The 4th THERMINIC Workshop

27-29 September 1998, Cannes, France

The 4th Therminic Workshop met in Cannes from September 27 to 29, 1998. The workshop was organized by TIMA Laboratory and the TU Budapest, sponsored by the IEEE Computer Society, Test Technology Technical Committee, the TIMA Laboratory in cooperation with the THERMINIC and DETERMIN projects supported by EC/ESPRIT, the European Test Technology Technical Committee and with SPIE (the Society of Photo-Optical Instrumentation Engineers).

This workshop gathered submissions from around the world, out of which the program committee accepted 23 contributions for oral presentation and 24 ones for poster presentation.

 

Program overview

Sunday 27 September 1998

Monday 28 September 1998

Tuesday 29 September 1998


Arrival 9:00 Session 2:
SENSORS AND ACTUATORS
9:00 Invited Talk
R. Mahajan

Intel Corp., Hillsboro, USA
14:00 Registration 10:20 Coffee 9:40 Coffee
15:00 Welcome address 10:40 Vendor presentations 10:00 Session 4:
THERMAL SIMULATION
15:10 Opening adress 12:00 Lunch 12:15 Lunch
15:20 Invited Talk
B.Guenin

AMKOR Electornics, Chandler, USA
13:30 Free Time 14:00 Session 5:
THERMAL MEASUREMENT TECHNIQUES
16:00 Coffee 16:00 Session 3:
ELECTRO-THERMAL SIMULATION
15:40 Special Session:
A FINAL STATUS REPORT ON THE SEED PROJECT: RESULTS AND FUTURE CHALLENGES
16:20 Session 1:
DYNAMIC THERMAL MEASUREMENT AND EVALUATION
17:20 Coffee 16:20 Closing Remarks
17:40 Coffee 17:40 Poster Session 2

18:00 Poster Session 1 18:45 Banquet

19:30 Reception 20:30 Panel:
INDUSTRY NEED FOR AN INTEGRATED THERMAL ANALYSIS/CAD ENVIRONMENT: FROM CHIP TO PACKAGE TO SYSTEM


 

Detailed program
Sunday 27 September
14:00 Registration
15:00 Welcome address

B. Courtois, General Chair

TIMA Laboratory, Grenoble, France

15:10 Opening address

H. Rajbenbach

European Commission - DGIII, Brussels, Belgium

15:20

Invited talk

B. Guenin

AMKOR Electronics, Chandler, USA

Chair: TBD

CHARACTERIZATION OF A DELAMINATED INTERFACE IN A PLASTIC SEMICONDUCTOR PACKAGE AND ITS EFFECT ON THERMAL PERFORMANCE
16:00 Coffee
16:20

17:40

Session 1

Chair: W. Claeys

Univ. Bordeaux, France

DYNAMIC THERMAL MEASUREMENT AND EVALUATION
16:20 V. Szekely, M. Rencz, S. Török, G. Végh, Zs. Benedek, Cs. Marta, J. Mizsei

Techn. Univ. of Budapest, Hungary

ADVANCES IN THE THERMAL MEASUREMENT AND EVALUATION TECHNICS
16:40 M. Carmona, S. Marco, J. Palacin, J. Samitier

Univ. de Barcelona, Spain

A TIME-DOMAIN METHOD FOR THE ANALYSIS OF THERMAL IMPEDANCE RESPONSE PRESERVING THE CONVOLUTION FORM
17:00 L. Pellegrino1, P.E. Bagnoli2, M. Madella1, A. Piccirillo1

1CSELT, Torino, Italy

2Univ. di Pisa, Italy

SPATIALLY RESOLVED THERMAL CHARACTERIZATION OF PACKAGED VERTICAL CAVITY SURFACE-EMITTING LASERS
17:20 Z. Suszynski

Techn. Univ. of Koszalin, Poland

EXAMINATION OF THE BIPOLAR TRANSISTORS SOLDERING QUALITY:
THEORY AND EXPERIMENT
17:40 Coffee
18:00

19:00

Poster session 1

Chair: M. Rencz

Techn. Univ. of Budapest, Hungary

 
  G. Hajas, L. Liptak-Fego

Techn. Univ. of Budapest, Hungary

CHARACTERIZATION OF SUBMICRON BULK AND SOI MOS TRANSISTORS FOR ELECTROTHERMAL AND LOGI-THERMAL SIMULATION
  U. Dillner, M. Zieren, J.M. Köhler

