The 9th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis will take place in Copenhagen, Denmark, from 5 to 9 October 1998.
This event will provide the European forum for the
presentation of recent developments and future trends in Quality and Reliability
of Microelectronic Material, Devices and Circuits.
All aspects of specifications, technology and manufacturing
advances, test, control and analysis will be addressed.
It is a pleasure, for the second time, to have the EOBT Conference, Electron and Optical Beam Testing, as part of the ESREF Conference. The enhancement that this collaboration brings to the ESREF sessions on these vital topics is truly significant.
Conference location
Scandic Hotel Copenhagen
Copenhagen
Denmark
Whilst the quality of the technical programme of course has priority at the Conference, we hope that you will find some time also to enjoy and explore the historic capital city of Denmark. Today Copenhagen is easily accessible with the airport only a fifteen minutes drive from the centre of the town, and excellent train services with most major European cities. The central station is just five minutes walk from the Conference venue.
We wish to thank the following for their contribution to the success of this conference:
- The Technical University of
Denmark
- United States Air
Force European Office of Aerospace Research and Development
- IEEE, Electron Devices Society
Conference Organization and Secretariat
Van Hauen Conferences and Incentives
Amaliegade 36
DK - 1256 Copenhagen
K.
Denmark
Tel.
+45 3314 0050
Fax. +45 3314 5750
e-mail: svh@vanhauen.dk,
internet:
http://www.vanhauen.dk
Also, as separate events, but an integral part of the Conference, several workshops or User Group meetings will be organized on the Monday of the Conference week. The topics range from COTS (Components off the Shelf), FIB (Focussed Ion Beam), ESD (Electrostatic Discharge) to Power Device Reliability.
Defect detection and
localization, ion techniques e.g. FIB, optical techniques, thermal
and electrical characterization
e.g. noise, acoustic microscopy.
Electron beam testing, optical
beam testing, scanning probe microscopy, electric force
microscopy, navigation methods, thermal
microscopy.
Metal migration, corrosion,
dielectric breakdown, hot carrier degradation, EOS and
ESD, latch-up, EMC and EMI effects, soft
errors.
Reliability by design,
robustness testing, proactive process control, wafer level
reliability monitors, reliability
indicators, built-in self test, burn-in and screening, field
failure returns, yield and reliability,
case studies.
Laser reliability,
optoelectronic devices, LED reliability, microwave components,
degradation mechanisms, specific failure
mechanisms.
MEMS, sensor reliability,
failure mechanisms, test approaches, case studies,
microwave connectors, optical fibre
transmission lines.
Bonding, multichip module
reliability, plastic packaging, solder joint reliability, flip
chip reliability, ball grid arrays,
socket and connector reliability.
Failure mechanisms, reliability
indicators, thermal management, bond reliability,
solder joint reliability, smart power
devices, IGBT multichip
modules, thyristors.
The deadline for submission of abstracts is 15 March 1998. One original and 15 copies should be mailed to the Scientific Secretariat. These abstracts must be written in English and should treat topics related to one of the eight themes of the Conference. Abstracts should contain the following information:
1. Title page containing:
reference
to the number of the theme to which the abstract fits best
title and
five-line abstract
the
complete address of the first author, including e-mail, phone and fax
number
if
applicable, explicit indication of category: Student Paper
2. Two-page abstract providing all relevant
information including major results, figures
and conclusions.
Claus Kjærgaard
IAE/DTU
Building 451
DK - 2800 Lyngby
Denmark
Tel.: +45 4525 5266, Fax.
+45 4588 0286
e-mail: ck@iae.dtu.dk
Internet: http://www.iae.dtu.dk/esref98
After the paper selection, authors will receive instructions for the layout of papers, transparencies and slides. Accepted papers will be published in the Conference Proceedings, which will be distributed to all participants at the beginning of the conference.
The proceedings will also be published as a special
edition of Microelectronics and Reliability by Elsevier Science.
Please use block
capitals
Date:
Ms/Mr/Dr. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Name . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Affiliation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Street/P.O. Box . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Postal code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
City . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Country . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fax . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
e-mail address . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
[
] I plan to attend the conference
[ ] I
will submit an abstract to ESREF 98 before 15 March
[ ]
Please send final progamme and registration form when available
Tentative title of paper:
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Send this call for papers also to: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Address: . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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