"An advanced packaging technology for high performance power devices.
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Article : [ART537]

Info : REPONSE 128, le 31/03/2004.

Titre : An advanced packaging technology for high performance power devices.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Ozmat, B.
Auteur : Temple, V.A.K.
Auteur : Azotea, J.K. (Harris Semicond., Latham, NY, USA)

Source : IECEC-97. Proceedings of the Thirty-Second Intersociety Energy Conversion Engineering Conference (Cat. No.97CH36203)
New York, NY, USA: IEEE, 1997. p.687-93 vol.1 of 4 vol. (xx+xvi+xvi+vi+2358) pp. 10 refs.
Conference: Honolulu, HI, USA, 27 July-1 Aug 1997
ISBN: 0-7803-4515-0
Document_Type : Conference Article
Treatment_Code : Application; Practical
Info : Country of Publication : United States
Language : English
Stockage :
Switches :
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Abstract :
Packaging related performance and reliability aspects of the advanced power modules were discussed. A new approach for the packaging of high performance power devices for both commercial and military applications was introduced. The resistance of device package was modeled. The results of closed form solutions and finite element analysis (FEA) were presented. The metalization and patterning of the first level package was discussed. The thermal performance of a typical power module with various heat spreader materials and configurations was analyzed by using 3D FEA techniques.

Accession_Number : 1998:5912546 INSPEC

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