L. CIAMPOLINI, M. CIAPPA, P. MALBERTI, P. REGLI, W. FICHTNER, "Modelling thermal effects of large contiguous voids in solder joints", Microelectronics Journal, Volume 30, Issue 11, November 1999, pp. 1115-1123.
Copyright - [Précédente] [Première page] [Suivante] - Home

Article : [ART228]

Titre : L. CIAMPOLINI, M. CIAPPA, P. MALBERTI, P. REGLI, W. FICHTNER, Modelling thermal effects of large contiguous voids in solder joints, Microelectronics Journal, Volume 30, Issue 11, November 1999, pp. 1115-1123.

Cité dans : [DATA197] Les revues Microelectronics Reliability et Microelectronics Journal, ELSEVIER, décembre 2004.
Cité dans :[REVUE308] Elsevier Science, Microelectronics Journal, Volume 30, Issue 11, Pages 1083-1172, November 1999.
Auteur : L. Ciampolini
Auteur : M. Ciappa
Auteur : P. Malberti
Auteur : P. Regli
Auteur : W. Fichtner

Vers : Bibliographie
Lien : art227.htm#Bibliographie - référence [20].

Adresse : Integrated System Laboratory, Swiss Federal Institute of Technology, Gloriastrasse 35, ETH Zentrum, CH-8092, Zurich, Switzerland
Tel. : +41-1-632-75-98
Fax. : +41-1-632-11-94
Lien : "mailto:ciampolini@iis.ee.ethz.ch"
PII : S0026-2692(99)00073-7
Source : Microelectronics Journal
Volume : 30
Issue : 11
Date : November 1999
Pages : 1115 - 1123
Lien : ciampolini1.pdf - 861 Ko, 9 pages.
Switches : IGBT
Stockage : Thierry LEQUEU

Abstract :
The local distortion of the junction temperature due to large contiguous voids
in the die attach of real power devices is investigated and modeled. Temperature
fields obtained by thermal simulations are calibrated with experimental data
obtained by high-resolution infrared thermography. The junction temperature
distortion caused by a large single void is shown to be proportional to the void
area via a package-dependent coefficient (differential specific thermal
resistance). Further, correction factors which take into account the effects of
both aspect ratio and location of the void have been computed, thereby leading
to a procedure for an accurate estimation of the local junction temperature
distortion peaks.

Keywords : Thermal modelling; Thermal analysis; Solder voids; Infrared imaging; Hybrids

Article Outline
Nomenclature
1. Introduction
2. Numerical simulation
2.1. Simulation technique
2.2. Numerical results
2.2.1. Differential specific thermal resistance
2.2.2. Edge effects
2.2.3. Aspect ratio effects
3. Experimental
3.1. Equipment
3.2. Sample preparation
3.3. Emissivity of the coating layer
4. Discussion
5. Conclusion
Acknowledgements


