The 2nd THERMINIC Workshop

25-27 September 1996, Budapest, Hungary

 

The Second Therminic Workshop met in Budapest from September 25 to 27. This workshop gathered 73 attendees from around the world. The workshop was organized by TIMA Laboratory and the TU Budapest, sponsored by the IEEE Computer Society, Test Technology Technical Committee, the Hungarian National Committe for Technical Development (OMFB) and the US Navy Office of Naval Research Europe (ONREUR) in cooperation with the THERMINIC CP940922 Copernicus and the BARMINT 8173 ESPRIT Projects and with the European Test Technology Technical Committee.

 

SUMMARY:

 

Alfonso Ortega from the University of Arizona gave an invited talk on conjugate heat transfer, and Reinhold Vahrmann from TEMIC, also invited, talked about the results obtained on thermal effects in the framework of Europe's JESSI Analog Expert Design System.A panel also met to discuss industrial needs, a counterpart to the panel on education held in the first workshop's 1995 meeting in Grenoble. These thermal issues are important to the testing community in a broad sense (production testing, on-line testing, design for thermal testability, and so on). A TAC (technical action committee) on thermal testing has been created. A small vendors' exhibition and presentation has also been organized. The participants were Semilab Rt., Hungary (thermal transient testing unit), Technical University of Budapest, Hungary (SISSI electro-thermal simulation package), Flomerics Ltd., UK (Flotherm CFD program) and Temptronics Inc., USA (liquid cristal based thermal imaging). The workshop featured seven sessions dealing with temperature sensors , thermal simulation, electrothermal simulation, thermal characterization of packages, thermal transient measurements, thermal mapping, thermal sensors & actuators. Further details:

 

Contributions to the technical programme
The informal proceedings (collection of papers) of the 2nd Therminic Workshop extends to 285 pages. The volume contains the full text of 31 contributed papers presented in 15 minutes at the 7 sessions of the workshop and it also contains the text version of 12 contribuitions that have been presented on posters. Furthermore, each poster has also been presented with a short (3 minutes) oral introduction. There were 6 papers which were not available in full text at the time of printing the informal proceedings. Altogether 134 authors from Europe, the USA and other countries including India, Australia and Taiwan have taken the effort to contribute to the technical programme of the workshop. About 2/3 of the contributions came from universities and research laboratories and about 1/3 of the papers came from the industry. The workshop programme reflected well the work carried out in the framework of the two related European research projects THERMINIC and BARMINT and a few papers reported results from the DELPHI project as well. The different sessions, thus the different chapters of the informal proceedings covered the most important fields of thermal problems related to ICs and microstructures. This year a separate session was devoted to electro-thermal simulation which indicates the emerging importance of this topic.

 

Statistics about the participants of the workshop

There were 73 participants at the 2nd Therminic Workshop, from 18 different countries. The majority of the participants came from Europe, especially from France (16), from Hungary (14), from Poland (9) and from Germany (6). There were 4 attendees from the USA, and we had guests from Singapore and India as well. Most of the attendees (47) came from the academia (universities and different research laboratories), while about 1/3 of the participants (22) were from the industry. Governmental bodies of different countries were represented by 4 attendees. There were 40 people from EU member states, 26 from Central and Eastern Europe. We had 4 US guests and 3 participants from other countries. The distribution of the workshop attendees is ilustrated by the bar diagrams below.

Distribution by countries:

France 16
Hungary 14
Poland 9
Germany 6
USA 4
Denmark 3
Ireland 3
Spain 3
UK 3
Belgium 2
Singapore 2
The Ukraine 2
Austria 1
Finland 1
India 1
Romania 1
Sweden 1
The Netherlands 1
All together 73

Distribution by sectors:

Academia 47
Industry 22
Government 4

Regional distribution:

EU Countries 40
CE/NIS countries 26

 

 

 

The workshop program overview

Wednesday 25 September 1996:

  • Arrival
  • 14.00 Registration
  • 15.00 Welcome address
  • 15.10 Opening address
  • 15.20 Invited talk
  • 16.00 Coffee
  • 16.20 Session 1 : Thermal Simulation
  • 19.00 Social event : cruise on the Danube with reception

Thursday 26 September 1996:

  • 8.40 Invited talk
  • 9.20 Coffee
  • 9.40 Session 2 : Temperature sensors & monitoring
  • 11.00 Coffee
  • 11.20 Poster session
  • 12.40 Lunch
  • 14.20 Session 3 : Electro-thermal Simulation
  • 16.20 Coffee
  • 16.40 Barmint
  • 17.00 Vendor presentations
  • 18.00 Dinner
  • 20.00 Panel discussion

