G. MITIC, R. BEINERT, P. KLOFAC, H. J. SCHULTZ, G. LEFRANC, "Reliability of AIN substrates and their solder joints in IGBT power modules", Volume 39, Issues 6-7, June - July 1999, pp. 1159-1164.
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Article : [PAP412]

Titre : G. MITIC, R. BEINERT, P. KLOFAC, H. J. SCHULTZ, G. LEFRANC, Reliability of AIN substrates and their solder joints in IGBT power modules, Volume 39, Issues 6-7, June - July 1999, pp. 1159-1164.

Cité dans :[REVUE172] Elsevier Science, Microelectronics Reliability, Volume 39, Issues 6-7, Pages 721-1170, June - July 1999.
Cité dans : [DATA196] ESREF'99, Proceedings of the 10th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis.
Cité dans :[ART185]
Cité dans :[ART227]
Auteur : G. Mitic (a)
Auteur : R. Beinert (b)
Auteur : P. Klofac (a)
Auteur : H. J. Schultz (a)
Auteur : G. Lefranc (a)

Vers : Bibliographie
Lien : ART185.HTM#Bibliographie - référence [4].
Lien : ART227.HTM#Bibliographie - référence [23].

Lien : private/MITIC.pdf - 6 pages, 516 Ko.
Adresse : (a) Siemens AG, Corporate Technology 81730 Munich Germany
Adresse : (b) eupec GmbH u. Co KG 59568 Warstein Germany
Source : Microelectronics Reliability
Volume : 39
Issues : 6-7
Date : June-July 1999
Pages : 1159 - 1164
DOI :
PII : S0026-2714(99)00165-1
Switches : IGBT modules
Puissance :
Logiciel :
Stockage :

Abstract :
The reliability of IGBT modules was investigated with respect to the metallized
ceramic (substrate) and the solder layer between the substrate and copper
baseplate. Thermal cycles were performed between -55°C and +150°C on substrates
based on different technologies and from various manufacturers. An incipient
delamination of the metallization could be predicted from the mechanical
resonance frequency. The warping of the substrates after cycling due to crack
propagation and the adhesion of the metallization were determined. Thermal and
active-power cycles were performed on 1200 A / 3.3 kV IGBT power modules to
investigate the reliability of the solder joint between substrate and baseplate.


Bibliographie

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Références : 10
[1] : K. H. SOMMER et al, "Multi-chip high-power IGBT modules for traction and industrial application", Proc. EPE' 97.
[2] : J. Göttert et al.: "Insulation voltage test and partial discharge test of 3.3 kV IGBT modules", Proc. PCIM 97, pp. 119, 1997
[3] : Int. Elect. Commission: "Electronic power converters", IEC 1287
[4] : P. Cova, F. Fantini, "On the effect of power cycling stress on IGBT modules", Microelectronics Reliability 38, pp. 1319-1323, 1998
[5] : H. Berg, E. Wolfgang: "Advanced IGBT modules for railway traction applications: Reliability testing" Microelectronics Reliability 38, pp. 1319-1323, 1998
[6] : N. Iwase et al.: "Thick film and direct-bond copper forming technologies", IEEE Trans. CHMT -8, pp. 253, 1985
[7] : J. Schulz-Harder et al.: ("Einsatz von direkt beschichteten Kupfer-Keramik Substraten"), Proc. ISHM, Munich, 1995
[8] : N. Anderson et al.: "Brazing of Aluniniun Nitride", The Int. J. for Hybrid Microelectronics 14, pp. 4, 1991
[9] : E. Leigscheider et al.: "Joining of non- metallized ceramic with metals", Proc. ceramic, glass and metals, Bad Nauheim, 1985
[10] : G. Mitic, K.-H. Sommer, D. Dieci, G. Lefranc, "The thermal impedance of new power semiconductor modules using AIN subtrates", IEEE-IAS, Industry Applications Conference, pp. 1026-1030, 1998.
  [1] :  [ART221]  K. SOMMER, J. GOTTERT, G. LEFRANC, R. SPANKE, Multi-chip high-power IGBT modules for traction and industrial application, Proc. EPE' 97, Trondheim, Norway, September 22-24, pp. 512-515.
  [2] :  [PAP158]  -------
  [3] :  [PAP158]  -------
  [4] :  [PAP404]  P. COVA, F. FANTINI, On the effect of power cycling stress on IGBT modules, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1347-1352.
  [5] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [6] :  [PAP158]  -------
  [7] :  [PAP158]  -------
  [8] :  [PAP158]  -------
  [9] :  [PAP158]  -------


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