Location:             DoubleTree Hotel, San Jose, CA

                                            Dates:                  March 20 - 22, 2001 Symposium
                                                                        March 18-19, 2001 Short Course

8:00 - 8:15 AM      Symposium Opening and Welcome
                        General Chair: Bruce Guenin - Amkor Technology, Inc.

8:15 - 9:55 AM      Technical Session I: Simulation in Thermal Management
                        Session Chair: Bill Maltz - Electronic Cooling Solutions

        I-1:     Characterization of Laminar Jet Impingement Cooling in Portable Computer Applications
                  John R. Guarino and Vincent P. Manno - Raytheon Systems Co./Tufts University
        I-2:     Optimisation of Thermal Resistance in Quasi Monolithic Integration Technology (QMIT) Structure
                   M. Joodaki, G. Kompa, H. Hillmer, R. Kassing - Dept. of HF Engrg., Univ. of Kassel, Germany
        I-3:     Thermal Design of a Desktop Computer System Using CFD Analysis
                   C.W. Yu & R.L. Webb - Pennsylvania State Unviversity
        I-4:     Thermal Analysis of IGBT and Hybrid Power Modules with the Boundary Element Method
                  Zoubir Khatir & S. Lefebvre - INRETS, France
        I-5:     Dynamic Electro-Thermal Physically Based Compact Models of the Power Devices for Device and
                   Circuit Simulations
                  P.M. Igic, P.A. Mawby & M.S. Towers - University of Wales, Swansea

9:55 - 10:15 AM    Coffee Break

10:15 AM - 11:15 AM    Technical Session II: Novel Measurement Techniques
                                 Session Chair: Savithri Subramanyam - Texas Instruments

        II-1:     A High-Speed Thermal Imaging System for Semiconductor Device Analysis
                     A. Hefner, D. Berning, D. Blackburn, C. Chapuy & S. Bouche - National Institute of Standars & Technology
        II-2:     Design Issues of a Multi-Functional Intelligent Thermal Test Die
                     A. Poppe, G. Farkas, M. Rencz, Ys. Benedek, L. Pohl, V. Szekely, K. Torki, S. Mir, B. Courtois
                     - MicReD Ltd, Hungary
        II-3:     Thermoreflectance Imaging of Superlattice Micro Refrigerators
                    James Christofferson, et al - University of Californial, Santa Cruz

11:15 AM - 12 Noon    Technical Session III: Poster Session Preview
                              Session Chair: Seri Lee - Intel Corporation

        III-1     Thermal-Mechanical Measurement and Analysis of Advanced Thermal Interface
                     Material Construction
                     Farhad Raiszadeh - INCEP Technologies, Inc.
        III-2     Fully Physical, Time-Dependent Thermal Modeling of Complex 3-Dimensional Systems for Device
                     and Circuit Level Electro-Thermal CAD
                     W. Batty, et al - Univ. of Leeds, UK/North Carolinga State Univ.
        III-3     Revising the Goals and Means for the Base-to-Air Cooling Stage for Semiconductor Heat Removal -
                     Experiments and Their Results
                     V.S. Travkin, K. Hu, M.Rizzi & I. Catton - University of California, Los Angeles
       III-4      Thermal Management for High Performance Integrated Circuits with Non-Uniform Chip Power
                     Considerations
                     T.D. Yuan, Bor Zen Hong, Howard Chan & Li-Kong Wong - IBM
        III-5     Thermal Comparison of Plate, Extrusion Heat Sink, and Skive Heat Sink
                     Michael C. Yang - Motorola
        III-6     The Development of a Natural Graphite Heat Spreader
                     J. Norley, J.-W Tzeng, G. Getz, J. Klug & B. Fedor - Graftech Inc.
        III-7     Thermal Characterization of Fan-Heat Sink Systems in Miniature Axial Fan and Micro Blower Airflow
                     C.K. Loh, Dan Nelson & D.J. Chou - Enerton
        III-8     Multi-Objective PLacement Optimization of Power Electronic Devices on Liquid Cooled Heat Sinks
                     D. Gopinath, Y.K. Joshi, S. Azarm - CALCE Electronic Products and Systems Consortium/University of Maryland

12:15 - 1:30 PM    Luncheon
                            Thermal Management Challenges of Third Generation Telecommunication Devices
                           Speaker: Jukka Rantala - Nokia Research Center

1:30 - 6:00 PM    Exhibits Open
2:00 - 5:15 PM    Vendor Workshops
1:30 - 3:00 PM     Poster Session
6:15 - 7:15 PM    Dinner

7:30 - 9:00 PM     Evening Workshop - Panel Session
                            Optoelectronic Packaging: Thermal Aspects and Challenges
                           Panel Chair:    Jeff Montgomery - Electronicast

