From: Bernard COURTOIS [THERMINIC@imag.fr] Sent: 10 March 2006 15:35 To: THERMINIC@imag.fr Subject: THERMINIC 27-29 September 2006 - Nice, Cτte d’Azur, France - We apologize if you receive this email multiple time. Please, feel free to forward this message to interested people. Call for Papers ************************************** 12th International Workshop on Thermal Investigations of ICs and Systems - THERMINIC 2006 - 27-29 September 2006 Nice, Cote d'Azur, France ************************************** Sponsored by: - TIMA Labs Grenoble, France (CNRS - INPG - UJF) - CPMT - Components, Packaging and Manufacturing Technology Society - THERMINIC Workshops are a series of events to discuss the essential thermal questions of microelectronic microstructures and electronic parts in general. These questions are becoming more and more crucial with the increasing element density of circuits packaged together and with the move to nanotechnology. These trends are calling for thermal simulation, monitoring and cooling. Thermal management is expected to become an increasingly dominating factor of a system’s cost. The growing power dissipated in a package, the mobile parts of microsystems raise new thermal problems to be solved in the near future necessitating the regular discussion of the experts in these fields. Finally, there is an increasing need for accurate assessment of the boundary conditions used in the analysis of electronic parts, which requires a concurrent solution of the thermal behaviour of the whole system. This year THERMINIC will address in addition to the "traditional" thermal management problems, also stress and thermal-stress-related-reliability issues, both in micro- and opto-electronics fields. These issues, including various nanotechnology applications, are of significant importance and of high interest to the engineering community engaged in the field of thermal phenomens in "high-tech" systems. The Workshop is sponsored by the IEEE Components, Packaging, and Manufacturing Technology Society and TIMA Laboratory. Areas of interest The areas of interest include, but are not limited to, the following topics: • Thermal and Temperature Sensors • Thermal Simulation • Electro-thermal Simulation • Thermal Modelling and Investigation of Packages • Reliability Issues • High Temperature Electronics • Heat Transfer Education • Flow Visualisation Techniques • Turbulence Modelling in Complex Geometrics • Measurement of Thermal Properties • Acquisition and Analysis of Thermal data • Temperature Mapping • Novel and Advanced Cooling Techniques • Thermal Performance of Interconnects • Heat Transfer Enhancement • Validation of Thermal Software • Coupled (Thermo-mechanical, Thermo-optical, etc.) Effects • Defect and Failure Modelling • Thermal Stress: Theory and Experiment • Thermal Stress Failures: Prediction and Prevention • Reliability Evolution and Prediction • Multiphysics Simulation • Nanoengineering Issues • Nanotechnology Applications • Education. Technical Programme The programme will include oral talks, posters presentations, a panel discussion and invited talks given by prominent speakers. Invited talks will include: - Michael Pecht, CALCE Electronic Products and Systems Center, U. of Maryland, College Park, USA. - Ari Glezer, Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA. Tutorial A Tutorial will be offered on 27 September, prior to the Workshop. - Thermal Management in Practice: Sense, Nonsense, and Things that Go Wrong. Clemens Lasance, Philips Research Laboratories, Eindhoven, The Netherlands Robert Moffat, Stanford Univ., USA For many designers, real-life is more like hell than paradise. There is always a big discrepancy between the simplified textbook examples and the complexity encountered in practice. This is especially true in the thermal management of electronic parts and systems. This short course will address several topics, widely used, that cause trouble when trying to solve thermal problems in industry. • About the widespread misuse of correlations • CFD: todays' designer's delight, but... • Experimental errors: easy to make, easy to prevent • How to use an estimate of the uncertainty to improve the experiment Detailed information about the submission process will be made available on the THERMINIC Web page: http://tima.imag.fr/conferences/therminic/ Deadlines: Submission: 28 April 2006 Notification: 23 June 2006 Venue The Workshop will take place in the Boscolo Plaza Hotel which is located in Nice. Nice, located in the south of France, is the gem of the French Riviera: elegant, chic, popular and antique. A University town and the business hub of Provence, Nice sparkles with life all year round. Every form of entertainment is available in this pleasant city of France, while a rich cultural heritage fascinates visitors. We are just 100 mt from Nice's famous Place Massιna and the Promenade des Anglais, from exclusive downtown shopping, nightlife, and our private beach, The Ruhl Plage. The Boscolo Plaza Hotel is just a stone's throw from the historic Old Town of Nice with its bustling narrow streets dating back to medieval times, its many tempting food shops and restaurants and a growing number of artists' workshops and galleries. -- Bernard COURTOIS TIMA Labs / THERMINIC Workshop Tel: +33 4 76 57 46 15/22(secr.) 46 Avenue Felix Viallet Fax: +33 4 76 47 38 14 38031 Grenoble Cedex - France E-mail: THERMINIC@imag.fr http://tima.imag.fr/Conferences/THERMINIC/ --