"Materials selection issues for high operating temperature (HOT) electronic packaging", 1998.
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Article : [ART215]

Info : REPONSE 27 © 2002 IEE, le 06/05/2002.

Titre : Materials selection issues for high operating temperature (HOT) electronic packaging, 1998.

Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Auteur : Gallagher, C.
Auteur : Shearer, B.
Auteur : Matijasevic, G. (Ormet Corp., Carlsbad, CA, USA)

Source : 1998 High-Temperature Electronic Materials, Devices and Sensors Conference (Cat. No.98EX132)
Editors : Golecki, I.; Kolawa, E.; Gollomp, B. New York, NY, USA: IEEE, 1998. p.180-9 of xvi+221 pp. 13 refs.
Conference : San Diego, CA, USA, 22-27 Feb 1998
Sponsor(s) : IEEE Electron Devices Soc.; IEEE Instrum. & Meas. Soc
Price : CCCC 0 7803 4437 5/98/$10.00
ISBN : 0-7803-4437-5
Document_Type : Conference Article
Treatment_Code : Application; Practical
Info : Country of Publication : United States
Language : English
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Abstract :
Currently, there are two major drivers for high operating temperature
(HOT) electronics in the 135-200 degrees C range. Products with
significant heat generation such as power electronics or small portable
electronics without space for cooling mechanisms provide a large market
segment in the low end of this temperature range. The upper end of the
temperature regime is represented by products that are placed into a HOT
environment such as distributed sensors and control systems. Use of
polymers for packaging in these applications is typically hampered by the
low thermal conductivity and thermal degradation resistance of polymeric
materials used in low-cost laminate PWB technology. Also, HOT applications
generally require exposure to rigorous thermal cycling for power up and
down and environmental exposure. Classes of polymeric materials
appropriate for the various aspects of electronic packaging at high
operating temperatures and -55 degrees C-225 degrees C cycling are
discussed. Also, a new electronic packaging technology which uses some
elements of laminate, except that circuits are directly deposited on
insulated metal substrates, is presented. This packaging has several-fold
better thermal conductivity than conventional ceramic or polyimide
glued-to-heat-sink HOT packaging, is more mechanically robust than
ceramic, is lightweight and compact and can be deposited on 3D surfaces to
minimize space requirements. Multilayer circuits with dimensions as small
as 50 mu m lines and spaces and 75 mu m vias are possible, as well as
large dimension circuits for power applications. This approach is also
more cost effective than conventional HOT packaging.

Accession_Number : 1999:6189538 INSPEC

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