ISTFA's Past

Proceedings

In 2001, the International Symposium for Testing and Failure Analysis celebrated its 27th anniversary. The proceedings have been an important addition to many libraries over the years. Proceedings are still available for the following years:

2001 2000* 1999 1998 1997 1996 1995 1994

1993 1992 1991 1990 1989 1988 1987 1986

1985 1984 1983 1982 1981 1980 1979 1978

*Corrections to 2000 proceedings papers: Two papers were misprinted within the 2000 ISTFA Proceedings. The corrected versions are available in pdf format here:

Failure Analysis of Tungsten Stud Defects from the CMP Process

K. Takagi, Y. Kohno ITES Co., Ltd. Shiga, Japan; S. Nukii, IBM Japan, Ltd.

Integrated Circuit SNR improvement using Dielectric Altering Compound, Laser Trim, and FIB system.

B.J. Dutt, J.J. Kroutch, Jr., K.N. Hooghan, R.J. Jenkins, M.J. Toth Lucent Technologies, Allentown, Pennsylvania, U.S.A.