M. OHRING, "Engineering Materials Science", A Publication of Academic Press U.S.A., November 1995.
Copyright - [Précédente] [Première page] [Suivante] - Home

Fiche : [LIVRE119]

Titre : M. OHRING, Engineering Materials Science, A Publication of Academic Press U.S.A., November 1995.

Auteur : Milton Ohring, Stevens Institute of Technology, Hoboken, New Jersey .

Affiliation : Stevens Institute of Technology, Hoboken, New Jersey

Published : November 1995
Lien : ohring2.gif - 180x194, 17 Ko.
ISBN : 0125249950

Cité dans :[LIVRE061] M. OHRING, Reliability and failure of Electronic Materials and Devices, Academic Press, may 1998.
Cité dans :[LIVRE120] M. OHRING, The Materials Science of Thin Films, A Publication of Academic Press U.S.A., december 1991.
Info : Academic Press : http://www.apnet.com ou http://www.apcatalog.com

Praise_for_the_book :

"....I spent 25 years with Westinghouse research and find your coverages of the electronics areas to be superior to most
Material Science texts and very realistic." --Doug Mattox, University of Missouri-Rolla

GENERAL_DESCRIPTION :

Milton Ohring's Engineering Materials Science integrates the scientific nature and modern applications of all classes of
engineering materials. This comprehensive, introductory textbook will provide undergraduate engineering students with the
fundamental background needed to understand the science of structure property relationships, as well as address the
engineering concerns of materials selection in design, processing materials into useful products, and how material degrade
and fail in service. Specific topics include: physical and electronic structure; thermodynamics and kinetics; processing;
mechanical, electrical, magnetic, and optical properties; degradation; and failure and reliability.
The book offers superior coverage of electrical, optical, and magnetic materials than competing text. The author has taught
introductory courses in material science and engineering both in academia and industry (AT&T Bell Laboratories) and has
also written the well-received book, The Material Science of Thin Films (Academic Press).

Key_Features :
Provides a modern treatment of materials exposing the interrelated themes of structure, properties, processing,
and performance.
Includes an interactive, computationally oriented, computer disk containing nine modules dealing with structure, phase
diagrams, diffusion, and mechanical and electronic properties.
Fundamentals are stressed.
Of particular interest to students, researchers, and professionals in the field of electronic engineering.

CONTENTS :
Introduction to Materials Science and Engineering: Materials Resources and Their Implications.
Materials and Engineering.
Engineering Materials and Selected Applications.
Electrons in Atoms and Solids: Bonding: Atomic Electrons in Single Atoms.
Fingerprinting Atoms.
Electrons in Molecules and Solids.
Bonding in Solids.
Structure of Solids: Introduction to Crystal Structure.
Common Crystal Structures.
Atom Positions, Directions, and Planes in Crystal Structures.
Experimental Evidence for Crystal Structure.
Defects in Crystalline Solids.
Structural Morphologies and How They Are Revealed.
Polymers, Glasses, Ceramics, and Nonmetallic Mixtures: Introduction to Polymers.
Polymer Chemistry and Structure.
Polymer Morphology.
Inorganic Glasses.
Ceramics: An Introduction.
Structure of Ceramics.
Cement and Concrete.
Thermodynamics of Solids: Chemical Reactions.
Single-Component Systems.
Introduction to Binary Phase Diagrams.
Additional Phase Diagrams.
Structure and Composition of Phases.
Thermodynamics of Surfaces and Interfaces.
Thermodynamics of Point Defects.
Kinetics of Mass Transport and Phase Transformations: Macroscopic Diffusion Phenomena.
Atom Movements and Diffusion.
Nucleation.
Kinetics of Phase Transformations.
Generalized Solid-State Kinetics.
Mechanical Behavior of Solids: Elastic Behavior.
Plastic Deformation of Metals.
Role of Dislocations.
Mechanical Behavior of Polymers.
Mechanical Behavior of Ceramics and Glasses.
Mechanical Testing of Materials.
Materials Processing and Forming Operations: Solidification Processing of Metals.
Mechanical Forming Operations.
Powder Metallurgy.
Polymer Processing.
Forming Glass.
Processing of Ceramics.
How Engineering Materials are Strengthened and Toughened: Heat Treatment of Steel.
Ferrous and Nonferrous Alloys: Properties and Applications.
Mechanical Working and Recrystallization.
Strengthening Nonferrous Metals.
Modeling Composite Properties.
Engineering Composites.
Ceramics and How to Strengthen and Toughen Them.
Degradation and Failure of Structural Materials: Corrosion.
Gaseous Oxidation.
Wear.
Fracture of Engineering Materials.
Elevated Temperature Creep Degradation and Failure.
Fatigue.
Fracture Case History.
Electrical Properties of Metals, Insulators, and Dielectrics: Electrons in Metals.
Electron Scattering and Resistivity of Metals.
Thermal Conductivity of Materials.
Superconductivity.
Conduction Behavior in Insulating Solids.
Dielectric Phenomena.
Dielectric Materials and Applications.
Semiconductor Materials and Devices: Science and Technology: Carriers and Conduction in Homogenous Semiconductors.
Phenomena at Semiconductor Junctions.
Diodes and Transistors.
Materials Issues in Processing Semiconductor Devices.
Fabrication of Integrated Circuit Transistors.
Optical Properties of Materials: Interaction of Light with Solids.
Applications of the Optical Properties of Metals and Dielectrics.
Electro-optical Phenomena and Devices.
Lasers.
Optical Communications.
Miscellaneous Optical Properties and Effects.
Magnetic Properties of Materials: Macroscopic Interaction between Magnetic Fields and Materials.
Atomic Basis of Magnetism. The Magnetization Process: Magnetic Domains.
Ferromagnetic Materials and Applications.
Failure and Reliability of Electronic Materials and Devices: Reliability in Electronics: Past, Present, and Future.
Mathematics of Failure and Reliability.
Failure Mechanisms.
Specific Examples of Failure Mechanisms.
Appendices.
Index.

CONTENTS : Chapter Headings
Introduction to Materials Science and Engineering.
Electrons in Atoms and Solids: Bonding.
Structure of Solids.
Polymers, Glasses, Ceramics, and Non-Metallic Mixtures.
Thermodynamics of Solids.
Kinetics of Mass Transport and Phase Transformations.
Mechanical Behavior of Solids.
Materials Processing and Forming Operations.
Engineering Materials; How They Are Strengthened and Toughened.
Degradation and Failure of Structural Materials.
Electrical Properties of Metals, Insulators, and Dielectrics.
Semiconductor Materials and Devices: Science and Technology.
Optical Properties of Materials.
Magnetic Properties of Materials.
Failure and Reliability of Electronic Materials and Devices.
Appendices.
Index.


Mise à jour le lundi 25 février 2019 à 15 h 33 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2019 : TOP

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.