Wednesday - March 21, 2001

 8:00 AM    Conference Announcements

 8:15 - 10:15 AM     Technical Session IV: Advances in Compact Models
                            Session Chair: Wendy Luiten - Philips

    IV-1     The European Project PROFIT: Prediction of Temperature Gradients Influencing the Quality of
                 Electronic Products
                Clemens J.M. Lasance - Philips Research Laboratories
    IV-2     Creating Compact Models Using Standard Spreadsheet Software
                Gerhard Noebauer - Infineon Technologies
    IV-3     A Simple Analytic Method for Converting Standardized IC-Package Thermal Resistances (q_JA, q_JC)
                 into a Two-Resistor Model (q_JB, q_JT)
                Yaniv Tal & Aharon Nabi - Heat and Mass Transfer Group, RAFAEL, Israel
    IV-4     A Generic Method for Thermal Multiport Model Generation of IC Packages
               M. Renccz & V. Szekely - MicRed

10:15 - 10:35 AM    Coffee Break

10:35 AM - 12:15 PM    Technical Session V: Active Cooling Technology
                                 Session Chair: Alan Claassen - IBM

    V-1     An Electroknetic Closed-Loop Micro Cooler for High-Power VLSI Chips
              Jiang, Loo, Zang, Zhang, Banerjee, Zhou, Santiago, Kenny & Goodson - Stanford University
    V-2     Current and Future Miniature Refrigeration Cooling Technologies for High Power Microelectronics
              P.E. Phelan/V. Chiriac & T.-Y. Lee - Arizona State University/Motorola
    V-3     Microprocessor-Based Adaptive Thermal Control for an Air-Cooled Computer CPU Module
              Carin Lundquist & Van P. Carey - University of California, Berkeley
    V-4     Tool for Fast Modeling Active Heat Sinks
              Piotr Dziurdzia & Andrzej Kos - University of Mining & Metallurgy, Poland
    Panel Discussion    Thermal Modeling Challenges/Issues
              Panel Chair: Roger Schmidt - IBM
               Panelists:     Clemens Lasance - Philips Research
                                    Bill Maltz - Electronic Cooling Solutions
                                    (other panelists to be announced)

12:20 - 1:30 PM    Luncheon
                                "The Arte of Fyshing with an Angle - in the 21st Century"
                              Speaker: Dr. Robert J. Moffat - Stanford University/Moffat Thermosciences, Inc.

1:30 - 6:00 PM     Exhibits Open
2:00 - 5:15 PM     Vendor Workshops
5:15 - 6:30 PM     Vendor Reception

Thursday - March 22, 2001

8:00 AM              Conference Announcements

8:15 - 9:00 AM      Significant Contributor Thermi Award Presentation
                            Capita Selecta in Electronics Cooling
                           Clemens J.M. Lasance - Philips Research Laboratories, The Netherlands

9:00 - 10:00 AM   Technical Session VI: Thermal Enhancement Technology
                         Session Chair: Prof. Alfonso Ortega - University of Arizona

    VI-1     Design Considerations of High Heat Flux Heat Pipe Evaporators
                Jon Zuo - Thermacore
    VI-2     Biporous Heat Pipes for High Power Electronic Device Cooling
                Jinliang Wang & Ivan Catton - University of California, Los Angeles
    VI-3     The Study of Micro-Fins Heat Sink for Electronic Cooling Application
                H.-C. Chien, C.-Y. Wang, M.-H. Tseng & C.-H. Chu - Industrial Technology Research Institute, Taiwan

10:00 - 10:20 AM    Coffee Break

10:20 AM - 12:00 Noon     Technical Session VII: Component Thermal Performance
                                    Session Chair: Paul Hundt - Texas Instruments

    VII-1     Effect of Flag Design on Thermal Performance of PBGA Packages
                 Bennett Joiner - Motorola
    VII-2     Linear Models for Temperature and Power Dependence of Thermal Resistance in Si, InP and
                  GaAs Substrate Devices
                 David J. Walkey, Tom J. Smy, Michael Maliepaard, ?Tom MacElwee - Carleton University, Canada
    VII-3     Analysis of Manifold Fluid Networks for Cooling Air and Liquid Flow-Through Modular Electronics
                 Scott T. Johnson - Raytheon Sensors and Electronics Systems
    VII-4     Temperature Sensors Placement Stategy for Fault Diagnosis in Integrated Circuits
                 Piotr Bratek & Andrzej Kos - University of Mining and Metallurgy, Poland
    VII-5     Wiring Statistics and Printed Wiring Board Thermal Conductivity
                  Richard D. Nelson - Teravicta Technologies

12:15 - 1:30 PM    Awards Luncheon
 

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