X. MA, Y. QIAN, X. ZHANG, "The Concept of Relative Damage Stress and its Application to Electronic Packaging Solder Joint Reliability", IRPS'2001, pp. 128-131.
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Titre : X. MA, Y. QIAN, X. ZHANG, The Concept of Relative Damage Stress and its Application to Electronic Packaging Solder Joint Reliability, IRPS'2001, pp. 128-131.

Cité dans : [DIV214]  IRPS'2001, 2001 IEEE International Reliability Physics Symposium, 30 avril - 3 mai 2001, Orlando, Floride.
Auteur : Xin Ma - (1) & (2)
Auteur : Yiyu Qian - (2)
Auteur : Xiaoming Zhang - (1)

(1) : Research and Analysis Center, CEPREI, P.O.Box 1501-05, Guangzhou 510610, P.R.China
Phone : +86-20-87236621
Fax : +86-20-87237185
Lien : mailto:maxin0144@sina.com
(2) : National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, P.R.China

Source : IRPS'2001
Date : 30 avril - 3 mai 2001
Stockage : Thierry LEQUEU & Bibliothèque LMP.
Pages : 128 - 131
Lien : private/MA-QUIAN.pdf - 1814 Ko, 4 pages.

A new mechanical concept, relative damage stress, which can mechanically reflect the failure mechanism of solder joints used in electronic packaging in full-scale, has been proposed. Based upon the new mechanical concept, the thermal fatigue life data of surface mount solder joints have been reasonably analyzed, something that traditional mechanical concepts, such as Mises equivalent stress, can not do. Some suggestions have been provided for the design of accelerated thermal fatigue tests of PCD-level electronic assembly.

Keywords : solder joints, damage stress, reliability evaluation



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