Bibliographie

TOP

References : 18
[1] : M. Mahalingam, M. Nagarkar, L. Lofgran, J. Andrews, D.R. Olsen, H.M. Berg, Thermal effects of die bond voids in metal, ceramic and plastic packages, First CHMT Symposium, 1985, pp. 205-214.
[2] : D.R. Kitchen, Physics of die attach interfaces, 18th Annual Proceedings of Reliability Physics, 1980, pp. 312-317.
[3] : E. Herr, T. Frey, R. Schlegel, A. Stuck and R. Zehringer, Substrate-to-base solder joint reliability in high power IGBT modules. Microelectronics and Reliability 37 10/11 (1997), pp. 1719-1722.
[4] : R.O. Carlson, A.J. Yerman, J.F. Burgess, C.A. Neugebauer, Voids, cracks, and hot spots in die attach, 21st Annual Proceedings of Reliability Physics, 1983, pp. 138-141.
[5] : N. Abuaf, V. Kadambi, Thermal investigation of power chip packages: effect of voids and cracks, Proceedings of the Technical Conference, Sixth Annual International Electronics Packaging Conference, 1986, pp. 821-828.
[6] : S. Pica, G. Scarpetta and P. Spirito, Electro-thermal simulation and experimental detection of the hot spot onset in power bipolar transistors. Microelect. J. 28 3 (1997), pp. 263-275.
[7] : W. Wu, G. Gao, L. Dong, Thermal reliability of power Insulated Gate Bipolar Transistor (IGBT) modules, 12th Annual Semiconductor Thermal Measurement and Management Symposium, 1996, pp. 136-141.
[8] : H.D. Lambilly and H.O. Keser, Failure analysis of power modules: a look at the packaging and reliability of large IGBTs. IEEE Trans. Components, Hybrids, and Manufacturing Technol. 16 4 (1993), pp. 412-417.
[9] : C. Casarosa, P. Di Barba, A. Savini, G. Ferla, A. Galluzzo, M. Mangiagli, Thermal impedance of a power plastic-package, Symposium on Materials and Devices for Power Electronics and the Fourth European Conference on Power Electronics and Applications, 1991, pp. 327-330.
[10] : R.A. Tatara, Modelling thermal resistance of power modules having solder voids with finite elements. Active and Passive Elec. Comp. 12 4 (1987), pp. 239-250.
[11] : M. Henini and D. De Cogan, TLM modelling of solder joints in semiconductor devices. IEEE Trans. Components, Hybrids, and Manufacturing Technol. CHMT 10 3 (1987), pp. 440-445.
[12] : F. Nakagawa, T. Sawa, Y. Nakano and S. Hagiwara, A thermal stress analysis of soldered/bonded joints with defects. Proceedings of the 1993 ASME International Electronics Packaging Conference 1 (1993), pp. 49-54.
[13] : H.S. Carslaw and J.C. Jaeger. Conduction of Heat in Solids, Clarendon Press, Oxford (1959).
[14] : N. Mohan, T.M. Undeland and W.P. Robbins. Power Electronics, Wiley, New York (1989).
[15] : C.C. Huang and A. Hamzehdoost, Area tape automated bonding ball grid array technology. In: J.H. Lau, Editor, Ball Grid Array Technology, McGraw Hill, New York (1995), p. 443.
[16] : R. Tummala and J. Rymaszewski, Editors, Microelectronics Packaging Handbook, Van Nostrand Reinhold, New York (1989).
[17] : C.M. Bhandari and D.M. Rowe. Thermal Conduction in Semiconductor, Wiley, New York (1988).
[18] : J.H. Lau, Editor, Ball Grid Array Technology, McGraw Hill, New York (1995).
  [1] :  [PAP158]  -------
  [2] :  [PAP158]  -------
  [3] :  [ART223]  E. HERR, T. FREY, R. SCHLEGEL, A. STUCK, R. ZEHRINGER, Substrate to base solder joint reliability in high-power IGBT modules, Microelectron. Reliab. Vol. 37, 1997, pp. 1719-1722.
  [4] : [SHEET150] R.O. CARLSON, A.J. YERMAN, J.F. BURGESS, C.A. NEUGEBAUER, Voids, cracks, and hot spots in die attach, Annual Proceedings IEEE Electron Devices Soc, april 1983, pp. 138-141.
  [5] :  [PAP158]  -------
  [6] :  [PAP158]  -------
  [7] :  [PAP158]  -------
  [8] :  [PAP158]  -------
  [9] :  [PAP158]  -------
 [10] :  [PAP158]  -------
 [11] :  [PAP158]  -------
 [12] :  [PAP158]  -------
 [13] :  [PAP158]  -------
 [14] : [LIVRE034] N. MOHAN, T.M. UNDELAND, W.P. ROBBINS, Power Electronics - Converters, Applications and Design, John Wiley & Sons, 1995 second edition, 802 pages.
 [15] :  [PAP158]  -------
 [16] :  [PAP158]  -------
 [17] :  [PAP158]  -------


Mise à jour le jeudi 19 septembre 2013 à 08 h 12 - E-mail : thierry.lequeu@gmail.com
Cette page a été produite par le programme TXT2HTM.EXE, version 10.5 du 3 décembre 2006.

Copyright 2013 : TOP
Les informations contenues dans cette page sont à usage strict de Thierry LEQUEU et ne doivent être utilisées ou copiées par un tiers.
Powered by www.google.fr, www.e-kart.fr, La Boutique Kartmasters and www.lequeu.fr.