M. QUIRK, J. SERDA, "Semiconductor Manufacturing Technology", 1st Edition, 2001, 666 pages.

M. QUIRK, J. SERDA, "Semiconductor Manufacturing Technology", 1st Edition, 2001, 666 pages. Copyright - [Précédente] [Première page] [Suivante] - Home

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Titre : M. QUIRK, J. SERDA, Semiconductor Manufacturing Technology, 1st Edition, 2001, 666 pages.

Auteur : Michael Quirk - Staktek, Inc.
Auteur : Julian Serda - Advanced Micro Devices

Stockage : Bibliothèque LMP
Fiche : LMP2001-xx
Référence : 2001-xx/LMP
Date_d'achat : 16 mars 2001
Prix_H.T. : 431.93

Date : 2001
Pages : 1 - 666 pages
ISBN : 0-13-081520-9 (Hardback)
Site : http://www.awl-he.com/titles/0130815209.html

Description : For the introductory course in Semiconductor Manufacturing Technology.

This text introduces the terminology, concepts, processes,
products, and equipment commonly used in the manufacture of
ultra-large-scale integrated (ULSI) semiconductors. The
book provides helpful, up-to-date technical information
about semiconductor manufacturing and strikes an effective
balance between the process and equipment technology found
in wafer fabrications.

Key Features

* Cutting edge of semiconductor technology - Offers
future and practicing technicians the latest technical
information, including sections on copper
interconnect; dual damascene process for
metallization; deep UV sub-quarter-micron
photolithography (.18 micron and below); low-k
dielectric processing; chemical mechanical
planarization; and more.
- Keeps students abreast of the most recent
technological tools and techniques, developing their
abilities to understand and use the same or similar
tools in their own careers.
* Process requirement vs. equipment capability- Explains
the technical relationship between these two areas,
revealing the tradeoffs between the potential
performance of equipment and the process parameters
required for optimal manufacturing.
- Allows students to assess the viability of
integrating new technology into an existing process a
crucial skill in the professional world.
* Comprehensive model of manufacturing process (Ch. 9) -
Process chapters with a CMOS process model using
diagrams that describes the major
semiconductor-manufacturing processes in a
comprehensive overview.
- Forms a basis for students to understand how the
different process technologies are related, fostering
a deeper understanding of semiconductor manufacturing.
* In-depth review of copper metallization and low-k
dielectric (Chs. 11-12) - Covers both the traditional
approach (i.e., aluminum metallization with silicon
dioxide dielectric) and the latest technologies,
including the new processing techniques (e.g., dual
damascene processing) and new equipment.
- Briefs students on the latest technological advances
that will provide up to a 30% increase in chip
performance.
* Full chapter on chemical-mechanical planarization
(CMP) (Ch. 18) - Discusses equipment and process
technology, showing how CMP has facilitated the
development of multi-layer metallization.
- Engages students in one of the most important
equipment developments in the 1990s for semiconductor
manufacturing.
* Equipment and process troubleshooting (Chs. 10-18) -
Presents a section devoted to equipment and process
troubleshooting within each of the process chapters.
- Offers students practical advice for troubleshooting
advanced wafer manufacturing processes.
* Instructional support in each chapter - Presents
chapter summaries, lists of key terms, and
end-of-chapter questions.

1. Introduction to the Semiconductor Industry.
2. The Characteristics of Semiconductor Materials.
3. Device Technologies.
4. Silicon and Wafer Preparation.
5. Chemicals in Semiconductor Fabrication.
6. Contamination Controls in Wafer Fabs.
7. IC Fabrication Metrology.
8. Gas Controls in the Process Chamber.
9. IC Fabrication Process Review.
10. Oxidation.
11. Deposition.
12. Metallization.
13. Photolithography: Surface Prep to Soft Bake.
14. Photolithography: Alignment and Exposure.
15. Photolithography: Development through Develop Inspect.
16. Etch.
17. Doping.
18. Planarization.
19. Wafer Sort.
20. Assembly and Packaging.
Appendices.

PREFACE

This text started with a simple premise: as instructors, we
need to teach relevant microchip technology to students and
employees in semiconductor manufacturing. Unfortunately, in
the semiconductor industry, changes in technology are
measured in months, not years. Our challenge was to write a
relevant book that would not be outdated by the time it was
published. With that in mind, we researched the material
and applied ourselves to writing the chapters and creating
the artwork. Following the aggressive pace of Moores law,
the technical material in our book is at most only 18 to 24
months old. This permits us to keep abreast of the changing
technology nodes swirling through the semiconductor
industry.

This text is written for students in two-year and four-year
technology programs at community colleges and universities.
The text will also be a practical reference as well as a
standard text in corporate and technical training classes.
Students are expected to have an understanding of high
school chemistry, physics, and math. Chapters are organized
around the broad technologies applicable to semiconductor
manufacturing.

ORGANIZATION OF THE TEXT

Our goal is to accomplish three objectives:

1. Help technology students grasp the fundamental
technologies used in manufacturing semi conductor
devices.
2. Present some of the many challenges in microchip
fabrication.
3. Instill in the reader an appreciation of the
conceptual simplicity of semiconductor manufacturing.

All fundamental technical information relevant to
semiconductor manufacturing is first presented in Chapters
1 to 8. Chapter 9 presents a process model overview with a
general flowchart that links the major areas in a wafer
fab. Chapters 10 to 19 cover each of the major processes in
the fab. Finally, Chapter 20 provides an overview of the
back-end process for IC assembly and packaging. The content
in the process chapters (Chapters 10 to 20) addresses
critical process technology, followed by the various
equipment designs needed to support this technology. Each
process chapter concludes with a summary of quality
measures and troubleshooting issues to familiarize the
student with the practical, day-to-day challenges
encountered during wafer fabrication.

The latest technologies for sub-0.25 um processing are
covered in detail. This includes chemical mechanical
planarization (CMP), shallow trench isolation (STI),
chemically amplified deep UV photoresists, step-and-scan
systems, copper metallization with dual damascene, and the
widespread move to process integration with cluster tools.
Throughout the text, we explain all process and equipment
technology in light of the long history of change in the
industry. Early tools and processes are described to
clarify the development of current technology. In some
cases, the linkage between the latest equipment and earlier
tools is obvious, while in other instances the change is
dramatic.

Professors, students, and other readers of this book can
send comments or questions about this text to the authors
at the following website: http://www.smtbook.com. We look
forward to any exchange of information that can help
advance semiconductor manufacturing education.

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Key Features

Contents

PREFACE

ORGANIZATION OF THE TEXT