Friday 27 September 1996

  • 8.40 Session 4 : THERMAL characterization of packages
  • 10.20 Coffee
  • 10.40 Session 5 : Thermal transient measurements
  • 12.40 Lunch
  • 14.20 Session 6 : Temperature mapping
  • 15.40 Coffee
  • 16.00 Session 7 : Thermal sensors & actuators
  • 20.00 Banquet

 

Detailed program of the workshop

25th September

  • 14.00 Registration
  • 15.00 Welcome address: B. Courtois general chair, TIMA, Grenoble, France
  • 15.10 Opening address: S. Bottka vice-president of OMFB, Budapest, Hungary
  • 15.20 Invited talk conjugate heat transfer :
    A. Ortega, Univ. of Arizona, USA beyond the adiabatic heat
    Chair : V. Szekely transfer coefficient in air Techn. Univ. of Budapest, Hungary cooling of electronics
  • 16.00 Coffee
  • 16.20-18.00 SESSION 1 Thermal Simulation
    Chair : G. Kelly, NMRC, Cork, Ireland
    • 16.20 V.A. Koval, D.V. Fedasyuk State Univ. of Lviv, The Ukraine
      The 3D transient thermal simulation of microelectronic systems
    • 16.40 A. Csendes, V. Szekely, M. Rencz Techn. Univ. of Budapest, Hungary
      microS-THERMANAL : an efficient thermal simulation tool for microsystem elements and MCMs
    • 17.00 V. Szekely Techn. Univ. of Budapest, Hungary
      THERMODEL : a tool for compact dynamic thermal model generation
    • 17.20 P. Tounsi, J.M. Dorkel, Ph. Leturcq, P. Vales, Ph. Dupuy LAAS - CNRS, Toulouse, France INSA, Toulouse, France
      3D thermal modelling for electronic devices based on the two-port network theory
    • 17.40 M. Furmanczyk, G. Jablonski, A. Napieralski Techn. Univ. of Lodz, Poland
      Thermal simulation with TULSOFT package in the Cadence design framework
  • 19.00 Social event Cruise on the Danube & reception
  • 22.00 Dinner

