"Deformation measurements of surface mount assembly under power cycling using optical interferometry", 1996.
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Article : [ART193]

Info : REPONSE 34, le 06/05/2002.

Titre : Deformation measurements of surface mount assembly under power cycling using optical interferometry, 1996.

Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Auteur : Leung Kang M. (City Univ.of Hong Kong, Kowloon, Hong Kong)
Auteur : Wang W.N.

Meeting : Laser Processing of Materials and Industrial Applications.
Info : organization : SPIE - Int Soc for Opt Engineering, Bellingham, WA USA
Location : Beijing, China
Date : 06 Nov 1996-07 Nov 1996
Source : Proceedings of SPIE - The International Society for Optical Engineering v 2888 1996..p 134-145
CODEN : PSISDG
ISSN : 0277-786X
ISBN : 0-8194-2289-4
Année : 1996
Meeting_Number : 22649
Document_Type : Conference Article
Treatment_Code : Application
Language : English
Stockage :

Abstract :
The reliability of solder joints has been regarded as one of the most
critical problems in surface mount technology because of large stress
developed at the joints due to thermal expansion mismatch between
components and the substrate in operation.uNderstanding the deformation
modes of surface mount assemblies and obtaining stress and strain values
of joints allow the designer to predict the fatigue life of the solder
joints.This study is directed toward a comprehensive evaluation of
thermomechanical behavior through 3D deformation measurements of a typical
surface mount assembly having gull-wing leads soldered on a printed
circuit board by means of laser interferometric techniques.In this paper
we describe the application of real-time holographic interferometry and
Moire interferometry to measure the 3D formation of the device under power
cycling.By combining the measured results of the out-of-plane and the
in-plane displacements, together with the temperature distribution of the
assembly, the stress distributions of the leads and solder joints were
evaluated.It was estimated that the mechanical stress will exceed the
yield stress of solder material when the PQFP assembly operates at the
rated temperature of 75 degrees C.Then, the deformation of solder joints
might change from elastic to plastic.

References : 10 Refs.

Accession_Number : 1997(20):3489 COMPENDEX


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