"Creep and tensile behavior of lead-rich lead-tin solder alloys", 1988.
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Info : REPONSE 120, le 06/05/2002.

Titre : Creep and tensile behavior of lead-rich lead-tin solder alloys, 1988.

Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Auteur : Frost, H.J. (Thayer Sch. of Eng., Dartmouth College, Hanover, NH, USA)
Auteur : Howard, R.T.
Auteur : Lavery, P.R.
Auteur : Lutender, S.D.

Source : IEEE Transactions on Components, Hybrids, and Manufacturing Technology (Dec. 1988) vol.11, no.4, p.371-9. 20 refs.
Price : CCCC 0148-6411/88/1200-0371$01.00
ISSN : 0148-6411
Conference : 38th Electronic Components Conference (ECC). Los Angeles, CA, USA.
Date : 9-11 May 1988
Sponsor(s) : IEEE; Electron. Ind. Assoc
Document_Type : Conference Article; Journal
Treatment_Code : Experimental
Info : Country of Publication : United States
Language : English
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Abstract :
The authors report on the tensile and creep deformation of a series
of high-lead solders with 0 to 10% tin, over a temperature range of 0
degrees C to 10 degrees C. In these alloys, the yield strength is strongly
influenced by the precipitation of the tin phase, which depends on
temperature and tin content. The creep rupture behavior follows the
Monkman-Grant relationship. The results are generally consistent with a
power-low creep mechanism, controlled by dislocation-core diffusion. There
is a clear trend to greater creep resistance (lower creep rate at a given
stress and temperature) for alloys of higher tin concentration. It is
concluded that the mechanical behavior during thermal cycling tests may
depend on cycle frequency and temperature range in a manner determined by
the evolution of the precipitate microstructure.

Accession_Number : 1989:3332526 INSPEC

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