Article : [SHEET144]
Info : COMPENDEX Answer Number 20 - 22/02/2000
Titre : C. BASARAN, R. CHANDAROY, Finite element simulation of the temperature cycling tests, 1997.
Cité dans : [DATA152] Recherche sur l'auteur M. PECHT, octobre 2002. Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004. Cité dans :[DIV194]Auteur : Cemal Basaran, (State Univ of New York, Buffalo, NY, USA)
Source : IEEE Transactions on Components, Packaging, and Manufacturing Technology Part A v 20 n 4
Date : Dec 1997
Pages : 530 - 536
CODEN : IMTAEZ
ISSN : 1070-9886
Language : English
Stockage : Thierry LEQUEU
Logiciel : oui
Lien : private/BASARAN.pdf - 7 pages, 178 Ko
Abstract :
Temperature cycling tests are commonly used in the semiconductor
industry to determine the number of cycles to failure and to predict
reliability of the solder joints in the surface mount technology
packages.In this paper, the thermomechanical fatigue of Pb40/Sn60
solder joint in a leadless ceramic chip carrier package is studied
and temperature cycling test is simulated by using a finite element
procedure with the disturbed state concept (DSC) constitutive
models.The progress of disturbance (damage) and the energy
dissipated in the solder joint during thermal cycling are
predicted.It is shown that the disturbance criterion used follows a
similar path as the energy dissipation in the system.Moreover, the
comparisons between the test data and the finite element analysis
show that a finite element procedure using the DSC material models
can be instrumental in reliability analysis and to predict the
number of cycles to failure of a solder joint. Furthermore, the
analysis gives a good picture of the progress of the failure
mechanism and the disturbance in the solder joint. (Author abstract)
Accession_Number : 1998(12):2837
References : 46 Refs.
[1] : D. Barker, Vodzak, A. Dasgupta, and M. Pecht, "Combined vibra-tional and thermal solder joint fatigue-A generalized strain versus life approach," J. Electron. Packag., vol. 112, pp. 129-134, 1990.
[2] : C. Basaran and C. S. Desai, Finite Element Thermomechanical Analysis of Electronic Packaging Problems Using the Disturbed State Constitutive Models, Report to NSF, Dept. Civil Engineering and Engineering Mechanics, Univ. of Arizona, Tucson, 1994.
[3] : K. J. Bathe, Finite Element Procedures. Engelwood Cliffs, NJ: Prentice-Hall, 1996.
[4] : N. R. Bonda and I. C. Noyan, "Effect of specimen size in predicting the mechanical properties of Pb/Sn solder alloys," IEEE Trans. Comp., Packag., Manufact. Technol., vol. 19, 1996.
[5] : J. Chia and C. S. Desai, Constitutive Modeling of Thermomechanical Response of Materials in Semiconductor Devices With Emphasis on Interface Behavior, Report to NSF, Depart. Civil Engineering and Engineering Mechanics, University of Arizona, 1994.
[6] : J.-P. Clech and J. A. Augis, "Engineering analysis of thermal cycling accelerated test for surface-mount attachment reliability evaluation," in Proc. VII Ann. Electron. Packag. Conf., Boston, MA, Nov. 1987, vol. 1, pp. 385-411.
[7] : R. Darveaux, Y. Edward, I. Turlik, and K. I. Murty, "Mechanical char-acteristics of IN and Pb55Sn solders in a thinfilm multichip package," in Proc. Mater. Res. Symp., vol. 203, pp. 443-449, 1991.
[8] : A. Dasgupta, C. Oyan, D. Barker, and M. Pecht, "Solder creep-fatigue analysis by an energy-partitioning approach," Trans. ASME, J. Electron. Packag., vol. 114, 1992.
[9] : C. S. Desai, "A consistent finite element technique for work-softening behavior," in Proc. Int. Conf. Comp. Meth. Nonlinear Mech., J. T. Oden et al., Eds. Austin, TX: Univ. of Texas Press, 1974.
[10] : , Elementary Finite Element Method. Englewood Cliffs, NJ: Prentice-Hall, 1979.
[11] : C. S. Desai and H. Siriwardane, Constitutive Laws for Engineering Materials: With Emphasis on Geologic Materials. Englewood Cliffs, NJ: Prentice-Hall, 1984.
[12] : C. S. Desai, "Constitutive modeling using the disturbed state as mi-crostructure self-adjustment concept," in Continuum Models for Ma-terials with Microstructure, H. B. Muhlhaus, Ed. New York: Wiley, 1996.
