The 1st THERMINIC Workshop
25-26 September 1995, Grenoble, France

The First Therminic Workshop met in Grenoble (in the Grand Hotel de Paris, in Villard de Lans, in the Vercors mountains) from September 25 to 26, 1995. It gathered together about 90 attendees from Europe, the USA and Japan. The workshop was organized by TIMA Laboratory (Grenoble, France) and the Department of Electron Deveices of TU Budapest, co-sponsored by the THERMINIC CP940922 Copernicus and the BARMINT 8173 ESPRIT projects. The workshop featured 6 sessions of oral presentations dealing with:

  • thermal and temperature sensors
  • thermal simulation
  • packages thermal modelling and investigation
  • evaluation of thermal measurements
  • thermography
  • electro-thermal simulation,

completed with a poster session and a panel discussion titled How bad is thermal education of electronics engineers. The Programme Committee has accepted 30 contributions for oral presentation and 13 papers for poster presentation. Oral contributions consisted of 15 min. presenattion followed by 5 min. discussion. The posters were introduced by one slide in 2 minutes each. A small vendors' exhibition and and presentation has also been organized.

Further details:

 

The workshop program overview

Sunday 24 September 1995

  • 18.30 Busses leave Grenoble station to Villard de Lans

  • 19.00 Registration

  • 20.00 Dinner

Monday 25 September 1995

  • 7.00 Registration (Breakfast is available from 7.00 every day)

  • 8.30 Opening Address

  • 8.40 Invited Talk

  • 9.20 Session 1 : Thermal and Temperature Sensors

  • 11.00 Coffee

  • 11.20 Session 2 : Thermal Simulation

  • 12.50 Lunch

  • 14.20 Session 3 : Packages Thermal Modelling and Investigation

  • 16.00 Coffee

  • 16.20 Session 4 : Thermal Simulation

  • 18.00 Free Time

  • 19.00 Dinner

  • 20.30 Panel : How Bad is Thermal Education of Electronics Engineers ?

Tuesday 26 September 1995

  • 8.30 Invited Talk
    Facing Challenges in Microprocessor Cooling ; Portable Power

  • 9.10 Session 5 : Evaluation of Thermal Measurements

  • 10.10 Introduction to the poster session

  • 10.40 Poster + Coffee

  • 11.40 Session 6 : Thermography

  • 13.00 Lunch

  • 14.30 Session 7 : Electro-thermal Simulation

  • 16.10 End of session 7

  • 16.30 Buses leave (option A)

  • 16.30 Free discussion on Thermal Simulation (option B)

 

 