IPHT, Jena, Germany

THERMAL DESIGN OF MICROCALORIMETERS BASED ON FINITE ELEMENT SIMULATION
  P. Bratek, P. Dziurdzia, A. Kos

Univ. of Mining and Metallurgy, Krakow, Poland

OPTIMISATION OF COOLING PROCESS WITH ACTIVE HEAT SINKS
  S. Narasimhan, B. Kusha

Fluent Inc., Santa Clara, USA

CHARACTERIZATION AND VERIFICATION OF COMPACT HEAT SINK MODELS
  M. K. Berhe, R. Nair

Fluent Inc., Lebanon, USA

NUMERICAL SIMULATIONS OF HEAT SINKS AND THEIR REPRESENTATION BY COMPACT HEAT SINK MODELS
  S. Di Pascoli1, P.E. Bagnoli1, C. Casarosa1, V. Ciuti2, A. Lorelli1

1Univ. of Pisa, Italy

2Accademia Navale, Livorno, Italy

THERMAL PROPERTIES OF INSULATED METAL SUBSTRATE TECHNOLOGY
  V. Lysenko1,2,3,Ph. Roussel1, B. Remaki1, G. Delhomme1, A. Dittmar1, D. Barbier1, C.Martelet2, V. Strikha3

1INSA Lyon, France

2Ecole Centrale Lyon, France

3Kyiv. T. Shevchenko Univ., The Ukraine

FORMATION OF THICK OXIDIZED MESO-POROUS SILICON LAYERS WITH LOW THERMAL CONDUCTIVITY FOR THERMAL ISOLATION APPLICATIONS
  A. Merticaru, V. Moagar-Poladian

National Inst. of Microtechnology, Bucharest, Romania

THERMO-MECHANICAL PROPERTIES OF HOLLOW INSULATOR THIN FILM
  L. Boarino1, G. Lerondel1, E. Monticone1, R. Steni1, G. Amato1, G. Benedetto1, V. Lacquaniti1, R. Spagnolo1, P. Roussel2, V. Lysenko2, B. Remaki2, G. Delhomme2, A. Dittmar2, D. Barbier2

1IEN "Galileo Ferraris", Torino, Italy

2INSA Lyon, France

DESIGN AND FABRICATION OF METAL BOLOMETERS ON HIGH POROSITY SILICON LAYERS
  K.S. Teh, L. Lin

The Univ. of Michigan, Ann Arbor, USA

TIME-DEPENDENT BUCKLING PHENOMENON OF POLYSILICON MICRO BEAMS
  F. Jablonski, M. Napieralska

Techn. Univ. of Lodz, Poland

MICROMACHINED ELECTRO-THERMAL CONVERTER:
MEASUREMENTS AND PARAMETER EXTRACTION
  D. Veychard1, Ph. Hazard2, J-M. Karam1

1TIMA Lab., Grenoble, France

2Schneider Electric SA, Nanterre, France

ELECTRO-THERMAL CONVERTER WITH HIGH TIME CONSTANT
19:30 Reception
Monday 28 September
9:00

10:20

Session 2

Chair: G. De Mey

Univ. of Gent, Belgium

SENSORS AND ACTUATORS
9:00 C. Shafai1, M.I. Brett2

1Univ. of Manitoba, Winnipeg, Canada

2Univ. of Alberta, Edmonton, Canada

ON-CHIP THIN FILM PELTIER HEAT PUMPS
9:20 L. Langley1, G. Matijasevic2, P. Gandhi2

1Vatell Corp., Blacksburg, USA

2Ormet Corp., Carlsbad, USA

HIGH SENSISTIVITY, LARGE AREA HEAT FLUX SENSORS FABRICATED USING A NOVEL MATERIALS AND PATTERNING TECHNOLOGY
9:40 M. Kimura, J.I. Hayasaka, C. Sawai, T. Aizawa

Tohoku-Gakuin Univ., Miyagi, Japan

CHARACTERIZATION OF THE MICRO-THERMAL ANALYSIS SENSOR AND PROPOSAL OF TRANSISTOR-THERMISTOR FOR TEMPERATURE MEASUREMENT OF ITS SI-SUBSTRATE
10:00 A.V. Korlyakov1, V.V. Luchinin1, I.V. Nikitin1, V. Busch2, H.D. Liess2, J. Lademann3

1St Petersburg State Electr. Univ., Russia

2Univ. of German Armed Forces, Muenchen, Germany

3Humboldt Univ. Berlin, Germany

STABLE INTEGRATED SiC-BASED MICROSYSTEMS:
HEATER/TEMPERATURE SENSOR
10:20 Coffee
10:40 Vendor presentations  
12:00 Lunch
13:30 Free time
16:00

17:20

Session 3

Chair: U. Dillner

IPHT, Jena, Germany

ELECTRO-THERMAL SIMULATION
16:00 M.N. Sabry

Mansoura Univ., Egypt

STATIC AND DYNAMIC THERMAL MODELLING OF IC'S
16:20 G. Digele1,2, S. Lindenkreuz1, E. Kasper

