania, U.S.A.