ESREF'98, "Proceedings of the 9th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis", 5-9 October 1998.

ESREF'98, "Proceedings of the 9th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis", 5-9 October 1998. Copyright - [Précédente] [Première page] [Suivante] - Home

Fiche : [DATA233]

Titre : ESREF'98, Proceedings of the 9th European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis, 5-9 October 1998.

Cité dans : [CONF016] ESREF, European Symposium on Reliability of Electron Devices, Failure Physics and Analysis et Microelectronics and Reliability, décembre 2005.
Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.
Cité dans :[REVUE253] Elsevier Science, Microelectronics Reliability, Volume 38, Issues 6-8, Pages 851-1366, 8 June 1998.

Congrés : 9th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
Lieu : Copenhagen, Denmark
Date : 5-9 October 1998
Site : http://www.iae.dtu.dk/esref98/
Lien : ESREF/1998/esref98.htm
Lien : ESREF/1998/call98.htm - Call for paper.
Lien : ESREF/1998/esref98.pdf - Final programme.

Liste des articles

  [1] :  [PAP396]  K. CROES, J. V. MANCA, W. DE CEUNINCK, L. DE SCHEPPER, G. MOLENBERGHS, The time of guessing your failure time distribution is over!, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1187-1191.
  [2] :  [PAP397]  C. Pellet, M. Lecouvé, H. Frémont, A. Val and D. Estève, Analysis of thermomechanical stresses in a 3D packaged micro electro mechanical system, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1261-1264.
  [3] :  [PAP398]  S. Dilhaire, A. Cornet, E. Schaub, C. Rauzan and W. Claeys, Measurement of the thermomechanical behaviour of the solder-lead interface in solder joints by laser probing : a new method for measuring the bond quality, Microelectronics Reliability, Volume
  [4] :  [PAP399]  P. Jansson, Experimental design and evaluation of interconnection materials for improvement of joint reliability at power transistors, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1297-1300.
  [5] :  [PAP400]  S. RAMMINGER, P. TURKES, G. WACHUTKA, Crack Mechanism in Wire Bonding Joints, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1301-1305.
  [6] :  [PAP401]  H. BERG, E. WOLFGANG, Advanced IGBT modules for railway traction applications: Reliability testing, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1319-1323.
  [7] : [SHEET245] S. JANUSZEWSKI, M. KOCISZEWSKA-SZCZERBIK, H. SWIATEK, Some observation dealing with the failures of IGBT transistors in high power converters, Microelectronics and Reliability, vol. 38, no. 6-8, Jun-Aug 1998, pp. 1325-1330.
  [8] :  [PAP402]  L. Galateanu, M. G. Stoica and E. Popa, Strain depending reliability of automotive diodes, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1331-1334.
  [9] :  [PAP403]  K. NASSIM, L. JOANNES, A. CORNET, S. DILHAIRE, E. SCHAUB, W. CLAEYS, Thermomechanical deformation imaging of power devices by Electronic Speckle Pattern Interferometry (ESPI), Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1341-13
 [10] :  [PAP404]  P. COVA, F. FANTINI, On the effect of power cycling stress on IGBT modules, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1347-1352.
 [11] : [SHEET120] A. HAMIDI, G. COQUERY, R. LALLEMAND, P. VALES, J.M. DORKEL, Temperature measurements and thermal modeling of high power IGBT multichip modules for reliability investigations in traction applications, ESREF'98, Reliability of Power Devices, Copenhague, 9
 [12] :  [PAP405]  T. FRANKE, M. HONSBERG-RIEDL, P. SIMON, J. OTTO, S. RAMMINGER, G. SOELKNER, E. WOLFGANG, On-Chip Reliability Investigations on Power Modules Actually Working in Inverter Systems, Microelectronics Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1361
 [13] :  [PAP463]  J. B. Nysaether, A. Larsenb, B. Liverodb, P. Ohlckersa, Structures for piezoresistive measurement of package induced stress in transfer molded silicon pressure sensors, Microelectronics and Reliability, Volume 38, Issues 6-8, 8 June 1998, pp. 1271-1276.

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