June, 11-12, 2002 in Bremen/Germany General information International Committee Conference Topics Program More Details (Conference-Database)

Tuesday, June 11, 2002 Session 1 Integration of Power Electronic Systems at High Power Densities 1 Session 2 Integration of Power Electronic Systems at High Power Densities 2 Session 3 Power Integration Technologies Wednesday, June 12, 2002 Session 4 Integration of Power Electronic Systems in Medium and Low Power Motor Drive Units Session 5 Hybrid or Monolithic Integrated Power Electronic Systems in Automotive Applications 1 Session 6 Hybrid or Monolithic Integrated Power Electronic Systems in Automotive Applications 2 Tuesday, June 11, 2002   8:30 – 8:45 Conference Opening J. Daan van Wyk, Virginia Polytechnic Institute and State University, USA Session 1 Integration of Power Electronic Systems at High Power Densities 1   8:45 – 9:30 Keynote paper: Modularization and Integration as a Future Approach for Power Electronics Systems F. C. Lee, J. Daan van Wyk, D. Boroyevich, P. Barbosa, Virginia Polytechnic Institute and State University, USA 9:30 – 10:00 Review: Ultracompact Power Electronics J. W. Kolar, ETH Zurich, CH 10:00 -10:30 Review: Review of the Development of High Density Integrated Technology for Electromagnetic Power Passives J. D. van Wyk, J. T. Strydom, L. Zhao, R. Chen, Virginia Polytechnic Institute and State University, USA 10:30 – 11:00 Coffee break Session 2 Integration of Power Electronic Systems at High Power Densities 2   11:00 – 11:30 Review: Three-Dimensional Integration based on Power Module Technology J. A. Ferreira, M. B. Gerber, Delft University of Technology, NL 11:30 – 12:00 Review: High Temperature Power Electronics: Challenges and Chances E. Wolfgang, Siemens AG, München, D 12:00 – 12:25 An Integrated Resonant Module for a 100kW 800V 3-Phase ZCT Inverter L. Zhao, J. T. Strydom, J. D. van Wyk, Virginia Polytechnic Institute and State University, USA 12:25 – 12:50 Power Supply Technology for High Power Density R. Weger, M. Schlenk, Minibea, Augsburg, D 12:50 – 14:20 Lunch Session 3 Power Integration Technologies   14:20 – 14:45 Optimization of Planar Inductors E. van Jaarsveld, W. A. Cronje, I. W. Hofsajer, Rand Afrikaans University, RSA 14:45 – 15:10 Integrated Power Filters Utilizing Skin- and Proximity Effect Based Low-Pass Interconnects J. D. van Wyk Jr., W. A. Cronje, Rand Afrikaans University, RSA, J. D. van Wyk, P. J. Wolmarans, Virginia Polytechnic and State University, Blacksburg, USA, C.K. Campbell, McMaster University, CA 15:10 – 15:35 High Voltage Smart Power IC's with Dielectric Isolation R. Lerner, U. Eckholdt, X-Fab Semiconductor Foundries AG, Erfurt, J. Knopke, alpha micro-electronics GmbH, Frankfurt/Oder, D 15:35 – 16:00 New Level Shift Transistors in 600V-Smart Power ICs using Thin-Film SOI-Technology R. Rudolf, V. Boguszewicz, R. Buckhorst, F. Michalzik, D. Priefert, Hanning ElektroWerke, Duisburg, D 16:00 –16:25 Low Temperature Joining Technique for Improved Reliability C. Mertens, R. Sittig, Technical University Braunschweig, D 16:25 – 16:50 Coffee break 16:50 – 18:15 Rap Session: Technologies for High Power Densities Chairman: G. Amaratunga, University of Cambridge, UK 19:30 – 21:00 Welcome Reception Wednesday, June 12, 2002   Session 4 Integration of Power Electronic Systems in Medium and Low Power Motor Drive Units   8:15 – 8:40 Characteristics and Benefits of Variable Speed Drives Applied to Domestic Refrigerator Compressors M. G. Schwarz, R. Rengel, embraco, BR 8:40 – 9:05 New 600V Compact Intelligent Power Modules Econo IPMs H.Thomas, Fuji Electric GmbH, Frankfurt, D, D. Y. Kusunoki, N. Matsuda, M. Watanabe, T. Fujihira, Matsumoto Branch, Fuji Hitachi Power Semiconductor Co, Ltd, Nagano, J 9:05 – 9:30 New IGBT-Driver with Independent dv/dt-and di/dt-Feedback-Control for Optimized Switching Behavior C. Dörlemann, J. Melbert, Ruhr-University Bochum, D 9:30 – 9:55 Thermal Aspects on Integrated Inverter Motors E. Schimanek, M. März, Fraunhofer Institut IIS-B, Erlangen, D 9:55 – 10:20 Active and Integrated Power – Agile Solutions for Low Power Drives Systems M. Tønnes, Danfoss Low Power Drives, P. Thøgersen, Danfoss Drives, Graasten, F. Blaabjerg, Aalborg University, DK 10:20 – 10:50 Coffee break Session 5 Hybrid or Monolithic Integrated Power Electronic Systems in Automotive Applications 1   10:50 –11:30 Review: Advanced Automotive SOC (System On Chip) Power IC's T. R. Efland, R. Teggatz, J. Devore, Texas Instruments, Dallas, USA 11:30 – 11:55 Surge Protection IC for the Switch Interface of ECUs K. Yoshida, S. Kiuchi, T. Ichimura, N. Yaeza-wa, S. Furuhata, T. Fujihira, Fuji Hitachi Power Semiconductor Co., Ltd, Nagano, J 11:55 – 12:20 SOI Intelligent Power IC Technology for Automotive Electronics M. Iida, DENSO Corporation, Aichi-ken, J 12:20 – 12:45 Key Features of a Smart Power Technology for Automotive Electronics J. Busch, M. Denison, G. Groos, H. Gruber, R. Hofmann, A. Meiser, P. Nelle, W. Schwet-lick, R. Weeger, M. Stecher, Infineon Technologies, München, D 12:45 – 14:20 Lunch Session 6 Hybrid or Monolithic Integrated Power Electronic Systems in Automotive Applications 2   14:20 – 14:45 Sensorless Current Mode Control for Automotive Applications K. Kaschani, Infineon Technologies, München, D 14:45 – 15:10 A 42V Powernet Concept for Soft Hybrids, Next Step towards the Electric Vehicle S. Bolz, R. Knorr, G. Lugert, Siemens Automotive AG, D 15:10 – 15:35 Optimal Rating of the Electric Drive in a Hybrid Vehicle A. Kleimaier, D. Schröder, Technical University Munich, D 15:35 – 16:00 Evolution of Door Electronic for Middle-and Upper Class Cars and how Semiconductor Companies Cope with these Challenging Requirements H. Sax, STMicroelectronics GmbH, Grasbrunn, D 16:00 End of Sessions General information International Committee Conference Topics Program More Details (Conference-Database)

ETG 4/2002