"Aging of ceramic materials used in power electronic substrates.
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Article : [ART514]

Info : REPONSE 64, le 31/03/2004.

Titre : Aging of ceramic materials used in power electronic substrates.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Auteur : Malec, D. (Universite Paul Sabatier, Toulouse, Fr)
Auteur : Dinculescu, S.
Auteur : Lebey, T.

Meeting : 2000 IEEE Conference on Electrical Insulation and Dielectric Phenomena.

Info : organization : IEEE
Location : BC, Can
Date : 15 Oct 2000-18 Oct 2000

Source : Conference on Electrical Insulation and Dielectric Phenomena (CEIDP), Annual Report v 2 2000. p 604-607, IEEE, Piscataway, NJ, USA, 00CB37132
ISSN : 0084-9162
Année : 2000
Meeting_Number : 57751
Document_Type : Conference Article
Treatment_Code : Theoretical; Experimental
Language : English
Stockage :
Switches :
Power :
Software :

Abstract :
In power electronics, the development of new IGBT power modules allows them to switch kV and kA during mus. However, such components need to be cooled and ceramic materials like AlN and Al2O3 are used as an interface between the electronic devices (the chips) and the cooling. Such materials have to present very well known electrical and thermal characteristics since the reliability of the inverters these components are used in is strongly depending on them. In order to increase the knowledge of the physical mechanisms involved during their aging, different experiments are performed (lifetime, breakdown, PD and Space charge measurements...). Electrofracture mechanism is claimed to be responsible of the observed behaviors.(Author abstract) 11 Refs.

Accession_Number : 2001(6):2048 COMPENDEX

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