C. Hager, A. Stuck, Y. Tronel, R. Zehringer, W. Fichtner, "Comparison between Finite-Element and Analytical Calculations for the Lifetime Estimation of Bond Wires in IGBT Modules", ISPSD'2000, pp. 291-294.
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Titre : C. Hager, A. Stuck, Y. Tronel, R. Zehringer, W. Fichtner, Comparison between Finite-Element and Analytical Calculations for the Lifetime Estimation of Bond Wires in IGBT Modules, ISPSD'2000, pp. 291-294.

Cité dans : [DATA125] ISPSD'2000, 12th Internationnal Symposium on Power Semiconductor Devices & Integrated Circuits, May 22-25 2000, Toulouse, France.
Auteur : C. Hager
Auteur : A. Stuck
Auteur : Y. Tronel
Auteur : R. Zehringer
Auteur : W. Fichtner

Vers : Bibliographie
Stockage :
Lien : private/HAGER.pdf - 982 Ko, 4 pages.
Source : ISPSD'2000, Toulouse, France
Pages : 291 - 294
Date : May 22-25, 2000

Abstract :
Coffin-Manson fatigue law based lifetime estimations of aluminum bond wires in IGBT modules under
field conditions were performed. The models were calibrated with fatigue data obtained from
accelerated lifetime tests and plastic strain computations corresponding to test conditions.
The calibrated laws were then used to predict the bond wire lifetime under field conditions.
To evaluate the influence of the plastic strain calculations finite-element and analytical
computations were performed and the resulting lifetimes compared.


Bibliographie

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Référence : 14
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[7] : P. Malberti, M. Ciappa, and R. Cattomio, "A Power Cycling-Induced Failure Mechanism of IGBT Multichip Modules", ISTFA'95, Proc. 21th Int. Symposium for Testing and Failure Analysis, 6-10 November, 1995, Santa Clara, California, pp. 163-168
[8] : M. Ciappa, and P. Malberti, "Plastic-strain of aluminium interconnections during pulsed operation of IGBT multichip modules", Quality and Reliability Engineering International, vol. 12, no. 4; July-Aug. 1996; pp. 297-303
[9] : ISE Integrated Systems Engineenng AG, "TED-ISE user manual", ISE TCAD Release 6.0 Manual Part 28, ISE AG (1999)
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