"Soldering down to a science (printed circuits).
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Article : [ART544]

Info : REPONSE 187, le 31/03/2004.

Titre : Soldering down to a science (printed circuits).

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Frederickson, M.D. (Electronics Manuf. Productivity Facility, Ridgecrest, CA, USA)

Source : Circuits Manufacturing (Jan. 1990) vol.30, no.1, p.76, 78, 85-6, 88. 0 refs.
CODEN : CMFGAF
ISSN : 0009-7306
Document_Type : Journal
Treatment_Code : Practical
Info : Country of Publication : United States
Language : English
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Abstract :
In the development of a soldering process, the reliability of the electronics assembly being soldered is a prime concern. Reliability of an assembly is its ability to perform properly for a defined period of time under specified operating conditions. The reliability of the solder connections have a vital role in the overall reliability of the assembly. In SMT, they provide both the mechanical and electrical integrity within the assembly. The first step in investigating the relationship between the hand-soldering process and the reliability of an electronics assembly is to define the reliability phases throughout its life. Once the relationship between the hand-soldering process and the reliability of the electronics assembly is known, the process can be optimized for reliability. Important considerations during process development are the thermal requirements of the solder connection, the thermal power delivery of the soldering tool, and the soldering iron's potential to electrically and thermally overstress the components being soldered.

Accession_Number : 1990:3626930 INSPEC
Search: thermal AND cycling
Search: thermal AND cycling AND power electronics
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