Detailed program of the workshop

25th September 1995

  • 8.30 Opening Address
  • 8.40 INVITED TALK : D. Blackburn NIST, Gaithersburg, USA
    ISSUES IN THE MEASUREMENT OF TEMPERATURE AND THERMAL CHARACTERIZATION OF MICROELECTRONIC COMPONENTS
  • 9.20-11.00 SESSION 1 Thermal and Temperature Sensors
    Chair : C. Cahill NMRC, Cork, Ireland
    • 9.20 M. Kimura, J. Manaka, K. Nagai Tohoku-Gakuin Univ., Tagajo, Japan Ricoh Seiki Co., Develop. Center, Tokyo, Japan
      ABSOLUTE-HUMIDITY SENSING INDEPENDENT OF THE AMBIENT TEMPERATURE
    • 9.40 V. Székely, Cs. Márta, M. Rencz, Zs. Benedek, B. Courtois TU Budapest, Hungary TIMA Laboratory, Grenoble, France
      DESIGN FOR THERMAL TESTABILITY (DfTT) AND A CMOS REALIZATION
    • 10.00 W. Wójciak, A. Napieralski TU Lódz, Poland
      AN ANALOGUE TEMPERATURE SENSOR INTEGRATED IN THE CMOS TECHNOLOGY
    • 10.20 T. Kudoh, S. Ikebe, H. Sato, K. Komatsu, M. Kimura TERUMO Corp., Kanagawa, Japan Tohoku-Gakuin Univ., Tagajo, Japan
      HIGHLY SENSITIVE THERMISTOR BOLOMETER FOR A CLINICAL TYMPANIC THERMOMETER
    • 10.40 U.A. Dauderstädt, P.H.S. de Vries, R. Hiratsuka, P.M. Sarro Delft Univ. of Technology, The Netherlands Nippon Steel Corporation, Japan DIMES-ICP, Delft, The Netherlands
      SIMULATION OF A THERMAL ACCELEROMETER
  • 11.00-11.20 Coffee
  • 11.20-12.40 SESSION 2 Thermal Simulation
    Chair : V. Székely TU Budapest, Hungary
    • 11.20 A. Napieralski, G. Jablonski TU Lódz, Poland
      PYRTHERM FOR WINDOWS - USER FRIENDLY THERMAL CAD SOFTWARE
    • 11.40 J.L. Blanchard, S. Louage Zuken-Redac S.A., Les Ulis, France
      AN INTERACTIVE AND INTEGRATED THERMAL CHARACTERIZATION OF COMPONENT PLACEMENT
    • 12.00 A.J. Przekwas, S.D. Habchi CFD Research Corp., Huntsville, USA
      MULTI-SCALE SIMULATION OF ELECTRONICS THERMAL PACKAGING ETP AND SYSTEM COOLING
    • 12.20 K.O. Petrosjanc, I.A. Kharitonov, N.I. Rjabov, A.V. Panjukhin Moscow Univ. of Electronics and Mathematics, Russia
      SOFTWARE FOR SEMICONDUCTOR DEVICES, MONOLITH AND HYBRID IC's DESIGN AND SIMULATION
  • 12.50 Lunch
  • 14.20-16.00 SESSION 3 Packages Thermal Modelling and Investigation
    Chair : A. Napieralski TU Lódz, Poland
    • 14.20 L. Tielemans, G. Gregoris, L. De Schepper DESTIN N. V., Diepenbeek, Belgium Alcatel Espace, Toulouse, France Limburgs Univ. Centrum, Diepenbeek, Belgium
      THERMAL DEGRADATION OF POWER MODULES
    • 14.40 M. O'Flaherty, C. Cahill, K. Rodgers, O. Slattery NMRC, Cork, Ireland
      VALIDATION OF NUMERICAL MODELS OF CERAMIC PIN GRID ARRAY PACKAGES
    • 15.00 H. I. Rosten DELPHI - Flomerics Ltd., Surrey, United Kingdom
      A EUROPEAN-FUNDED PROJECT FOR THE DEVELOPMENT OF LIBRARIES AND PHYSICAL MODELS FOR AN INTEGRATED DESIGN ENVIRONMENT
    • 15.20 V.A. Koval, D.V. Fedasyuk State Univ. "Lviv Polytechnic", The Ukraine
      THERMAL SIMULATION OF THE SEMICONDUCTOR IC's : GENERAL AND PRACTICAL APPROACH
    • 15.40 L. Albo, A. Coello-Vera, P. Pipard Alcatel Espace, Toulouse, France
      THERMAL ANALYSIS OF MCM-V STACKS
  • 16.00-16.20 Coffee
  • 16.20-18.00 SESSION 4 Thermal Simulation
    Chair : V. Koval TU Lviv, The Ukraine
    • 16.20 B. Lanzendörfer SICAN GmbH, Hannover, Germany
      THERMAL ANALYSIS AND SIMULATION OF MCM-SI AND MICROMECHANIC COMPONENTS
    • 16.40 M. Furmánczyk, G. Jablónski, A. Napieralski, J. Pacholik TU Lódz, Poland
      THE 3D TRANSIENT THERMAL SIMULATION WITH ARBITRARY BORDER CONDITION
    • 17.00 K. Hofmann, J.M. Karam, V. Moleavin, T. Niculiun, B. Courtois, M. Glesner TH Darmstadt, Germany TIMA/TIMC, Grenoble, France Univ. Bucharest "Politechnica", Romania
      MODELLING AND SIMULATION OF THERMAL EFFECTS ON THE SYSTEM LEVEL
    • 17.20 T. Niculiu, K. Hofmann, M. Glesner Univ. Bucharest "Politechnica", Romania TH Darmstadt, Germany
      ANALOG HDL BASED THERMAL CIRCUIT SIMULATION FOR MICROSYSTEMS
    • 17.40 D. Agonafer, A. Free IBM, Poughkeepsie, NY, USA
      AN INTEGRATED SOLID MODEL BASED CFD MODELING METHODOLOGY FOR COMPUTER PACKAGING APPLICATIONS
  • 19.00 Dinner
  • 20.30 PANEL SESSION
    Chair : G. De Mey Univ. of Ghent, Belgium
    HOW BAD IS THERMAL EDUCATION OF ELECTRONICS ENGINEERS ?
    Introductory talk : G. De Mey, Univ. Ghent, Belgium
    MISUNDERSTANDINGS OF HEAT TRANSFER IN THE ELECTRONICS ENGINEERING COMMUNITY
    Panelists : D. Blackburn, A. Napieralski, V. Székely, C. Zardini
    NIST, Gaithersburg, USA, TU Lódz, Poland, TU Budapest, Hungary, IXL, Talence, France

