Next Generation Imaging

This tutorial will focus on the intrinsic and extrinsic defects in current and planned semiconductor package technologies that require imaging techniques to fault isolate and identify failure mechanisms prior to destructive analysis. . The techniques that will be discussed are x-ray radiography/topography, scanning acoustic microscopy, scanning squid microscopy, time domain reflectometry, thermal and terahertz imaging. These tools and techniques will be discussed from the point of view of current capability and limitations and the general direction needed for future capability that is consistent with semiconductor packaging trends.

Gay Samuelson

Gay Samuelson holds a M.S. and Ph.D. in molecular biology from the University of Wisconsin. She has been an engineering manager at Intel for 14 years running an analytical laboratory that supports package development at the Chandler facility. Prior to that she managed hybrid assembly of pacemakers at Micro-Rel, a division of Medtronics. Prior to that Gay worked 10 years at Motorola in liquid crystal display technology, thin film characterization and finally photovoltaic development and manufacturing.