"Mechanical analysis process for electronic packaging", 1993.
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Article : [ART210]

Info : REPONSE 37, le 06/05/2002.

Titre : Mechanical analysis process for electronic packaging, 1993.

Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Auteur : Notohardjono, Budy D. (International Business Machine Corporation,
Auteur : Poughkeepsie, NY, USA)
Auteur : Pan, Tzong-Shii
Auteur : Bove, Ronald

Meeting : Proceedings of the 1993 ASME International Electronics Packaging Conference.
Info : organization : ASME
Location : Binghamton, NY, USA
Date : 29 Sep 1993-02 Oct 1993
Source : Advances in Electronic Packaging American Society of Mechanical Engineers, EEP v 4-1 1993.Publ by ASME, New York, NY, USA.p 193-200
Année : 1993
Meeting_Number : 20497
Document_Type : Conference Article
Treatment_Code : Theoretical; Experimental
Language : English
Stockage :
Switches :
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Abstract :
This paper describes a mechanical analysis process to achieve highly
reliable power supplies.The process consists of a dynamic characterization
of the critical subassemblies, in this case the printed wire boards
(PWB's); early design review; testing; random vibration screen; and other
stress screening such as burn-in and temperature cycling.The dynamic
characterization of the critical assemblies is accomplished by both
analytical and experimental approaches.As an example, the dynamic analysis
using Finite Element method is employed to estimate dynamic
characteristics of the printed wire board and later verified by
testing.Early design review process consists of defining the requirements
and utilizing a mechanical design guide-line, a compilation of past
failures and solutions in the form a list of DO's and DONT's.(Edited author abstract)

Références : 4 Refs.

Accession_Number : 1994(41):4029 COMPENDEX

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