26th September 1995

  • 8.30 INVITED TALK : T. Tarter AMD, Sunnyvale, USA
    FACING CHALLENGES IN MICROPROCESSOR COOLING ; PORTABLE POWER
  • 9.10-10.10 SESSION 5 Evaluation of Thermal Measurements
    Chair : D. Blackburn NIST, Gaithersburg, USA
    • 9.10 B Bocquet, D. Allal, Y. Leroy IEMN, Villeneuve d'Ascq, France
      THERMOMETRY OF LOSSY COPLANAR LINES BY MICROWAVE CORRELATION RADIOMETRY
    • 9.30 G. Oliveti, A. Piccirillo, P.E. Bagnoli CSELT, Torino, Italy Univ. Pisa, Italy
      ANALYSIS OF LASER DIODES THERMAL PROPERTIES WITH SPATIAL RESOLUTION BY MEANS OF T.R.A.I.T. METHOD
    • 9.50 V. Székely TU Budapest, Hungary
      A NEW EVALUATION METHOD OF THERMAL TRANSIENT MEASUREMENT RESULTS
    • 10.10 Introduction to the poster session Chair : M. Rencz TU Budapest, Hungary
  • 10.40-11.40 POSTER + Coffee
    • S. Rael, Y. Marechal, C. Schaeffer LEG/ENSIEG, St. Martin d'Heres, France
      A 3D ELECTROTHERMAL MODELLING FOR PARALLELED CHIPS
    • M. Mullins, R. Bayford, J. Butcher, A. van Putten MUMEC, London, United Kingdom
      EFFECTIVE 3D THERMAL AND ELECTRICAL SIMULATION OF SILICON THERMAL FLOW SENSORS WITH HSPICE BEHAVIOURAL MODELS
    • A. Csendes, Zs. Kohári TU Budapest, Hungary
      THERMAL INVESTIGATION OF MICROSTRUCTURES BY DIFFERENT SIMULATION AND MEASUREMENT TOOLS
    • W. Wójciak, A. Napieralski TU Lódz, Poland
      THE DISTANCE DEPENDENT METHOD FOR TEMPERATURE MEASUREMENT OF SINGLE HEAT SOURCE IN SEMICONDUCT - OR DEVICES - THE FIRST APPROACH
    • M. Kaluza, S. Delmas, E. Sicard, C. Garres TU Lódz, Poland INSA, Toulouse, France Matra Marconi Space, Toulouse, France
      DESIGN AND SIMULATION OF CMOS-COMPATIBLE INDUCTORS FOR THE POWER SUPPLY OF IMPLANTED THERMAL SENSORS
    • P. Godts, L. Camberlain, C. Machut, D. Leclercq IEMN, Villeneuve d'Ascq, France
      A NEW CONTACTLESS TEMPERATURE MICROSENSOR
    • L. Méchin, J.C. Villégier, P. Langlois, D. Robbes, D. Bloyet LETI-CEA, Grenoble, France GREYC, Caen, France
      THERMALLY ISOLATED YBaCuO AIR BRIDGES ON SILICON SUBSTRATES FOR HIGH PERFORMANCE BOLOMETERS
    • R.G.C. Artus Univ. of Reading, Berkshire, United Kingdom
      THE DESIGN AND THERMAL MANAGEMENT OF A VIRTUAL WAFER-SCALE MULTI-CHIP MODULE SYSTEM
    • B. Wiecek TU Lódz, Poland
      THERMAL MANAGEMENT IN SURFACE MOUNTED ICs
    • T. Ochi, T. Ogushi, R. Aoki Osaka Univ., Japan Mitsubishi Electric Corp., Hyogo, Japan
      DEVELOPMENT OF A HEAT PIPE THERMAL DIODE AND ITS HEAT TRANSPORT PERFORMANCE
    • M.J. Marongiu MJM Consulting Services, Naperville, IL,
      SOME COMPRESSIBLE FLOW ISSUES IN THE DESIGN OF USA MICRO CHANNEL COOLING SYSTEMS
    • M. Mermet-Guyennet, J.M. Paladel, P. Galliard, R. Billoud, T. Fromont, Y. Stricot CSTI, Lyon, France BULL, Les Clayes, France
      THERMAL MANAGEMENT OF TAB AND TBGA COMPONENTS IN AN AIR COOLED SUPERCOMPUTER
