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Chairman
| Mauro Ciappa | ETH Zurich CH |
Sub-Com Circuits, Systems, and Assembly Reliability
| Marcantonio Catelani | Uni Firenze I |
| Yves Danto | Uni Bordeaux F |
| Ward De Ceuninck | Uni Limburgs B |
| Fausto Fantini | Uni Modena I |
| Jorgen Moltoft | TU Denmark DK |
| Andreas Preussger | Infineon D |
| Robert Thomas | Experts Network USA |
| Consolato Versace | STMicroelectronics I |
| Paolo Cova | Uni Parma I |
| Christian Zardini | Uni Bordeaux F |
Sub-Com ESD & Latch up
| Antonio Andreini | STM I |
| Marise Bafleur | LASS F |
| Gianluca Boselli | Texas Instruments USA |
| Horst Gieser | FhG D |
| Ton Mouthaan | Uni Twente NL |
| Wolfgang Stadler | Infineon D |
| Matthias Stecher | Infineon D |
| Wolfgang Wilkening | Bosch D |
| Lucia Zullino | STMicroelectronics I |
Reliability Dielectrics & Hot Carriers
| Xavier Aymerich | Uni Barcelona E |
| Francis Balestra | ENSERG F |
| Gerard Ghibaudo | ENSERG F |
| Gabriella Ghidini | STMicroelectronics I |
| Guido Groesenecken | IMEC B |
| Giuseppe La Rosa | IBM USA |
| Hans Reisinger | Infineon D |
| James Stathis | IBM USA |
| Nino Stojadinovic | Uni Nis Y |
Sub-Com Interconnects Reliability
| Barbara Zanderighi | STMicroelectronics I |
| Andrea Scorzoni | Uni Perugia I |
| Fausto Fantini | Uni Modena I |
Sub-Com TCAD for Reliability
| Lars Bomholt | ISE CH |
| Herve Jaouen | STMicroelectronics F |
| Gerhard Wachutka | TU Munich D |
Sub-Com Power Devices Reliability
| Giovanni Busatto | Uni Cassino I |
| Gérard Coquery | INRETS F |
| Leonardo Lonzi | STMicroelectronics I |
| Eckhardt Wolfgang | Siemens D |
| Wolfgang Wondrak | Daimler-Chrysler D |
| Raymond Zehringer | ABB CH |
Sub-Com Photonics & Compound Materials Reliability
| Jean-Michel Dumas | Uni Limoges F |
| Mattia Borgarino | Uni Modena I |
| Hans Hartnagel | TU Darmstadt D |
| Nathalie Labat | Uni Bordeaux F |
| Roberto Menozzi | Uni Parma I |
| Giulia Salmini | Pirelli I |
| Bernd Witzigmann | ETH CH |
| Enrico Zanoni | Uni Padova I |
Sub-Com Failure Analysis Techniques
| Christian Boit | TU Berlin D |
| Jean-Pierre Fortea | CNES F |
| Siegfried Goerlich | Infineon D |
| Philippe Perdu | CNES F |
| Alan Street | Qualcomm USA |
| Massimo Vanzi | Uni Cagliari I |
Sub-Com EOBT
| Peter de Wolf | Veeco USA |
| Dionysz Pogany | TU Vienna A |
| Ludwig Balk | Uni Wuppertal D |
| Ronald Cramer | Altis F |
| Wolfgang Mertin | Uni Duisburg-Essen D |
| Jacob Phang | Nat. Uni Singapore |
Sub-Com MEMs & Nanotechnology Reliability
| Ingrid de Wolf | IMEC B |
| Wilfrid Claeys | Uni Bordeaux F |
| Nico de Rooji | Uni Neuchatel CH |
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