EuroSimE Thermal, Mechanical and Multiphysics
Simulation and Experiments
in Micro-Electronics and Micro-Systems

Prepare for EuroSimE 2005

The 6th IEEE EuroSimE conference will be held in Berlin, Germany, on April 17 (courses) and 18-19-20, 2005 (conference and exhibition).

· Short courses (April 17) will be offered for professional training. Subjects to be announced later.
· Three days of technical sessions (April 18-20) for oral and poster presentation.
· A parallel exhibition from industrial contributors and simulation and optimization software companies.
Authors ! 
  • get the first call for paper (PDF 660kb).
  • abstracts to be received by October 15, 2004 latest !
  • upload your abstract here.
  • Background

    One of the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important competitive edge to achieve competitive product and/or process development.

    Thermal, thermo-mechanical and mechanical simulations have significant impact on the business profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also formulated many challenges and impulse for the further development of simulation methodologies and tools. As the only international conference specially dedicated to thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems, EuroSimE was initiated in 2000 with major sponsorship from the European Community. The 6th in the series, EuroSimE 2005 aims to:

    Scope of EuroSimE

    EuroSimE 2005 will address the results of both fundamental research and industrial application in the fields of thermal, mechanical and multiphysics simulation and experiments in microelectronics and microsystems. This includes, but is not limited to:


    The applications will cover all fields of (micro)-electronics and microsystems, but not limited to:

    Discover former EuroSimE 2004

    The 5th international conference on thermal, mechanical and thermo-mechanical simulation and experiments in micro-electronics and micro-systems, was held in Brussels, Belgium on May 10th to 12th, 2004 with 135 participants from 22 countries.

    Get the programme of conference only (PDF 90k) or the complete programme (PDF 1.1M) : conference and courses programmes.


    EuroSimE 2005 is financially and logistically organised by Association EuroSimE and Astefo under the control of the EuroSimE Steering Committee.


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