Article : [DATA037]

Info : COMPENDEX Answer Number 40 - 22/02/2000

Titre : Proceedings of the 10th IEEE Semiconductor Thermal Measurement and Management Symposium.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Title : Proceedings of the 10th IEEE Semiconductor Thermal Measurement and Management Symposium.
Location : San Jose, CA, USA
Date : 01 Feb 1994-03 Feb 1994
Info : Organization IEEE; Components, Packaging, & Manufacturing Technology (CPMT) Society
Source : Proceedings - IEEE Semiconductor Thermal Measurement & ManagementSymposium 1994.Publ by IEEE, IEEE Service Center, Piscataway, NJ, USA.
Pages : 0 180
CODEN : PITSE2
Meeting_Number : 20532
Document_Type : Conference Proceedings
Treatment_Code : Experimental; Theoretical
Language : English
Vers : 18 papiers

Abstract :
This conference proceedings contains 18 papers on methods of cooling
and enhancing the thermal performance semiconductor devices.Topics
discussed include the thermal performance of air-cooled hybrid heat
sinks, the thermal performance of electronic components in natural
convection cooling, thermal enhancement of integrated circuit
packages, the effect of printed circuit card conductivity on the
thermal performance of surface mount electronic packages, advanced
micro air cooling for high-density packaging, thermal management of
silicon-based multichip modules, the use of radial jet reattachment
nozzles as active sinks for electronic component boards, liquid
cooling performance of a 3-D multichip module and heat sink, an
evaluation of alternative cooling techniques for TAB packages,
evaporation heat transfer in the cooling of high-power electronics,
GaAs MMIC thermal modeling for channel temperatures in accelerated
life test fixtures and microwave modules, the steady-state surface
temperature for a general multilayer structure, and a model for
thermal fatigue of large-area adhesive joint between materials with
dissimilar expansion.

Accession_Number : 1994(36):3077

18 papiers

GUENIN, B.M.
TRANSIENT THERMAL MODEL FOR THE MQUAD MICROELECTRONIC PACKAGE
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

SIEGAL, B.; BERG, M.
AN EFFECTIVE ALTERNATIVE FOR MARGINAL THERMAL IMPROVEMENTS OF
SEMICONDUCTOR DEVICES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

EDWARDS, D.; MING HWANG; STEARNS, B.
THERMAL ENHANCEMENT OF IC PACKAGES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

BJORNEKLETT, A.; TUHUS, T.; KRISTIANSEN, H.
A MODEL FOR THERMAL FATIGUE OF LARGE AREA ADHESIVE JOINTS
BETWEEN MATERIALS WITH DISSIMILAR THERMAL EXPANSION
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

MCMAYE, F.
EVALUATION OF ALTERNATIVE COOLING TECHNIQUES FOR TAB PACKAGES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

MOK, L.S.
THERMAL MANAGEMENT OF SILICON-BASED MULTICHIP MODULES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

SOFIA, J.W.
ANALYSIS OF THERMAL TRANSIENT DATA WITH SYNTHESIZED DYNAMIC
MODELS FOR SEMICONDUCTOR DEVICES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

GROMOLL, B.
ADVANCED MICRO AIR-COOLING SYSTEMS FOR HIGH DENSITY PACKAGING
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

KRISTIANSEN, H.; FALLET, T.; BJORNEKLETT, A.
A STUDY ON THE EVAPORATION HEAT TRANSFER IN THE COOLING OF HIGH
POWER ELECTRONICS
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

CHAPMAN, C.L.; LEE, S.; SCHMIDT, B.L.
THERMAL PERFORMANCE OF AN ELLIPTICAL PIN FIN HEAT SINK
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

AZAR, K.; PAN, S.S.; PARRY, J.; ROSTEN, H.
EFFECT OF CIRCUIT BOARD PARAMETERS ON THERMAL PERFORMANCE OF
ELECTRONIC COMPONENTS IN NATURAL CONVECTION COOLING
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

ALBERS, J.
AN EXACT SOLUTION OF THE STEADY-STATE SURFACE TEMPERATURE FOR A
GENERAL MULTILAYER STRUCTURE
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

COSLEY, M.R.; MARONGIU, M.J.
STUDIES ON THE USE OF RADIAL JET REATTACHMENT NOZZLES AS ACTIVE
HEAT SINKS FOR ELECTRONIC COMPONENT BOARDS
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

WILSON, J.; DECKER, K.
GAAS MMIC THERMAL MODELING FOR CHANNEL TEMPERATURES IN
ACCELERATED LIFE TEST FIXTURES AND MICROWAVE MODULES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

VOGEL, M.R.
LIQUID COOLING PERFORMANCE FOR A 3-DIMENSIONAL MULTICHIP MODULE
AND MINIATURE HEAT SINK
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

VOGEL, M.R.
THERMAL PERFORMANCE OF AIR-COOLED HYBRID HEAT SINKS FOR A LOW
VELOCITY ENVIRONMENT
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

SHAUKATULLAH, H.; GAYNES, M.A.
EXPERIMENTAL DETERMINATION OF THE EFFECT OF PRINTED CIRCUIT CARD
CONDUCTIVITY ON THE THERMAL PERFORMANCE OF SURFACE MOUNT
ELECTRONIC PACKAGES
SEMICONDUCTOR THERMAL MEASUREMENT AND MANAGEMENT SYMPOSIUM,
1994. SEMI-THERM X., PROCEEDINGS OF 1994 IEEE/CPMT 10TH ( 1994 )

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