"Thermal impedance and stress in a power package due to variations in layer thickness.
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Article : [ART536]

Info : REPONSE 124, le 31/03/2004.

Titre : Thermal impedance and stress in a power package due to variations in layer thickness.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Hopkins, D.C.
Auteur : Pitarresi, J.M. (T.J. Watson Sch. of Eng. & Appl. Sci., State Univ. of New York, Binghamton, NY, USA)
Auteur : Karker, J.A.

Source : Proceedings. 1997 International Symposium on Microelectronics (SPIE vol.3235)
Reston, VA, USA: IMAPS - Int. Microelectron. & Packaging Soc, 1997. p.72-7 of xvii+707 pp. 8 refs.
Conference: Philadelphia, PA, USA, 14-16 Oct 1997
Sponsor(s): IMAPS - Int. Microelectron. & Packaging Soc
ISBN: 0-930815-50-5
Document_Type : Conference Article
Treatment_Code : Practical; Theoretical
Info : Country of Publication : United States
Language : English
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Abstract :
Thickness variations of copper, ceramic and AlSiC, in a common power package structure, are investigated using a FEM (finite element model) to predict the effects of thermally induced stresses. Variation in ceramic thickness, which was previously not available for consideration, is considered as a major design variable. Thinner ceramic layers provide a significant increase in the thermal conductance of the structure. It is shown that a general trend of lesser layer thickness provides lower thermally induced stresses during system operation, which should improve reliability. Since the relative thicknesses of the layers depend on the interconnect (copper) thickness, a discussion of the copper thickness is given. A criterion is also given for substitution of an AlSiC metal matrix composite (MMC) for a copper or aluminium baseplate. The criterion is based on equivalent rigidity. Since the AlSiC has a lower thermal conductivity than the others, it becomes desirable to thin the AlSiC, which also provides a lower weight.

Accession_Number : 1998:5932628 INSPEC

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