26th September

  • 8.40 Invited talk R. Vahrmann TEMIC Semiconductors, Heilbronn, Germany
    Chair : V. Szekely Techn. Univ. of Budapest, Hungary
    analog expert design system - jessi ac12 - analog design methodology and thermal effects
  • 9.20 Coffee
  • 9.40-11.00 Session 2 Temperature sensors & monitoring
    Chair : W. Claeys Univ. of Bordeaux, Talence, France
    • 9.40 E. Montane, S.A. Bota, J. Samitier Univ. of Barcelona, Spain
      A compact temperature sensor for a 1.0 microm CMOS technology using lateral pnp transistors
    • 10.00 V. Szekely, Cs. Marta, Zs. Kohari, M. Rencz Techn. Univ. of Budapest, Hungary
      New temperature sensor for DfTT applications
    • 10.20 R.C.S. Freire, G.S. Deep, P. Loumeaun DEE-CCT-UFPB, Bodocongo, Brazil ENST-ELEC-ANA, Paris, France
      A pn junction-based precision temperature transducer integrated circuit
    • 10.40 J. Altet, A. Rubio Univ. Polit. de Catalunya, Barcelona, Spain
      Analysis of ambient temperature effects on dynamic thermal testing of integrated circuits
  • 11.00 Coffee
  • 11.20-12.40 Poster Session Introduction to posters
    Chair : M. Rencz, Techn. Univ. of Budapest, Hungary
    • J.L. Blanchard Zuken-Redac S.A., Les Ulis, France
      Temperature of copper tracks in a substrate cooled by radiation
    • A.K. Stubos NCSR Demokritos, Attikis, Greece
      Enhanced chip cooling via boiling in porous layers
    • Y. Scudeller , C. Valn Univ. of Nantes, France 3D+, France
      Heat transfer analysis on tridimensional stacking of thin plastic packages
    • S.P. Kolev, I. Barsony, A. van der Bergn, C. Cobianul
      Univ. of Sofia, Bulgaria Res. Inst. of Materials Sci., Budapest, Hungary Univ. of Twente, Enschede, The Netherlands Inst. of Microelectronics, Bucharest, Romania
      Mathematical modelling of porous silicon based pellistor-type catalytic flammable gas sensor
    • W. Kalita, J. Potencki Techn. Univ. of Rzeszow, Poland
      Thick-film distributed rc networks in synthesis of sensors and control systems
    • G.A. Frolov, O.M. Grudin, I.I. Katsann,B.I. Lupinan
      Sensor Systems Co., Kiev, The Ukraine Kiev Polytechnic Inst., Kiev, The Ukraine
      Thermal gas density sensor
    • Y. Assouad, F. Gatfosse, T. Gautier Thomson RCM, Elancourt, France
      Transient characterization and modelling of ceramic packages
    • A. Kos Univ. of Mining & Metallurgy, Krakow, Poland
      Estimation of thermal dynamics of ICs
    • V. Jimenez, F. Masana, M. Dominguez, L. Castaner Univ. Polit. de Catalunya, Barcelona, Spain
      Electro-thermal simulation in hot-wire flow sensors
    • M. Orlikowski, M. Zubert, W. Wojciak, A. Napieralski Techn. Univ. of Lodz, Poland
      General approach to VHDL-A modelling of an integrated micropump
    • F. Migom, W. Temmerman, J. Peeters Alcatel Telecom, Antwerp, Belgium
      Thermal models for integrated resistor technology
    • F. Dhondt, P.A. Rolland, N. Haese, S. Delagen, H. Blanckn, E. Chartiern
      IEMN, Villeneuve d'Ascq, France Thomson LCR, Orsay, France
      Self-consistent electro-thermal modelling of multifingers HBTs for power application
    • M. WiklundUniv. of Lund, Sweden
      Electro-thermal simulation of MOS transistor circuits with SPICE using portable subcircuits
    • W. Szczesniak Tech. Univ. of Gdansk, Poland
      Reduction of thermal interactions between chosen elements of electronic circuits
    • A. Soulos, D. de Cogan, K.O. Chichlowski Univ. of East Anglia, Norwich, UK
      Sub-surface feature location and identification using inverse TLM techniques
  • 12.40 Lunch
  • 14.20-16.20 Session 3 Electro-thermal simulation
    Chair : G. De Mey, Univ. of Ghent, Belgium
    • 14.20 G. Digeletn, S. Lindenkreuz, E. Kaspern
      R. Bosch GmbH, Reutlingen, Germany,Univ. of Stuttgart, Germany
      Fully-coupled dynamic electro-thermal simulation
    • 14.40 V. Szekely, A. Poppe, A. Pahi, A. Csendes, G. Hajas, M. Rencz
      Techn. Univ. of Budapest, Hungary
      Electro-thermal and logi-thermal simulation of VLSI designs
    • 15.00 S. Wunsche Fraunhofer Inst., Dresden, Germany
      Simulator coupling for electro-thermal simulation of integrated circuits
    • 15.20 M.N. Sabry, A. Bontemps, V. Aubert ANACAD, Meylan, France
      Realistic and efficient simulation of electro-thermal effects in VLSI circuits
    • 15.40 S. Nooshabadi, G.S. Visweswaran, D. Nagchoudhuri n, K. Eshraghiann
      Northern Territory Univ., Australia, Indian Inst. of Techn., New Delhi, India, Edith Cowan Univ., Australia A SPICE MOS transistor thermal subcircuit
    • 16.00 S. Azzopardi, Ch. Zardini Univ. of Bordeaux, France
      Temperature effects on the internal physical and electrical behaviour of n-channel punch-through insulated gate bipolar transistor
  • 16.20 Coffee
  • 16.40 The BARMINT Project : open questions on thermo-mechanical aspects
    D. Esteve, Project leader, LAAS-CNRS, Toulouse, France
  • 17.00 Vendor presentations
  • 18.00 Dinner
  • 20.00 Panel discussion
    Moderator : C. Lasance Philips Research, Eindhoven, The Netherlands
    Industrial needs with respect to thermal issues in electronic parts
    Coorganized with IEEE Design and Test of Computers
    Panelists :
    H. Rosten, Flomerics Ltd, Hampton Court, UK
    H. Jaouen, SGS-Thomson, Crolles, France
    D. Blackburn, NIST, Gaithersburg, USA
    A. Ortega, Univ. of Arizona, USA

