S. MOREAU, R. LEROY, T. LEQUEU, R. JERISIAN, "Comparison of Lifetime Predictions with 3-D Finite Element Model of Power Electronics Devices", EuroSIME'2005, International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics a
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Titre : S. MOREAU, R. LEROY, T. LEQUEU, R. JERISIAN, Comparison of Lifetime Predictions with 3-D Finite Element Model of Power Electronics Devices, EuroSIME'2005, International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems, Berlin, Germany, April 17-20, 2005, pp. 430-435.

Cité dans : [CONF077] EuroSIME, International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems, février 2005.
Cité dans : [DIV457]  EuroSIME'2005, International Conference on Thermal & Mechanical Simulation and Experiments in Micro-electronics and Micro-systems, Berlin, Germany, April 17-20, 2005.
Cité dans : [DATA033] Liste des publications de Thierry LEQUEU et activités de recherche, janvier 2018.
Auteur : S. Moreau (a),(b)
Auteur : R. Leroy (c)
Auteur : T. Lequeu (a)
Auteur : R. Jérisian (a)

Source : Proceedings of the 6th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments n Micro-Electronics and Micro-Systems, EuroSimE 2005.
Lieu : Berlin, Germany
Date : 18-20 April 2005
Pages : 430 - 435
Lien : mailto:stephane-nicolas.moreau@st.com
Lien : private/MOREAU7.pdf - 6 pages, 439 ko.
Adresse : (a) Université F. Rabelais de Tours, L.M.P., 16 rue Pierre et Marie Curie, BP 7155, 37071 Tours cedex 2, FRANCE
Adresse : (b) STMicroelectronics, 16 rue Pierre et Marie Curie, BP 7155, 37071 Tours cedex 2, FRANCE
Adresse : (c) Université F. Rabelais de Tours, L.M.R., 7 rue Marcel Dassault, 37204 Tours cedex 3, FRANCE

Abstract :
Reliability tests and simulated results on medium power components are discussed in this paper. This study is based on statistical data coming from Thermal Cycling Tests (TCT, air-air test) and Thermal Shock Tests (TST, liquid-liquid test), are correlated with information coming from failure analysis and compared to results issued from 3-D Finite Element (FE) analysis.


Bibliographie

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