Session #4: Reliability Test Structures
John Conley, DRC & Homi Nariman, AMD, Co-chairs

RTS-1

"ESD Technology Benchmarking for Evaluation of Electrostatic Discharge Robustness of CMOS Technologies," S. Voldman of IBM Microelectronics, Essex Junction, VT; W. Anderson of Digital Equipment Corporation, Shrewsbury, MA; R. Ashton of Lucent Technologies, Orlando FL; M. Chaine of Texas Instruments Inc., Houston, TX; C. Duvvury of Texas Instruments Inc., Dallas, TX; T. Maloney of Intel Corp., Santa Clara, CA; and E. Worley of Rockwell Semiconductor Systems, Newport Beach, CA

RTS-2

"Non-Contact In-Line Monitoring of Plasma-Induced Latent Damage," Tim Turner and Steve Weinzierl of Keithley Instruments, Cleveland, OH

RTS-3

"Monitoring Charging in High Current Ion Implanters Yields Optimum Preventive Maintenance Schedules and Procedures," Henry Gonzalez, Steven Reno, Cleston Messick of Fairchild Semiconductor, West Jordan, UT; Wes Lukaszek of Wafer Charging Monitors, Woodside, CA; Thomas Romanski of Eaton Corporation, Tempe, AZ

RTS-4

"Characterizing Electron Shower with CHARM-2 wafers on Eaton NV-8200P Medium Current Ion Implanter," Steve Reno, Henry Gonzalez, and Cleston Messick of Fairchild Semiconductor, West Jordan, UT, Wes Lukaszek of Wafer Charging Monitors, Woodside, CA; David A. St. Angelo, Klaus Becker and Bobby Rogers of Eaton Corporation, Austin, TX