"New plastic package bridges the gap between discrete power semiconductors and power modules.
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Article : [ART541]

Info : REPONSE 163, le 31/03/2004.

Titre : New plastic package bridges the gap between discrete power semiconductors and power modules.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Artusi, D.
Auteur : Frank, R. (Semicond. Products Sector, Motorola Inc., Phoenix, AZ, USA)

Source : Powerconversion & Intelligent Motion (Sept. 1994) vol.20, no.9, p.19-21, 23-4. 0 refs.
ISSN : 0885-0259
Document_Type : Journal
Treatment_Code : New Development; Practical
Info : Country of Publication : United States
Language : English
Stockage :
Switches :
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Abstract :
High power requirements in power supplies and motor control applications frequently are limited by power dissipation, or system designers are forced to use more costly packaging and/or additional heat sinking to avoid thermal problems. However, a new plastic package with silicon die size and power dissipation capability beyond existing, discrete alternatives alleviates this problem. The author describes the TO-264 (formerly known as the TO3PBL) is a plastic package based on leadframe assembly techniques like the TO-220 and TO-247 plastic power packages. It extends the range of leadframe package, technology to provide a cost-effective solution for large die without requiring more costly power module packaging. It safely dissipates 325 W and can replace several TO-247 devices, reducing the size and improving the reliability of power supplies and motor drives.

Accession_Number : 1994:4781911 INSPEC

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