"Reliability prediction of substitute parts based on component temperature rating and limited accelerated test data.
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Article : [ART528]

Info : REPONSE 19, le 31/03/2004.

Titre : Reliability prediction of substitute parts based on component temperature rating and limited accelerated test data.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Kleyner, A.
Auteur : Boyle, J. (Delphi Delco Electron. Syst., Kokomo, IN, USA)

Source : Annual Reliability and Maintainability Symposium. 2003 Proceedings (Cat. No.03CH37415)
Piscataway, NJ, USA: IEEE, 2003. p.518-22 of xviii+622 pp. 6 refs. Also available on CD-ROM in PDF format
Conference: Tampa, FL, USA, 27-30 Jan 2003
Price: CCCC 0-7803-7717-6/03/$17.00
ISBN: 0-7803-7717-6
Document_Type : Conference Article
Treatment_Code : Theoretical
Info : Country of Publication : United States
Language : English
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Abstract :
This paper presents a practical method of estimating failure rates of substitute electronic component with temperature characteristics different from that of an original part. For a number of reasons electronics designers occasionally substitute electronic components with comparable parts having different power-temperature rating. The proposed method describes how the accelerated test data pertaining to the original part can be applied to the substitute component while accounting for the difference in temperature ratings. Also due to climatic differences between the regions of operation the authors suggest the use of equivalent failure rate by incorporating the temperature distribution function into the process of warranty prediction. The proposed combined technique offers the reliability engineer a practical procedure to achieve considerable savings in terms of time and cost of product validation by eliminating redundant testing and improving the accuracy of reliability prediction.

Accession_Number : 2003:7590903 INSPEC

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