R.D. PENDSE, P. ZHOUB, "Methodology for predicting solder joint reliability in semiconductor packages", Microelectronics Reliability, Volume 42, Issues 2, February 2002, pp. 301-305.
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Article : [ART236]

Titre : R.D. PENDSE, P. ZHOUB, Methodology for predicting solder joint reliability in semiconductor packages, Microelectronics Reliability, Volume 42, Issues 2, February 2002, pp. 301-305.

Cité dans :[REVUE294] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 2, Pages 157-305, February 2002.
Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Auteur : Rajendra D. Pendse (a)
Auteur : Peng Zhoub (b)

Vers : Bibliographie
Adresse : (a) ChipPac Inc., 3151 Coronado Drive, Santa Clara, CA 95054, USA
Adresse : (b) Department of Mechanical Engineering, Stanford University, Stanford, CA, USA
Tel. : +1-408-486-5939
Lien : mailto:rajendra.pendse@chippac.co
Source : Microelectronics Reliability
Volume : 42
Isues : 2
Date : February 2002
Pages : 301 - 305
DOI : 10.1016/S0026-2714(01)00130-5
PII : S0026-2714(01)00130-5
Lien : private/Pendse1.pdf - 5 pages, 175 Ko.
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Abstract :
A new experimental method for detecting solder joint strain in package
assemblies using digital image correlation metrology has been developed. A new
methodology is proposed which utilizes strain data generated by this technique
for predicting solder joint fatigue life for any desired package configuration
based on a reference configuration. This approach has significant practical
appeal since it obviates brute-force temperature cycle testing for the
qualification of every new variation of an existing package configuration. In
this paper, we describe the principle, experimental set-up and sample
preparation techniques for this method. We present typical strain data on solder
joints for a ball grid array (BGA) package mounted to a FR4 PC board. We apply
the technique to the prediction of temperature cycling reliability of a Ceramic
BGA package wherein, the effect of a new substrate material is examined and the
predictions are confirmed based on empirical temperature cycle testing data.
Finally, we show a co-relation of measured strain data with computations by
finite element modeling performed for a specific package configuration.

Article Outline
1. Introduction
2. Description of the technique
3. Typical results
4. Evaluation of new CBGA with HiTCE substrate material



Références : 8
[1] : K.C. Norris and A.H. Landzberg , Reliability of controlled collapse interconnections. : IBM J Res Dev 13 3 (1969), pp. 226¯271.
[2] : Darveaux R, Banerji K, Mawyer A, Dody G. Reliability of plastic ball grid array assembly. In: LauBall J, editor. Grid Array Technology. New York: McGraw Hill; 1995.
[3] : Guo Y, Sarihan S. Testing and measurement techniques applied to electronic packaging development. Applications of Experimental Mechanics to Electronic Packaging, EEP vol. 22 / AMD-vol. 26. New York: ASME; 1997. p. 85¯90.
[4] : B. Han, Y. Guo, C.K. Lim and D. Caletka , Verification of numerical models used in microelectronic packaging design by interferometric displacement measurement methods. ASME J Electron Packaging 118 (1996), pp. 157¯163. Abstract-Compendex
[5] : Zhou P, Goodson KE. Thermo mechanical diagnostics of flip chip BGA structures using phase-shifting electronic speckle pattern interferometry. Proc InterPACK'99, EEP-vol. 26-2. New York: ASME; 1999. p. 1875¯80.
[6] : W.H. Peters and W.F. Ranson , Digital imaging techniques in experimental stress analysis. Opt Engng 21 (1982), pp. 427¯431. Abstract-INSPEC | Abstract-Compendex
[7] : Maeda K, Higashi M, Kokubu M, Nakagawa S. The application of HiTCE ceramic material for LGA-type chip scale package. Proc 50th Electron Components Technol Conf, 2000. p. 358¯63.
[8] : Pendse R, Afshari B, Butel N, Leibovitz J, Hosoi Y, Shimada M, Maeda K, Maeda M, Yonekura H. New CBGA package with improved 2nd level reliability. Proc 50th Electron Components Technol Conf, 2000. p. 358¯63.

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