1Robert Bosch GmbH, Reutlingen, Germany

2Univ. of Stuttgart, Germany

FAST ELECTRO-THERMAL CIRCUIT SIMULATION USING REDUCED ORDER MODELS
16:40 V. Szekely, A. Poppe, M. Rencz, A. Pahi, Sz. Hajder, G. Hajas

Techn. Univ. of Budapest, Hungary

STRUCTURAL AND ALGORITHMIC QUESTIONS OF A PLATFORM INDEPENDENT ELECTRO-THERMAL SIMULATOR
17:00 H. Laiz1, M. Klonz2

1INTI,San Martin, Argentina

2PTB, Braunschweig, Germany

DYNAMIC NONLINEAR ELECTRO-THERMAL SIMULATION OF A THIN-FILM THERMAL CONVERTER
17:20 Coffee
17:40

18:40

Poster session 2

Chair: M. Rencz

Techn. Univ. of Budapest, Hungary

 
  T. Dalton, J. Punch, M. Davies

Univ. of Limerick, Ireland

AN EXPERIMENTAL METHODOLOGY FOR THE DETERMINATION OF COMPACT THERMAL MODELS OF ELECTRONIC DEVICES
  M. Furmanczyk1, A. Napieralski1, E. Yu, A. Przekwas2, M. Turowski1,2

1Techn. Univ. of Lodz, Poland

2CFD Research Corp., Huntsville, USA

THERMAL MODEL REDUCTION FOR INTEGRATED CIRCUITS
  K.O. Petrosjanc1, P.P. Maltcev1, N.I. Rjabov1, V.N. Gridin2, L.N. Kravtchenko3

1Moscow Univ. of Electr. & Maths, Russia

2Russian Acad. of Sciences, Odintsovo, Russia

3SRIM, Moscow, Russia

THERMAL INVESTIGATIONS OF HIGH-SPEED DIGITAL GaAs ICs
  A. Kaminski, J. Jouglar, C. Volle, S. Natalizio, P.L. Vuillermoz, A. Laugier

INSA Lyon, France

NON DESTRUCTIVE CHARACTERIZATION OF DEFECTS IN DEVICES USING INFRARED THERMOGRAPHY
  M. Malinski1, L. Bychto1, R. Kisiel2

1Techn. Univ. of Koszalin, Poland

2Techn. Univ. of Warsaw, Poland

PHOTOACOUSTIC MEASUREMENTS OF THE THERMAL PROPERTIES OF THE ELECTRICALLY CONDUCTING ADHESIVES USED IN THE ASSEMBLY OF ELECTRONIC COMPONENTS
  Z. Suszynski

Techn. Univ. of Koszalin

PHOTOACOUSTIC DIAGNOSTIC OF THE POWER TRANSISTORS ENCAPSULATION
  C. A. dos Reis Filho

State Univ. of Campinas, Brasil

CURRENT-FEEDBACK LINEARIZATION TECHNIQUE FOR Pt100 RTD’s
  J.E. Duarte1, F.H Fernandez Morales1, J. Sieiro2, S. Leseduarte2, M. Moreno2

1Univ. Pedag. Y Tecno., Boyaca, Colombia

2Univ. de Barcelona, Spain

THERMO-MECHANICAL MODELING OF A THERMO-OPTICALLY ACTUATED SILICON MEMBRANE
  S. Tuli, A. Gupta, A. Moghe

Indian Inst. of Techno., New Delhi, India

MIRAGE BASED PROFILING OF CURRENT CARRYING MICROCONDUCTORS
  Ch. S. Roumenin, A. Ivanov, P. Nikolova

Inst. of Control and System Research, Sofia, Bulgaria

TEMPERATURE INDUCED ANISOTROPY EFFECT IN DIODE MICROSTRUCTURES BASED MAGNETIC SENSORS
  S.Q. Ling, B.Q. Le, R.F. Conde

Johns Hopkins Univ., Laurel, USA

THERMAL ASSESSMENT OF A MINIATURIZED SPACEBORNE COMMAND & DATA HANDLING IN YOUR PALM (C&DHIYP)
  A. Morrissey1, J.Alderman1, G. Kelly1, Zs.Kohari2, A. Pahi2, M. Rencz2

1NMRC, Cork, Ireland

2Techn. Univ. of Budapest, Hungary

3D PACKAGING OF A MICROSYSTEM WITH SPECIAL THERMAL CONSTRAINTS
18:45 Banquet
20:30 Panel

Moderator: B. Guenin

AMKOR Electronics, Chandler, USA

INDUSTRY NEED FOR AN INTEGRATED THERMAL ANALYSIS/CAD ENVIRONMENT:
FROM CHIP TO PACKAGE TO SYSTEM
Tuesday 29 September
9:00