    • J. Bedmar, J.A. Puente, J.Pérez Oria UPM, Madrid, Spain Univ. Cantabria, Santander, Spain
      A TECHNIQUE FOR SOLVING THE THERMAL DISSIPATION PROBLEM IN FAST VLSI ELECTRONIC SYSTEMS
  • 11.40-13.00 SESSION 6 Thermography
    Chair : M. Glesner TH Darmstadt, Germany
    • 11.40 A. Csendes, V. Székely, M. Rencz TU Budapest, Hungary
      RESOLUTION, ACCURACY AND OTHER FEATURES OF LIQUID CRYSTAL THERMAL MAPPING
    • 12.00 M. Ashauer, J. Ende, H. Glosch, H. Haffner, K. Hiltmann Inst. für Mikro- und Informationstechnik, Villingen-Schwenningen, Germany
      THERMAL CHARACTERIZATION OF MICROSYSTEMS BY MEANS OF HIGH-RESOLUTION THERMOGRAPHY
    • 12.20 M. Grecki, J. Pacholik, B. Wiecek, A. Napieralski TU Lódz, Poland
      APPLICATION OF COMPUTER -BASED THERMOGRAPHY TO THERMAL MEASUREMENTS OF INTEGRATED CIRCUITS AND POWER DEVICES
    • 12.40 P. Dondon, J. Lauriou, C. Zardini IXL, Talence, France
      THERMAL TRANSIENT CHARACTERIZATION OF ELECTRONIC ASSEMBLIES BY INFRARED THERMOGRAPHY IN FAST LINE SCAN MODE
  • 13.00 Lunch
  • 14.30-16.10 SESSION 7 Electro-thermal Simulation
    Chair : M. Kimura Tohoku-Gakuin Univ., Tagajo, Japan
    • 14.30 V. Székely, A. Poppe, M. Rencz, A. Csendes, T. Kocsis TU Budapest, Hungary
      SELF-CONSISTENT ELECTRO- THERMAL SIMULATION : FUNDAMENTALS AND PRACTICE
    • 14.50 J. Litsios, B. Schmithüsen, W. Fichtner ETH-Zentrum, Zürich, Switzerland
      THERMAL MIXED MODE DEVICE AND CIRCUIT SIMULATION
    • 15.10 W. K. Chu, W. H. Kao Cadence Design Systems Inc., San Jose, CA, USA
      A THREE-DIMENSIONAL TRANSIENT ELECTRO- THERMAL SIMULATION SYSTEM FOR IC's
    • 15.30 M. Wilklund, S. Mattisson Lund Inst. of Technology, Sweden
      SIMULATION OF THERMAL EFFECTS IN INTEGRATED CIRCUITS USING STANDARD CIRCUIT SIMULATORS
    • 15.50 J. Ecrabey, L. Hebrard, J. Berger-Toussan, M. Le Helley LEAME, Ecole Cent. de Lyon, France
      A 3D MODEL FOR PACKAGES IN ELECTROTHERMAL SIMULATIONS OF INTEGRATED CIRCUITS
  • 16.10 End of session 7
  • 16.30 Buses leave (option A)
  • 16.30 Free discussion on Thermal Simulation (option B)

 

Proceedings, special issues of journals

Proceedings, Special issue of Microelectronics Journal, Special issue of the Journal Sensors and Actuators A-physical (ELSEVIER Science).

Informal Proceedings were available to attendees, based on papers provided by authors on a voluntary offer. Formal Proceedings are constituted by 2 Special issues of Journals. The Special issue of Microelectronics Journal (Vol. 28 No. 3, 1997) collected papers dealing with thermal simulation, measuring and monitoring of thermal states. The Special issue of the Journal Sensors and Actuators (Vol. A55 No. 1, 15 July 1996) includes papers dealing with thermal issues in microsystems.

 

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