June, 11-12, 2002 in Bremen/Germany

More Details (Conference-Database)

Chairmen Conference Focus Conference Topics Who should attend International Scientific Committee ACTUATOR 2002 Chairmen   General Chairman J. Daan van Wyk, National Science Foundation Engineering Research Center for Power Electronic Systems (USA) Vice General Chairman       Leo Lorenz, Infineon Technologies, München (D) Technical Chairman Dieter Silber, University of Bremen (D) Conference Focus   The next two decades in the 21st century will be driven by energy savings intelligent energy management, power quality on a system miniaturization at a high level of reliability. Power electronics in vehicles as well as waking on the mains is controlling the energy flow from the source to the load and such determining to a great extend the intelligence in power conversion and energy saving. The high technological level achieved in monolithic and hybrid system integration along with new power semiconductor concepts and packaging ideas on system miniaturization and the reliability issue. The CIPS (Conference on Integrated Power Systems) is focussing on three Conference Topics   First part: Hybrid or monolithic integrated power electronic systems in automotive applications What needs exist for further monolithic or hybrid integration for different areas of application? What special requirements exist in areas of high quantity, particularly in automobile and white goods applications? What limitations arise for further integration for application specific designs in the area of low quantity? Which levels for autonomous "intelligence" and which types of sensors would be suitable for integrated power electronic systems? What requirements exist for interfaces? Which technologies are expected for future monolithic power integration? What will be the role of "silicon-on-insulator (SOI)"? Which other additional functions (cooling, inductive and capacitive components) will be integrated in future power modules? Which types of power devices will succeed in power integrated circuits and modules for different voltage levels? How do we estimate the effective penetration of CAD and simulation tools, and what further developments are required? Cost effective partitioning in embedded power units Second part: Integration of power electronic systems (mechatronics integration) in medium and low power motor drive units. Home appliance systems are denoted a special focus How should the different motor types (B-DC, SRM, IM) be chosen for different areas of applications? What power electronic system developments are required for increasing the integration levels of these drive concepts? What new reliability aspects arise from integration of power electronics into motors (temperature, vibrations)? What packaging technologies are required for motor integration? What is the potential for higher efficiency of different motor types? Will developments in the "white goods" range become formative for power electronics and drive integration? Which is the upper power limit for such integrations? Embedded power systems at high voltage applications (< 600 V) Third part: Integration of power electronic systems at high power densities What system packaging concepts are suitable for high power density DC/DC converters Assembly ideas for high current low on state losses in converter topologies High voltage integration in AC/DC converter topologies (driving ICs and monolithic system integration) Concepts for extreme low voltage power supply (Vout < 2,5V) Intelligent power management for system power supplies (motherboards, telecom, etc.) Who should attend   The conference will be a technical and scientific forum for engineers engaged in System development Component development Research Organized by   The conference is organized by ETG, the Power Engineering Society within VDE, sponsored by IEEE Industrial Application Society (IAS) und Power Electronic Society (PELS) Bremen Center of Mechatronics (BCM), Microsystem Center Bremen (MCB) (University of Bremen) VDE/VDI Society Microelectronics, Micro- and Precision Engineering (GMM) Infineon Technologies AG, Munich Power Electronics Europe (PEE), Munich VDE, the Association for Electrical, Electronic & Information Technologies is one of the largest technical and scientific associations in Europe with more than 35 000 members. Sponsorship In order to promote your organization become a sponsor of CIPS 2002 - International Conference on Integrated Power Systems. Please contact the VDE Conference Office (address see next page). International Scientific Committee   Amaratunga, GehanA.J. University of Cambridge (GB) Avenwedde, Josef Miele (D) Binder, Andreas University of Darmstadt (D) De Doncker, R.W. University of Aachen (D) Efland, Taylor Texas Instruments (USA) Fujihira, Tatsuhiko Fuji Electric (JP) Gabriel, Rupprecht D-Tech (D) Hower, Phil Texas Instruments Unitrode (USA) Jaecklin, André (CH) Jäger, Ulrik Danfoss (DK) Kawakami, Jonzou Hitachi (JP) Kiel, Edwin Lenze (D) Lorenz, Leo Infineon Technologies (D) März, Martin Fraunhofer Institute (D) Melbert, Joachim University of Bochum (D) Mutschler, Peter University of Darmstadt (D) Mori, Satoshi Melco (D) Nakagawa, Akio Toshiba (JP) Piepenbreier, Bernhard University of Erlangen (D) Reniero, Erio M. Elektrolux (I) Schmid, Eberhard Bosch (D) Schröder, Dirk University of Munich (D) Shibib, Ayman Agere Systems (USA) Silber, Dieter University of Bremen (D) Sittig, Roland University of Braunschweig (D) Stoisiek, Michael University of Erlangen (D) Stölting, Hans-Dieter University of Hannover Tadano, Hiroshi Toyota Central (JP) Thomas, Bernhard A. DaimlerChrysler (D) Tursky, Werner Semikron (D) Vogt, Holger Fraunhofer Institute (D) Wagner, Armin BMW (D) Wick, Albert Siemens (D) Williams, Richard K. Advanced Analogic Techn. (USA) Wolfgang, Eckhard Siemens (D) ACTUATOR 2002   In parallel to CIPS 2002, the conference ACTUATOR 2002 will take place in the same congress center. Further information: E-Mail: actuator@messe-bremen.de Internet: http://www.actuator.de

ETG 11/2001