Thermal Test Services

Analysis Tech offers complete thermal test lab services for component characterization with speedy turn-around times, usually less than 10 days. All thermal tests conform to MIL STD 750C methods and 883 method 1012 as well as EIA/JESD51 methods.

Why Thermal Testing?

Elevated junction operating temperatures in semiconductors can lead to premature aging and failure. With the continuing trend toward higher power devices, testing for thermal-related failure conditions is becoming a major concern. Manufacturers and end-users of packaged semiconductor devices are finding that production screening for quality thermal characteristics and laboratory testing for good thermal package design are low-cost alternatives to premature product failures. Some of the areas of application include:

* In-line production screening for quality thermal characteristics
* Determination of thermal resistances for component specification
* Engineering development of new semiconductor package designs
* Determination of correct burn-in temperatures
* Pre-screening for thermal resistance to increase burn-in yield
* Incoming inspection/evaluation for users of packaged semiconductors
* Engineering development of product system cooling designs
* Package thermal measurements for verification of computer thermal models

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