S.F. POPELAR, "Parametric study of flip chip reliability based on solder fatigue modelling", 1997.
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Article : [SHEET145]

Info : COMPENDEX Answer Number 21 - 22/02/2000

Titre : S.F. POPELAR, Parametric study of flip chip reliability based on solder fatigue modelling, 1997.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Popelar, Scott F. (Delco Electronics Corp, Kokomo, IN, USA)

Source : Proceedings of the 1997 21st IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium.
Location : Austin, TX, USA
Date : 13 Oct 1997-15 Oct 1997
Info : Organization IEEE, Piscataway, NJ, USA,97CH36068.
Pages : 299 - 307
CODEN : 61UNAI
Meeting_Number : 47387
Document_Type : Conference Article
Treatment_Code : Theoretical
Language : English
Stockage : Thierry LEQUEU

Abstract :
A solder fatigue model for 63Sn/Pb solder has been developed by
combining nonlinear finite element modelling with thermal fatigue
data of assorted flip chip assemblies.The model characterizes the
creep fatigue phenomena of the solder alloy by correlating the
amount of creep strain energy dissipated per thermal cycle with the
characteristic Weibull life of the critical solder joint.It has been
validated for various die sizes, bump geometries, board materials
and thermal profiles.Furthermore, the model has accurately predicted
fatigue lives for flip chip assemblies with and without
underfill.The solder fatigue model has been utilized to investigate
the reliability of flip chip joints subjected to thermal cycling.In
particular, a parametric study had been performed which shows how
various flip chip design parameters will affect solder joint
fatigue.Finite element models have been developed to analyze the
effect of die size, die thickness, solder joint height, cap diameter
and underfill properties on solder fatigue.For this investigation,
all analyses have been carried out for parts on ceramic
substrates.The results for underfilled parts show that while die
size does not influence solder joint reliability, the effects of
underfill CTE are very important. Non-underfilled parts are
significantly influenced by die size, cap size and joint
height.(Author abstract)

References : 5 Refs.

Accession_Number : 1998(4):4277


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