R. SCHLEGEL, E. HERR, F. RICHTER, "Reliability of non-hermetic pressure contact IGBT modules", Microelectronics Reliability, Volume 41, No. 9-10, September/October 2001, pp. 1689-1694.
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Article : [ART242]

Info : REPONSE 2, le 13/05/2002.

Titre : R. SCHLEGEL, E. HERR, F. RICHTER, Reliability of non-hermetic pressure contact IGBT modules, Microelectronics Reliability, Volume 41, No. 9-10, September/October 2001, pp. 1689-1694.

Cité dans : [DATA240] Recherche sur l'auteur E. HERR, mai 2002.
Cité dans : [PAP371]  R. Schlegel, E. Herr, F. Richter, Reliability of non-hermetic pressure contact IGBT modules, ESREF'2001, pp. 1689-1694
Cité dans :[REVUE279] Elsevier Science, Microelectronics Reliability, Volume 41, Issues 9-10, Pages 1273-1736, September - October 2001.
Auteur : R. Schlegel (ABB Semiconductors AG, CH 5600 Lenzburg, Switzerland)
Auteur : E. Herr
Auteur : F. Richter

Source : Microelectronics Reliability v 41 n 9-10 September/October 2001 2001.p 1689-1694
CODEN : MCRLAS
ISSN : 0026-2714
Année : 2001
Language : English
Stockage :
Switches :
Power :
Software :
Lien : private/RICHTER.pdf - 6 pages, 573 Ko.

Abstract :
The reliability of a newly developed non-hermetic pressure contact
module for high power applications was investigated. Besides the standard
reliability tests one focus was the evaluation of the resistance to
humidity. A highly accelerated temperature and humidity stress test (HAST)
was introduced to shorten the learning cycles during the design phase. The
main focus of interest however was on the reliability of a non-hermetic
pressure contact module in two relevant application situations: the life
expectancy under thermal (power) cycling conditions and the capability of
a module, when it fails with a short circuit, to remain in that failure
mode even under full application load. Based on an experimental assessment
of the respective capabilities under lest conditions, theoretical
estimations then predict performance and margins in both application situations.

Références : 7 Refs.

Accession_Number : 2002(1):2675 COMPENDEX
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