C.A. HARPER, "Electronics Packaging and Interconnection Handbook", New York, McGraw-Hill, Inc. 1991, p.210.
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Titre : C.A. HARPER, Electronics Packaging and Interconnection Handbook, New York, McGraw-Hill, Inc. 1991, p.210.

Cité dans : [DATA201] Recherche sur l'auteur Charles HARPER.
Cité dans :[SHEET341]
Cité dans :[SHEET144]
Auteur : Charles A. Harper

Lien : SHEET341.HTM - référence [3].
Lien : SHEET144.HTM - référence [18].
Année : 1991
Stockage :
Lien : Harper.jpg - 13 Ko, third edition.
ISBN : 0-07-134745-3
Format : Hardcover, 462 illus., 992p.
Pub_date : February, 2000
Price : $125.00US
Categories : Engineering & Related Disciplines -- Electrical & Electronics Engineering -- Packaging & Fabrication
Publisher : Engineering

Harper.jpg - 13 Ko

DESCRIPTION :
Covering every aspect of electronic packaging fromdevelopment and design
to manufacturing, facilities, andtesting, Electronic Packaging and
Interconnection Handbook,Third Edition, continues to be the standard
reference in itsfield. Here, in this single information-packed resource
are all the data and guidelines you need for all types and levels of
electronic packages, interconnection technologies, and electronic systems.
No other book treats all of the subjects covered in this handbook in such
an integrated and inter-related manner, a treatment designed to help you
achieve a more reliable, more manufacturable, and more cost-effective
electronic package. Here's everything you need to know about materials,
thermal management, mechanical and thermomechanical stress behavior,
wiring and cabling, soldering and solder technology, integrated circuit
packaging, surface mount technologies, rigid and flexible printed wiring
boards. And with over 60% new material, this third edition brings you
thoroughly up to speed on a new generation of packaging technologies:
single chip packaging...ball gridarrays...chip scale packaging...low-cost
flip chip technologies...direct chip attach, and more.

CONTENTS :
Materials for Electronic Packaging.
Thermal Management in Electronic Packaging.
Mechanical and Thermomechanical Stress Behavior in Electronic Packaging.
Connector and Interconnection Technology.
Wiring and Cabling.
Soldering and Solder Technology.
Integrated Circuit Packaging and Ball Grid Arrays.
Surface Mount Technologies.
Hybrid Microelectronic and Multichip Module Packaging.
Chip Scale Packaging and Direct Chip Attach Technologies.
Rigid and Flexible Printed Wiring Boards.
Packaging of High Speed and Microwave Electronic Systems.
Packaging of High Voltage Electronic Systems.


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