27th September

  • 8.40-10.20 Session 4 THERMAL characterization of packages
    Chair : D. Blackburn, NIST, Gaithersburg, USA
    • 8.40 H.I. Rosten Flomerics Ltd, Hampton Court, UK
      DELPHI-A status report on the European-funded project for the development of libraries and physical models for an integrated design environment
    • 9.00 M. O'Flaherty, C. Cahill, K. Rodgers, O. Slattery NMRC, Cork, Ireland
      Thermal resistance measurement protocols
    • 9.20 E.P. Fitzgerald, M.R.D. Davies Univ. of Limerick, Ireland
      Thermal conductivity of plastic encapsulations
    • 9.40 B. Wiecek, G. De Mey Univ. of Ghent, Belgium
      Evaluation of heat dissipation by natural convection for VLSI packages
    • 10.00 L. Albo, Ph. Coulloch, A. Coello-Vera Alcatel Espace, Toulouse, France
      Thermal parametric characterisation of an MCM-V stack for space applications
  • 10.20 Coffee
  • 10.40-12.00 Session 5 Thermal transient measurements
    Chair : H. Rosten, Flomerics, Surrey, UK
    • 10.40 T. Phan, S. Dilhaire, V. Quintard, D. Lewis, W. Claeys, J.C. BatsalenD. Lewis, W. Claeys, J.C. Batsalen
      LCO, Talence, France LEPT, Talence, France
      Modelling and measurement of micrometric interconnects' transient temperature - application to thermal conductivity identification
    • 11.00 Y. Scudeller, N. Hmina Univ. of Nantes, France
      Experimental investigation on thermal properties of metal-oxydes submicron structures
    • 11.20 M. Malinski, Z. Suszynski, L. Bychto Techn. Univ. of Koszalin, Poland
      Determination of the quality of the soldering of semiconductor chips by the thermal wave method
    • 11.40 G. De Meyn, C. Munteanu Univ. of Ghent, Belgium Techn. Univ. of Cluj-Napoca, Romania
      Measuring thermal parameters by induced thermal waves
  • 12.40 Lunch
  • 14.20-15.40 Session 6 Temperature mapping
    Chair : A. Ortega Univ. of Arizona, USA
    • 14.20 Ch. Herzum, Ch. Bolt, J. Kolzer, J. Otto, R. Weiland Siemens AG, Munchen, Germany
      High resolution temperature mapping of microelectronic structures using quantitative fluorescence microthermography
    • 14.40 D. Lewis, S. Dilhaire, T. Phan, V. Quintard, V. Hornungn, W. Claeys
      Univ. of Bordeaux, Talence, France Alcatel Alsthom Rech.,Marcoussis, France
      Heat deposition and transport in a semiconductor laser diode: modelling and experimental study
    • 15.00 B. Wiecek, E. DeBaetselier, G. De Mey Univ. of Ghent, Belgium
      Active thermography application for solder thickness measurement in SMD technology
    • 15.20 D. Pogany, N. Seliger, T. Lalinskyo ,J. Kuzmik, P. Habas, P. Hrkut, E. Gornik
      Tech. Univ. of Vienna, Austria Inst. El. Eng., Slovak Acad. of Sci Bratislava, Slovakia Inst. Comp. Sci., Slovak Acad. of Sci, Bratislava, Slovakia
      Study of thermal effects in GaAs micromachined power sensor microsystems by an optical interferometer technique
  • 15.40 Coffee
  • 16.00-18.00 Session 7 Thermal sensors & actuators
    Chair : Y. Zorian Lucent Technologies, USA
    • 16.00 U. Dillner, E. Kessler, S. Poser, V. Baier, J. Muller IPHT, Jena, Germany
      Thermal simulation of a micromachined thermopile-based thin-film gas flow sensor
    • 16.20 J.M. Karam, R.A. Bianchi, F.V. Santos, B. Courtois TIMA Laboratory, Grenoble, France
      Design and fabrication of an array of CMOS compatible IR sensors
    • 16.40 D. L. Blackburn, A. Ortega NIST, Gaithersburg, USA Univ. of Arizona, USA
      The application of a micromachined, thin film thermal converter as an active local heat transfer sensor
    • 17.00 P. Ancey, J.P. Fontaine, K. Ishihara, M. Gschwind IMRA Europe S.A., Sophia Antipolis, France Design of a thermoelectric oscillator by numerical simulation & thermography, application to thermal flux sensing
    • 17.20 G. Kelly, J. Alderman, C. Lyden, J. Barrett NMRC, Cork, Ireland
      Packaging a thermally actuated micromachined silicon membrane pump
    • 17.40 L. Lin, M. Chiao National Taiwan Univ., Taipei, Taiwan
      Electro, thermal and elastic characteristics of suspended micromachined beams
  • 20.00 Banquet
    Halászbástya Restaurant Buda Castle

 

Proceedings, special issues of journals
The informal proceedings of the workshop is formed by the Collection of papers presented at the 2nd Therminic Workshop, which was distributed among the workshop participants. Limited number of copies is available for FF200 from TIMA. As follow up to the Workshop special issue of the Microelectronics Journal (Vol. 29, No.4-5, 1998) and a special section in the IEEE Transactions on VLSI Systems (Vol. 5, No. 3, 1997) were prepared based on contributions presented at the 2nd Workshop. These issues form the formal proceedings of the workshop.

 

 

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