"Thermal shock resistance of plastic IC package.
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Article : [TRIAC094]

Info : REPONSE 164, le 04/02/2002.

Titre : Thermal shock resistance of plastic IC package.

Cité dans : [DIV333]  Recherche sur les mots clés thermal + shock + liquid , février 2002.
Auteur : Kojima, Yoshitsugu (Toyota Central Research & Development Lab, Aichi,
Auteur : Jpn)
Auteur : Ohta, Takashi
Auteur : Matsushita, Mitsumasa
Auteur : Takahara, Minoru
Auteur : Kurauchi,
Auteur : Toshio

Source : J Appl Polym Sci v 41 n 9-10 1990 p 2199-2206
ISSN : 0021-8995
Année : 1990
Document_Type : Journal
Treatment_Code : Application; Experimental
Language : English
Stockage :

Abstract :
Dual-in-line packages (DIPs) were formed from epoxy molding compounds
with various physical properties using a transfer molding machine.The
compounds were prepared by changing kinds and amounts of additives
methods.The thermal shock test was carried out by the following
procedures.The plastic package was soaked alternately in liquid nitrogen
(-196 degree C) and in liquid solder (250 degree C) in the cycle of 140
s.The packages were intermittently subjected to optical microscopic
inspection for crack initiation.The median life to crack initiation is
defined to be the number of the cycles when half of the specimens
exhibited crack initiation.Glass transition temperature, coefficient of
linear expansion, and flexural modulus were measured to calculate thermal
stress in plastic packages. According to the linear fracture mechanics,
the following expression was obtained among the median life N, thermal
stress sigma t, and strength sigma b: N equals C/@ sigma b2 center dot (
sigma b/ sigma t)m.We found the linear relation between logarithm of N
sigma b2 and logarithm of sigma b/ sigma t for various packages, and
obtained that the value of C and m are estimated as 3 multiplied by 104
MPa2 and 5.5, respectively.Therefore, the median life can be predicted
from the glass transition temperature, coefficient of linear expansion,
flexural modulus, and strength of plastic materials for packages.(Author
abstract) 12 Refs.

Accession_Number : 1991(2):14052 COMPENDEX

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