G. COQUERY, S. CARUBELLI, J.P. OUSTEN, R. LALLEMAND, F. LECOQ, D. LHOTELLIER, V. DE VIRY, PH. DUPUY, "Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter", ESREF'2001, pp. 1695-1700
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Article : [PAP372]

Titre : G. COQUERY, S. CARUBELLI, J.P. OUSTEN, R. LALLEMAND, F. LECOQ, D. LHOTELLIER, V. DE VIRY, PH. DUPUY, Power module lifetime estimation from chip temperature direct measurement in an automotive traction inverter, ESREF'2001, pp. 1695-1700

Cité dans : [DATA227] ESREF'2001, 12th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis, Arcachon, France , 1-5 octobre 2001.
Cité dans : [DATA146] LTN, Laboratoire des Technologies Nouvelles, INRETS, Arcueil, France.
Cité dans : [DATA484] M. PLOTON, D. BEJRACH, Bornes de mesure de temps et de vitesse pour l’épreuve de kart électrique de 50 mètres départ arrêté, projet Licence EE-EAM, IUT GEII Tours, février 2013.
Auteur : G. Coquery (1)
Auteur : S. Carubelli (1)
Auteur : J.P. Ousten(1)
Auteur : R. Lallemand (1)
Auteur : F. Lecoq (2)
Auteur : D. Lhotellier (1)
Auteur : V. de Viry (2)
Auteur : Ph. Dupuy (2)

Adresse : (1) INRETS - (2) Renault -France
Source : ESREF'2001 - 12th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis - Arcachon - France.
Date : 1-5 octobre 2001
Site : http://www.elsevier.com/locate/microrel
Pages : 1695 - 1700
Lien : private/COQUERY2.pdf - 6 pages, 100 Ko.

Abstract :
Based on investigations conducted on a Renault Kangoo Electric vehicle, this article is a contribution to
increase our knowledge's on thermal constraints applied to hybrid vehicles traction system, in view of IGBT
power modules lifetime estimation . This paper describes on one hand the tests and the methodology used for
direct measurement of chip temperature on an automotive traction inverter working in urban and suburban
mission and on the other hand the power cycling tests (PCT) realised at INRETS laboratory. A correlation
between these two tests will be discussed in the last part in order to determine the impact of active power cycling
on vehicle lifetime.


Bibliographie

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Références : 8
[1] : Coquery G., Lallemand R, "Failure criteria for long term Accelerated Power Cycling Test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A-3300V module with AlSiC base plate", ESREF 2000, Reliability of Power Devices, 11th, October 2000, Dresden.
[2] : Chave.J, Kayal.A.H, Lisowski.L, Theurillat.P, "Power Electronic’s Reliability in Electric Vehicles : Simulations and Tests according to Road Profiles." EVS 17, September 2000, Montréal.
[3] : Hamidi.A., Coquery.G., "Contact temperature measurements on chip surface for reliability investigations of high power IGBT modules in traction applications". 3rd European Conference on Interconnection Technology in Electronics, Eupac’98. Nurember. Juin 1998.
[4] : Ramminger S., Seliger N., Wachutka G., "Reliability Model for Al Wire Bonds subjected to Heel Crack Failures", ESREF 2000 11th, October 2000, Dresden.
[5] : Sommer.K, Göttert.J, Lefranc.G, Spanke.R. Multichip high power IGBT-Modules for traction and industrial application, Proc. of EPE Conf, Trondheim, September 1997.
[6] : Coquery G., Lallemand R., Berg H., Sommer K., Wagner D., Piton M., "Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules", 8th European Conference on Power Electronics, EPE'99, Lausanne, September 1999.
[7] : Franke.T, Honsberg-Riedl.M, Simon.P, Otto.J, Ramminger.S, Soelkner.G, Wolfgang.E, "On chip reliability investigation on power modules actually working in inverter systems", ESREF 98, Reliability of Power Devices, Copenhague, October 1998.
[8] : Manson S.S. "Thermal stress and low-cycle fatigue" , Krieger, Florida, 1981
  [1] : [SHEET516] G. COQUERY, R. LALLEMAND, Failure criteria for long term Accelerated Power Cycling Test linked to electrical turn off SOA on IGBT module. A 4000 hours test on 1200A-3300V module with AlSiC base plate, ESREF'2000, pp. 1665-1670.
  [2] :  [PAP158]  -------
  [3] : [SHEET360] A. HAMIDI, G. COQUERY, Contact temperature measurements on chip  surface for reliability investigations of high power IGBT modules in traction applications, 3rd Europ. Conf. On Electronic Packaging Technology, EUPAC'98, Nuremberg, juin 1998, 9 pages.
  [4] : [SHEET465] S. RAMMINGER, N. SELIGER, G. WACHUTKA, Reliability Model for Al Wire Bonds subjected to Heel Crack Failures, ESREF'2000, pp. 1521-1526.
  [5] :  [PAP158]  -------
  [6] : [SHEET119] G. COQUERY, R. LALLEMAND, D. WAGNER, M. PITON, H. BERG, K. SOMMER, Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules, EPE'99, paper 904, 1999.
  [7] :  [PAP405]  T. FRANKE, M. HONSBERG-RIEDL, P. SIMON, J. OTTO, S. RAMMINGER, G. SOELKNER, E. WOLFGANG, On-Chip Reliability Investigations on Power Modules Actually Working in Inverter Systems, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1361
  [8] :  [PAP377]  S.S. MANSON, Thermal stress and low-cycle fatigue, Krieger, Florida, 1981


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