E S R E F '04

Welcome
Location
Program Booklet
Final Program Oral Sessions
Final Program Poster Sessions
Submission of Presentation Files
Schedule
Registration
General Information
Exhibitor List
Equipment Exhibition
Local Organisation Committee
Techn. Committee & Sub Committees
Steering Committee
Workshop and Tutorials
Hotel Booking
Networking Event



T E C H N I C A L    C O M M I T T E E    A N D    S U B    C O M M I T T E E



Chairman


Mauro CiappaETH Zurich CH


Sub-Com Circuits, Systems, and Assembly Reliability


Marcantonio CatelaniUni Firenze I
Yves DantoUni Bordeaux F
Ward De CeuninckUni Limburgs B
Fausto FantiniUni Modena I
Jorgen MoltoftTU Denmark DK
Andreas PreussgerInfineon D
Robert ThomasExperts Network USA
Consolato VersaceSTMicroelectronics I
Paolo CovaUni Parma I
Christian ZardiniUni Bordeaux F


Sub-Com ESD & Latch up


Antonio AndreiniSTM I
Marise BafleurLASS F
Gianluca BoselliTexas Instruments USA
Horst GieserFhG D
Ton MouthaanUni Twente NL
Wolfgang StadlerInfineon D
Matthias StecherInfineon D
Wolfgang WilkeningBosch D
Lucia ZullinoSTMicroelectronics I


Reliability Dielectrics & Hot Carriers


Xavier AymerichUni Barcelona E
Francis BalestraENSERG F
Gerard GhibaudoENSERG F
Gabriella GhidiniSTMicroelectronics I
Guido GroeseneckenIMEC B
Giuseppe La RosaIBM USA
Hans ReisingerInfineon D
James StathisIBM USA
Nino StojadinovicUni Nis Y


Sub-Com Interconnects Reliability


Barbara ZanderighiSTMicroelectronics I
Andrea ScorzoniUni Perugia I
Fausto FantiniUni Modena I


Sub-Com TCAD for Reliability


Lars BomholtISE CH
Herve JaouenSTMicroelectronics F
Gerhard WachutkaTU Munich D


Sub-Com Power Devices Reliability


Giovanni BusattoUni Cassino I
Gérard CoqueryINRETS F
Leonardo LonziSTMicroelectronics I
Eckhardt WolfgangSiemens D
Wolfgang WondrakDaimler-Chrysler D
Raymond ZehringerABB CH


Sub-Com Photonics & Compound Materials Reliability


Jean-Michel DumasUni Limoges F
Mattia BorgarinoUni Modena I
Hans HartnagelTU Darmstadt D
Nathalie LabatUni Bordeaux F
Roberto MenozziUni Parma I
Giulia SalminiPirelli I
Bernd WitzigmannETH CH
Enrico ZanoniUni Padova I


Sub-Com Failure Analysis Techniques


Christian BoitTU Berlin D
Jean-Pierre ForteaCNES F
Siegfried GoerlichInfineon D
Philippe PerduCNES F
Alan StreetQualcomm USA
Massimo VanziUni Cagliari I


Sub-Com EOBT


Peter de WolfVeeco USA
Dionysz PoganyTU Vienna A
Ludwig BalkUni Wuppertal D
Ronald CramerAltis F
Wolfgang MertinUni Duisburg-Essen D
Jacob PhangNat. Uni Singapore


Sub-Com MEMs & Nanotechnology Reliability


Ingrid de WolfIMEC B
Wilfrid ClaeysUni Bordeaux F
Nico de RoojiUni Neuchatel CH




06 Nov 2003 webmaster esref'04