T. ALANDER, S. NURMI, P. HEINO, E. RISTOLAINEN, "Impact of component placement in solder joint reliability", Microelectronics Reliability, Volume 42, Issue 3, March 2002, pp. 399-406.
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Article : [ART229]

Titre : T. ALANDER, S. NURMI, P. HEINO, E. RISTOLAINEN, Impact of component placement in solder joint reliability, Microelectronics Reliability, Volume 42, Issue 3, March 2002, pp. 399-406.

Cité dans :[REVUE295] Elsevier Science, Microelectronics Reliability, Volume 42, Issue 3, Pages 307-461, March 2002.
Auteur : T. Alander
Auteur : S. Nurmi
Auteur : P. Heino
Auteur : E. Ristolainen

Vers : Bibliographie
Adresse : Institute of Electronics, Tampere University of Technology, P.O. Box 692, 33101 Tampere, Finland
Fax : +358-3-365-2620
Lien : "mailto:tapani.alander@tut.fi"
Source : Microelectronics Reliability
Volume : 42
Issue : 3
Date : March 2002
Pages : 399 - 406
DOI : 10.1016/S0026-2714(01)00217-7
PII : S0026-2714(01)00217-7
Lien : alander1.pdf - 270 Ko, 8 pages
Switches : IGBT
Stockage : Thierry LEQUEU

Abstract :
Component placement in an electronic product is usually derived using
manufacturability or electromagnetic effects as the defining factors. The effect
of placement on component reliability is rarely studied. High integration level
of modern products provides advantages in high speed electronics but can
severely degrade the reliability of components, unless certain design rules are met.
In this paper the relation between placement and the solder joint reliability of
a BGA components is studied with computational methods in 3-D and verified with
experimental tests. Finite element method is utilized to calculate the
accumulation of plastic work in solder joints. Based on the failure criteria
obtained in the process, simple design rules are extracted and presented.

Article Outline
1. Introduction
2. Model
3. Results and discussion
3.1. Components in the same place, different sides
3.2. Components placed edge to edge
3.3. Components placed corner to corner
3.4. Components placed edge to corner
3.5. Component array
4. Conclusions


Bibliographie

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