X. MA, Y. QIAN, X. ZHANG, "The Concept of Relative Damage Stress and its Application to Electronic Packaging Solder Joint Reliability", IRPS'2001, pp. 128-131.
Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [PAP255]

Titre : X. MA, Y. QIAN, X. ZHANG, The Concept of Relative Damage Stress and its Application to Electronic Packaging Solder Joint Reliability, IRPS'2001, pp. 128-131.

Cité dans : [DIV214]  IRPS'2001, 2001 IEEE International Reliability Physics Symposium, 30 avril - 3 mai 2001, Orlando, Floride.
Auteur : Xin Ma - (1) & (2)
Auteur : Yiyu Qian - (2)
Auteur : Xiaoming Zhang - (1)

(1) : Research and Analysis Center, CEPREI, P.O.Box 1501-05, Guangzhou 510610, P.R.China
Phone : +86-20-87236621
Fax : +86-20-87237185
Lien : mailto:maxin0144@sina.com
(2) : National Key Laboratory of Welding, Harbin Institute of Technology, Harbin 150001, P.R.China

Source : IRPS'2001
Date : 30 avril - 3 mai 2001
Stockage : Thierry LEQUEU & Bibliothèque LMP.
Pages : 128 - 131
Lien : private/MA-QUIAN.pdf - 1814 Ko, 4 pages.

ABSTRACT :
A new mechanical concept, relative damage stress, which can mechanically reflect the failure mechanism of solder joints used in electronic packaging in full-scale, has been proposed. Based upon the new mechanical concept, the thermal fatigue life data of surface mount solder joints have been reasonably analyzed, something that traditional mechanical concepts, such as Mises equivalent stress, can not do. Some suggestions have been provided for the design of accelerated thermal fatigue tests of PCD-level electronic assembly.

Keywords : solder joints, damage stress, reliability evaluation


Bibliographie

TOP

Références : 21
[1] : J.H. Lau eds., Solder Joint Reliability: Theory and Application. New York: Von Nostrand Reinhold, 1992.
[2] : J. Mackerle, "Finite element analysis and simulation of adhesive bonding, soldering and brazing: a bibliography (1976-1996)," Modelling Simul. Mater. Sci. Eng., vol. 5, pp. 159-185, 1997.
[3] : S.M. Lee and K.W. Lee, "Thermal fatigue life prediction of gull-wing solder joints in plastic thin small outline packages,;' Jpn. J. Appl. Phys., vol. 35, pp. L1515-1517, 1996.
[4] : S. Ling and A. Dasgupta, "A non linear multi-domain stress analysis method for surface mount solder joints," ASME Journal of Electronic Packaging, vol. 118, pp. 72-79, 1996.
[5] : W. Jung, J.H. Lau and Y.-H. Pao, "Non linear analysis of full matrix and perimeter plastic ball grid array solder joints," ASME Journal of Electronic Packaging, vol. 1 19, pp. 163-169, 1997.
[6] : B.Z. Hong and L.G. Burrell, "Modeling thermally induced viscoplastic deformation and low cycle fatigue of CBCJA solder joints in a surface mount package," IEEE Trans. CPMT Part A, vol. 20,pp. 280-285, 1997.
[7] : Q. Yu and M. Shiratori, "Fatigue-strength prediction of micro electronics solder joints under thermal cyclic loading," IEEE Trans. CPMT Part A, vol. 20, pp. 266-273, 1997.
[8] : J.H. Lau and C.G. Harkins, "Thermal-stress analysis of SOIC packages and interconnections,;' IEEE Trans. CIIMT, vol. 11, pp. 380-389, 1988.
[9] : W.A. Logsdon, P.K. Liaw and M.A. Burke, "Fracture behavior of 63Sn-37Pb solder," Engng. Fracture Mech., vol. 36, pp. 183-218, 1990.
[1O] : A.F. Skipor, S.V. Harren and J. Botsis, "The effect of mechanical constraint on the flow and fracture of 63/37 Sn/Pb eutectic alloy," Engng. Fracture Mech., vol. 41, pp. 647-669, 1995.
[ll] :X.Ma, Y. Qian and F. Yoshida, "Void damage at Sn-Pb alloy/ intermetallic compounds interface of solder joints," in Proceedings of International Brazing and Soldering Conference, pp.568-574, 2000.
[12] : M.F. Ashby, F.J. Blunt and M. Bannister, "Flow characteristics of highly constrained metal wires," Acta Metall., vol. 37, pp. 1847-1857, 1989.
[13] : J. Lemaitre, A Course on Damage Mechanics. New York: Springer-Verlag, 1996.
[14] : A.G. Varias, Z. Guo and C.F. Shih, "Ductile failure of a constrained metal foil," Journal of Mechanics and Physics of Solids, vol. 39, pp. 963-986, 1991.
[15] : Huang, K.X. Hu, C.P. Yeh, N.-Y. Li and K.C. Hwang, "A model study of thermal stress-induced voiding in electronic packaging," ASME Journal of Electronic Packaging, vol. 1 18, pp. 229-234, 1996.
[16] : B.Z. Hong and L.G. Burrell, "Non linear finite element simulation of thermoviscoplastic deformation of C4 solder joints in high density packaging under thermal cycling,;' IEEE Trans. CPMT Part A, vol. 18, pp. 585-591, 1995.
[17] : X. Ma, E Yoshida and Y Qian, "Finite element analysis of temperature history effect on the stress field characteristic in the surface mount solder joints under temperature cycling," in Proceedings of Intemational Brazing and Soldering Conference, pp.427-434,2000.
[19] : P.K. Bhatti, K. Gschwend, A.Y. Kwang and A.R. Syed, "Three dimensional creep analysis of solder joints in surface mount devices," ASME Journal of Electronic Packaging, vol. 117, pp. 202-5, 1995.
[20] : T.E. Wong, L.A. Kachatorian and D.D. Tierney, "Gull-wing solder joint fatigue life sensitivity evaluation," ASME Journal of Electronic Packaging, vol. 119, pp. 171-176, 1997.
[21] : T.Y. Pan, "Critical accumulated strain energy (Case) failure criterion for thermal cycling fatigue of solder joints," ASME Journal of Electronic Packaging, vol. 1 16, pp. 163-170, 1994.


Mise à jour le lundi 10 avril 2023 à 18 h 54 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2023 : TOP

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.