[13] : C. S. Desai, C. Basaran, and Z. Wu, "Numerical algorithms and mesh sensitivity in disturbed state concept models," Int. J. Numer. Meth., vol. 40, pp. 3059-3083, 1997.
[14] : D. R. Frear, S. N. Burchett, and M. M. Rashid, "A microstructurally based model of solder under conditions of thermomechanical fatigue," Trans. ASME Adv. Electron. Packag., vol. EEP-10, no. 1, 1995.
[15] : Q. Guo, E. C. Cutiongco, L. M. Keer, and M. E. Fine, "Thermome-chanical fatigue life prediction of 63Sn/37Pb solder," Trans. ASME, J. Electron. Packag., vol. 114, pp. 145-151, June 1992.
[16] : P. Hall, "Forces, moments and displacements during thermal chamber cycling of leadless ceramic chip carriers soldered to printed boards," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. CHMT-7, pp. 314-327, 1984.
[17] : P. M. Hall and W. M. Sherry, "Materials, structures, and mechanics of solder-joints for surface-mount microelectronics technology," in Proc. Lectures 3rd Int. Conf. Techniques de Connexion en Electronique, Welding Society, Fellbach, Dusseldorf, Germany, Feb. 1986, pp. 18-20.
[18] : C. A. Harper, Handbook of Materials and Processes for Electronics. New York: McGraw-Hill, 1970.
[19] : J. H. Huang, J. Y. Pei, Y. Y. Qian, and Y. H. Jiang, "Life predictions of SMT solder joints under thermal cycling," Soldering Surface Mount Technol., 1994, vol. 16, pp. 31-50.
[20] : H. Ishikawa and K. Sasaki, "Constitutive model for 60Sn-40Pb solder under cycling loading," Adv. Electron. Packag.,inProc. Joint ASME/JSME Conf. Electron. Packag., W. T. Chen and H. Abe, Eds., 1992, vol. 1, pp. 401-408.
[21] : L. M. Kachanov, Introduction of Continuum Damage Mechanics. Am-sterdam, The Netherlands: Martinus Nijhoff, 1986.
[22] : S. Knecht and L. R. Fox, "Constitutive relation and creep-fatigue life model for eutectic tin-lead solder," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 13, pp. 424-433, June 1990.
[23] : J. H. Lau, D. W. Rice, and D. A. Avery, "Elasto plastic analysis of surface mount solder joints," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. CHMT-10, Sept. 1987.
[24] : J. Lau and S. Erasmus, "Reliability of fine pitch plastic quad at pack leads and solder joints under bending twisting and thermal conditions," J. Electron. Packag., vol. 115, pp. 322-328, 1993.
[25] : H. B. Muhlhaus, "A thermodynamic criteria for damage," in Proc. 8th Int. Conf. Int. Assoc. Comput. Methods Adv. Geomech., WV, May 1994, pp. 22-28.
[26] : Y. Oshida and P. Chen, "High and low-cycle fatigue damage evaluation of multilayer thin film structure," Trans. ASME, J. Electron. Packag., vol. 113, Mar. 1991.
[27] : D. R. J. Owen and E. Hinton, Finite Elements in Plasticity. Swansea, U.K.: Pineridge.
[28] : T. Pan, "Thermal cycling induced plastic deformation in solder joints: Part III: Strain-energy based fatigue life model and effects of ramp rate and hold time," in Proc. ASME Winter Ann. Meet., Atlanta, GA, Dec. 1991, pp. 1-6.
[29] : Y. H. Pao, K. L. Chen, and A. Y. Kuo, "A nonlinear and time dependent finite element analysis of solder joints in surface mounted components under thermal cycling," in Proc. Mat. Res. Soc. Symp., 1991, vol. 226.
[30] : Y. H. Pao, R. Govila, S. Badgley, and E. Jih, "An experimental and finite element study of thermal fatigue fracture of PbSn solder joints," J. Electron. Packag., vol. 115, pp. 1-8, 1993.
[31] : E. D. Riemer, "Prediction of temperature cycling life for SMT solder joints on TCE-mismatched substrates," in Proc. Electron. Comp., 1990, pp. 418-423.
[32] : R. G. Ross, L. C. Wen, G. R. Mon, and E. Jetter, "Solder creep-fatigue interactions with exible leaded parts," J. Electron. Packag., vol. 114, pp. 185-192, 1992.
[33] : J. Sauber and Seyyedi, "Predicting thermal fatigue lifetimes for SMT solder joints," J. Electron. Packag., vol. 114, pp. 472-476, 1992.
