Therminic 2001, At A Glance

7^th International Workshop on

THERMal INvestigations of ICs and Systems

plus a special
HALF-DAY ON DYNAMIC MEASUREMENTS

Sponsored by the IEEE Computer Society, Test Technology Technical Council and TIMA Laboratory in cooperation with the IEEE Components, Packaging, and Manufacturing Technology Society and with the IEEE Solid-State Circuits Society French Chapter.

Monday 24 September

9:30 Tutorials
A. Thermal Design Basics and Calculation of Air Cooling Limits
K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA
B. Resource Management in Thermal Design of compact Electronic Equipment
W. Nakayama, ThermTech International, Kanagawa, Japan

12:30 Lunch

14:00 Tutorials
A. Thermal Design Basics and Calculation of Air Cooling Limits
K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA
B. Resource Management in Thermal Design of compact Electronic Equipment
W. Nakayama, ThermTech International, Kanagawa, Japan

Tuesday 25 September

8:00 Registration

9:30 Welcome address

9:40 Invited talk High-Power Robust Semiconductor Electronics Technologies in the New Millennium

10:20 Session 1 Dynamic Compact Models

11:40 Break
12:00 Session 2 System Level Thermal Analysis

13:00 Lunch

14:30 Vendor's session

15:30 Session 3 Advances in Package Cooling Solutions-I

16:30 Break

16:50 Posters session

18.30 Cocktail

Wednesday 26 September

8:30 Invited talk The Use of H-Adiabatic in Electronics Cooling and other Applications

9:10 Session 4 Advances in Package Cooling Solutions-II

10:30 Break

10:50 Panel Dynamic compact modeling: Where are we and where to go ?

12:20 Lunch

13:50 Session 5 Static Measurements

15:50 Break

16:10 Session 6 Static Compact Models

19:00 Banquet "Le Ciel de Paris"

Thursday 27 September

9:00 Invited talk Emerging New Roles of CFD Simulation in Competitive Market Environment

9:40 Half-day on Dynamic Measurements

10:50 Break

11:10 Half-day on Dynamic Measurements, cont'd

12:10 Discussion

12:45 Lunch

14:15 Session 7 Thermal and Electro-Thermal Simulation

15:45 Closing remarks

Monday 24 September
9:30	Tutorials A. Thermal Design Basics and Calculation of Air Cooling Limits K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA B. Resource Management in Thermal Design of compact Electronic Equipment W. Nakayama, ThermTech International, Kanagawa, Japan
12:30	Lunch
14:00	Tutorials A. Thermal Design Basics and Calculation of Air Cooling Limits K. Azar, Advanced Thermal Solutions, Inc., Norwood, USA B. Resource Management in Thermal Design of compact Electronic Equipment W. Nakayama, ThermTech International, Kanagawa, Japan
Tuesday 25 September
8:00	Registration
9:30	Welcome address
9:40	Invited talk	High-Power Robust Semiconductor Electronics Technologies in the New Millennium
10:20	Session 1	Dynamic Compact Models
11:40	Break
12:00	Session 2	System Level Thermal Analysis
13:00	Lunch
14:30	Vendor's session
15:30	Session 3	Advances in Package Cooling Solutions-I
16:30	Break
16:50	Posters session
18.30	Cocktail
Wednesday 26 September
8:30	Invited talk	The Use of H-Adiabatic in Electronics Cooling and other Applications
9:10	Session 4	Advances in Package Cooling Solutions-II
10:30	Break
10:50	Panel	Dynamic compact modeling: Where are we and where to go ?
12:20	Lunch
13:50	Session 5	Static Measurements
15:50	Break
16:10	Session 6	Static Compact Models
19:00	Banquet "Le Ciel de Paris"
Thursday 27 September
9:00	Invited talk	Emerging New Roles of CFD Simulation in Competitive Market Environment
9:40	Half-day on Dynamic Measurements
10:50	Break
11:10	Half-day on Dynamic Measurements, cont'd
12:10	Discussion
12:45	Lunch
14:15	Session 7	Thermal and Electro-Thermal Simulation
15:45	Closing remarks

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