Z. KHATIR, S. LEFEBVRE, "Boundary element analysis of thermal fatigue effects on high power IGBT modules", Microelectronics Reliability, Vol. 44, No. 6, pp. 889-1029, June 2004.
Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART545]

Titre : Z. KHATIR, S. LEFEBVRE, Boundary element analysis of thermal fatigue effects on high power IGBT modules, Microelectronics Reliability, Vol. 44, No. 6, pp. 889-1029, June 2004.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.
Cité dans :[REVUE520] Elsevier Science, Microelectronics Reliability, Volume 44, Issue 6, Pages 889-1029, June 2004.
Cité dans : [DATA146] LTN, Laboratoire des Technologies Nouvelles, INRETS, Arcueil, France.
Auteur : Z. Khatir
Auteur : S. Lefebvre

Vers : Bibliographie
Abresse : (a) The French National Institute for Transport and Safety Research, Laboratory of New Technologies, INRETS, 2, Av. du général Malleret-Joinville, F-94114, Arcueil Cedex, France.
Adresse : (b) SATIE-ENS de Cachan, 61, Av. du président Wilson, F-94235, Cachan, France.
Tel. : +33-1-4740-7334
Fax. : +33-1-4547-560
Source : Microelectronics Reliability
Volume : 44
Issues : 6
Date : June 2004
Pages : 889 - 1029
Lien : private/KHATIR1.pdf - 678 Ko, 10 pages.
Switches :
Puissance :
Logiciel :
Stockage :

Abstract :
The technology of high power IGBT modules has been significantly improved these last years against thermal fatigue. The most frequently observed failure modes, due to thermal fatigue, are the solder cracks between the copper base plate and the direct copper bonding (DCB) substrate and bond wire lift-off. Specific simulation tools are needed to carry out reliability researches and to develop device lifetime models. In other respects, accurate temperature and flux distributions are essential when computing thermo-mechanical stresses in order to assess the lifetime of high power modules in real operating conditions.
This study presents an analysis method based on the boundary element method (BEM) to investigate thermal behavior of high power semiconductor packages subjected to power cycling loads. The paper describes the boundary integral equation which has been solved using the BEM and applied to the case of a high power IGBT module package (3.3 kV–1.2 kA).
A validation of the numerical tool is presented by comparison with experimental measurements. Finally, the paper points out the effect on the thermal stress of the IGBT chips position on the DCB substrate. In particular, a light shifting of the silicon chips may be sufficient to delay significantly the initiation and the propagation of the cracks, allowing a higher device lifetime of the studied module.

Article Outline
1. Introduction
2. The problem statement
3. BEM formulation
4. Experimental validations
5. Effect of IGBT chip position on the DCB attach delamination for copper base plate module
6. Conclusion
Appendix A



References : 15
[1] : G. Mitic et al., Reliability of AlN substrates and their solder joints in IGBT power modules. Microelectron. Reliab. 39 (1999), pp. 1159–1164. SummaryPlus | Full Text + Links | PDF (495 K)
[2] : Herr E et al. Substrate-to-base solder joint reliability in high power IGBT modules. Proc of Microelectron Reliab [special issue]. ESREF'97, 1997:1719–1722
[3] : J. He et al., Reliability in large solder joint assemblies and effects of thermal expansion mismatch and die size. Int. J. Microcircuits Electron. Packag. 21 3 (1998), pp. 297–304. Abstract-Compendex
[4] : H. Berg and E. Wolfgang, Advanced IGBT modules for railway traction applications: reliability testing. Microelectron Reliab 38 (1998), pp. 1319–1323. SummaryPlus | Full Text + Links | PDF (368 K)
[5] : Coquery G et al. Reliability improvement of the soldering thermal fatigue with AlSiC technology on traction high power IGBT modules. In: Proc of 8th Europ Conf on Power Electron Appl, Lausanne, 1999
[6] : J.M. Dorkel, P. Tounsi and Ph. Leturcq, Three-dimensional thermal modeling based on the two-port network theory for hybrid or monolithic integrated power circuits. IEEE Trans. Compon., Packag. Manufact. Technol. Part A 19 4 (1996), pp. 501–507. Abstract-INSPEC | Abstract-Compendex | Full Text via CrossRef
[7] : Brebbia CA, Wrobel LC. Boundary element methods in heat transfer, copublished by Computational Mechanics Publications and Elsevier Applied Science, 1992
[8] : C.A. Brebbia, J.C.F. Telles and L.C. Wrobel, Boundary element techniques. , Springer-Verlag (1984).
[9] : I. Guven et al., Transient two-dimensional thermal analysis of electronic packages by the boundary element method. IEEE Trans. Adv. Packag. 22 3 (1999), pp. 476–486. Abstract-INSPEC | Abstract-Compendex | Full Text via CrossRef
[10] : M. Bonnet, Boundary integral equation methods for solids and fluids. , John Wiley and Son Ltd. (1999).
[11] : M. Thoben, X. Xie, D. Silber and J. Wilde, Reliability of chip/DCB solder joints in AlSiC base plate power modules: influence of chip size. Microelectron Reliab 41 (2001), pp. 1719–1723. SummaryPlus | Full Text + Links | PDF (394 K)
[12] : M.P. Rodriguez, N.Y.A. Shammas, A.T. Plumpton, D. Newcombe and D.E. Crees, Static and dynamic finite element modelling of thermal fatigue effects in insulated gate bipolar transistor modules. Microelectron Reliab 40 (2000), pp. 455–463. SummaryPlus | Full Text + Links | PDF (1089 K)
[13] : Katsis D, van Wyk J. Experimental measurement and simulation of thermal performance due to aging in power semiconductor devices. In: Proc of IAS 2002, 3:1746–1751
[14] : Hamidi A, Coquery G. Contact temperature measurements on chip surface for reliability investigations of high power IGBT modules in traction applications. In: Proc of 3rd Europ Conf on Electron Packag Technol, Nuremberg, 1998
[15] : H.S. Carslaw and J.C. Jaeger, Conduction of heat in solids. (2nd ed.), Clarendon Press, Oxford (1959).

Mise à jour le lundi 10 avril 2023 à 18 h 47 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.7.3 du 27 décembre 2018.

Copyright 2023 : TOP

Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, l'atelier d'Aurélie - Coiffure mixte et barbier, La Boutique Kit Elec Shop and www.lequeu.fr.