[34] : C. G. Schmidt, "A simple model for fatigue of leadless ceramic chip carrier solder attachments," J. Electron. Manufact., vol. 2, pp. 31-36, 1992.
[35] : W. M. Sherry, J. S. Erich, M. K. Bartschat, and F. B. Prinz, "Analytical and experimental analysis of LCCC solder joint fatigue life," in Proc. Electron. Comp. Conf., 1985, pp. 81-90.
[36] : A. Skipor, S. Harren, and J. Botsis, "Constitutive characterization of 63/37 Sn/Pb eutectic solder using the bodner-partom unified creep-plasticity model," ASME, Adv. Electron. Packag., pp. 661-672, 1992.
[37] : H. D. Solomon, "Low cycle fatigue of 60/40 solder plastic strain limited vs. displacement limited testing," Electron. Packag.: Mater. Processes, pp. 29-47, 1989.
[38] : H. D. Solomon and E. D. Tolksdorf, "Energy approach to the fatigue of 60/40 solder: Part II-In uence of hold time and asymmetric loading," J. Electron. Packag., vol. 118, pp. 67-71, 1996.
[39] : R. Subrahmanyan, J. R. Wilcox, and C. Li, "A damage integral approach to thermal fatigue of solder joints," IEEE Trans. Comp., Hybrids, Manufact. Technol., vol. 12, Dec. 1989.
[40] : E. Suhir, "Thermal stress failures in microelectronic components-review and extension," in Advances in Thermal Modeling of Electronic Com-ponents and Systems, A. Bar-Cohen and A. Kraus, Eds. 1989, ch. 5, vol. 1, pp. 337-412.
[41] : J. K. Tien, B. C. Hendrix, and A. I. Attarwala, "Understanding the cyclic mechanical behavior of lead/tin solder," Trans. ASME, J. Electron. Packag., vol. 113, June 1991.
[42] : S. Verma, A. Dasgupta, and D. Barker, "A Numerical study of fatigue life of J-leaded solder joints using the energy partitioning approach," J. Electron. Packag., vol. 115, pp. 416-423, 1993.
[43] : W. L. Yin, "Thermal stresses and free-edge effects in laminated beams: A variational approach using stress functions," J. Electron. Packag., vol. 113, pp. 68-75, 1991.
[44] : O. C. Zienkiewicz, The Finite Element Method. New York: McGraw Hill, 1986.
[45] : O. C. Zienkiewicz and I. C. Comeau, "Viscoplasticity-plasticity and creep in elastic solids-a unified approach," Int. J. Numer. Meth. Eng., vol. 8, pp. 821-845, 1974.
[46] : A. Zubelewicz, Q. Guo, E. C. Cutiongco, M. E. Fine, and L. M. Keer, "Micromechanical method to predict fatigue life of solder," J. Electron. Packag., vol. 112, 1990.
Cemal Basaran received the M.S. degree from the Massachusetts Institute of Technology, Cambridge,
and the Ph.D. degree from the University of Arizona, Tucson.
He is an Assistant Professor in the Department of Civil, Structural, and Environmental Engineering,
State University of New York, Buffalo. His research interest is in experimental and computational
reliability study of interconnects and interfaces in electronic packaging under combined dynamic and
thermal loading.
Dr. Basaran received the DoD ONR Young Investigator Award for his research on damage mechanics of power electronic packaging interconnects
and interfaces in 1997.
Rumpa Chandaroy received the M.S. degree from the State University of New York, Buffalo, and is
currently pursuing the Ph.D. degree in thermomechanical response of solder joints under concurrent
dynamic and thermal cycling loading at the Department of Civil, Structural, and Environmental
Engineering.
Ms. Chandaroy received the India National Scholarship.
[1] : [SHEET323] H.D. SOLOMON, Low cycle fatigue of 60/40 solder plastic strain limited vs. displacement limited testing, Electron. Packag.: Mater. Processes, pp. 29-47, 1989. [2] : [SHEET324] H.D. SOLOMON, E.D. TOLKSDORF, Energy approach to the fatigue of 60/40 solder: Part II-In uence of hold time and asymmetric loading, J. Electron. Packag., vol. 118, pp. 67-71, 1996. [3] : [LIVRE194] C.A. HARPER, Electronics Packaging and Interconnection Handbook, New York, McGraw-Hill, Inc. 1991, p.210.
Mise à jour le lundi 25 février 2019 à 15 h 36 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.
Copyright 2019 : |
Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.