G. COQUERY, R. LALLEMAND, D. WAGNER, P. GIBARD, "Reliability of the 400 A IGBT modules for traction converters. Contribution on the power thermal fatigue influence on life expancy", EPE'95, vol. 1, pp. 60-65.
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Article : [SHEET121]

Info : INSPEC Answer Number 39 - 22/02/2000

Titre : G. COQUERY, R. LALLEMAND, D. WAGNER, P. GIBARD, Reliability of the 400 A IGBT modules for traction converters. Contribution on the power thermal fatigue influence on life expancy, EPE'95, vol. 1, pp. 60-65.

Cité dans : [DATA146] LTN, Laboratoire des Technologies Nouvelles, INRETS, Arcueil, France.
Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans : [DIV134]  EPE'95, European Conference on POWER ELECTRONICS AND APPLICATIONS, Seville, Espagne, september 1995.
Cité dans :[SHEET245]
Auteur : G. Coquery, INRETS LTN, France
Auteur : R. Lallemand, INRETS LTN, France
Auteur : D. Wagner, GEC Alsthom (France)
Auteur : P. Gibard, GEC Alsthom (France)

Lien : SHEET245.HTM - référence [2].
Lien : EPE/EPE95_ct.txt
Source : EPE'95. 6th European Conference on Power Electronics and Applications Brussels, Belgium: EPE Assoc, 1995.
Pages : 60 - 65
Volume : vol.1 of 4 vol. (xxxii+42+xxxiv+948+xxx+928+1032) pp.
Lieu : Seville, Spain,
Date : 19-21 Sept 1995
Language : English, Sponsor(s): Eur. Power Electron. & Drives Assoc
Stockage : Thierry LEQUEU

Abstract :
With standard high power IGBT modules, a new packaging technology
using internal soldered electrical contact instead of pressed
contact, has been applied to design the traction converters. This
paper presents accelerated tests of power thermal cycling on more
than 30 IGBT modules from three manufacturers, to estimate the
parameters on the life expectancy in traction working conditions.
Also several test conditions are changed, including variations of
the junction temperature, heating current and maximal junction
temperature. To clarify the behaviour of this complex technology
module, a qualitative analysis of the thermal stress is proposed.
The conditions of tests, the criteria of failures and the
methodology of measurement are discussed. The results are presented
with major types of failure and analyses of the INRETS tests.
Failures on direct wire bond with high current density are
discussed.

Accession_Number : 1997:5545938


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