9:40

Invited talk

R. Mahajan

Intel Corp., Hillsboro, USA

Chair: V. Székely

Techn. Univ. of Budapest, Hungary

THERMAL INTEGRATION CHALLENGES IN COMPUTING:
THE NEED FOR PREDICTIVE CAPABILITIES
9:40 Coffee
10:00

11:40

Session 4

Chair: Y. Zorian

LogicVision, Princeton, USA

THERMAL SIMULATION
10:00 L. Ciampolini, P. Regli, W. Fichtner

ETH Zurich, Switzerland

SIMULATING THERMAL EFECTS OF SOLDER VOIDS IN LARGE AREA JOINTS
10:20 V. Szekely, A. Pahi, M. Rosenthal, M. Rencz

Techn. Univ. of Budapest, Hungary

3D EXTENSION OF THE SUNRED THERMAL FIELD SOLVER
10:40 M. Janicki, M. Zubert, A. Napieralski

Techn. Univ. of Lodz, Poland

APPLICATION OF FUNCTION SPECIFICATION METHOD FOR INTEGRATED CIRCUIT TEMPERATURE ESTIMATION
11:00 D. de Cogan

Univ. of East Anglia, United Kingdom

THE RELATIONSHIP BETWEEN PARABOLIC AND HYPERBOLIC TLM MODELS FOR HEAT-FLOW
11:20 S. Tzanova, P. Philippov

Techn. Univ. of Sofia, Bulgaria

MCM ELEMENT PLACEMENT SATISFYING THE CRITERION FOR OPTIMAL THERMAL CONDITIONS
12:15 Lunch
14:00

15:40

Session 5

Chair: D. de Cogan

Univ. of East Anglia, United Kingdom

THERMAL MEASUREMENT TECHNIQUES
14:00 G.B.M. Fiege, L.J. Balk

BUGH, Wuppertal, Germany

SCANNING THERMAL MICROSCOPE (SThM):
A TOOL FOR THE INVESTIGATION OF THERMAL PROPERTIES AND TEMPERATURE DISTRIBUTIONS IN THE NANOMETER RANGE
14:20 J. Altet1, A. Rubio1, S. Dilhaire2, E. Schaub2, W. Claeys2

1Univ. Polit. De Catalunya, Barcelona, Spain

2Univ. Bordeaux, France

THERMAL CHARACTERIZATION OF DEFECTS IN AN IC:
THERMAL TESTING
14:40 Y. Assouad1, T. Gautier1, J.P. Landesman2, E. Martin2, P. Braun3

1Thomson-CSF, Elancourt, France

2LCR, Orsay, France

3United Monolithic Semiconductors GmbH, Ulm, Germany

TEMPERATURE DISTRIBUTION IN POWER GaAs TRANSISTORS USING SPATIALLY RESOLVED PHOTOLUMINESCENCE MAPPING COMPARED WITH FULL THERMAL MODELLING
15:00 K. Nassim1, L. Joannes1, A. Cornet1, S. Dilhaire2, E. Schaub2, W. Claeys2

1Univ. Louvain-La-Neuve, Belgium

2Univ. Bordeaux, France

HIGH RESOLUTION INTERFEROMETRY (HRI) AND ELECTRONIC SPECKLE PATTERN INTERFEROMETRY (ESPI) APPLIED TO THE THERMOMECHANICAL SYUDY OF MOS POWER TRANSISTOR
15:20 J. Lohan, R. Lehtiniemi, P. Rodgers, C.M. Fager, P. Tiilikka, J. Rantala

Nokia Research Center, Finland

COMPARISON AND VALIDATION OF DIFFERENT EXPERIMENTAL TECHNIQUES TO MEASURE ELECTRONIC COMPONENT OPERATING JUNCTION TEMPERATURE
15:40

16:20

Special session

Chair: V. Székely

Techn. Univ. of Budapest, Hungary

J. Parry

Flomerics Ltd, Surrey, United Kingdom

A FINAL STATUS REPORT ON THE SEED PROJECT:
RESULTS AND FUTURE CHALLENGES
16:20

16:30

Closing remarks

 

Proceedings, special issues of journals

The informal proceedings of the workshop is formed by the Collection of papers presented at the 4th Therminic Workshop (241 pages), which was distributed among the workshop participants. Limited number of copies is available for FF200 from TIMA. As follow up to the Workshop special issue of the Microelectronics Journal (Vol. 30, No. 11, 1999) and a special issue of the IEEE Transactions on Components, Packaging and Manufacturing Technology, (Vol. 22, No. 2, 1999) were prepared based on contributions presented at the 4th Workshop. These issues form the formal proceedings of the workshop.

 

 

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