Article : [ART503]

Info : REPONSE 892, le 29/03/2004.

Titre : Reliability investigation of thermal stress/fatigue failure in multilayer interconnection boards (Final Technical Report Mar 1969-May 1970).

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.

Info : organization : IBM Corp., Owego, NY, USA
Number of Report
RADC-TR-70-192; AD-714702
Number of Contract
F30602-69-C-0192
Number of Report
RADC-TR-70-192; AD-714702

Source : Oct. 1970. 103 pp. Availability: NTIS, Springfield, VA 22151, USA
Document_Type : Report
Treatment_Code : Experimental
Info : Country of Publication : United States
Language : English
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Abstract :
Results are reported on the failure mechanisms of multilayer interconnection boards subjected to long-term temperature-cycling tests. The underlying failure process, consisting of low-cycle copper fatigue and leading to circuit open due to fracture was found to occur at different rates and in different locations as a function of: (1) MIB design geometry and material parameters; (2) manufacturing process parameters; and (3) temperature cycling test profile values. Of particular interest is the presentation of comparative test results PTH construction provides somewhat greater resistance to thermal fatigue than does etched-back PTH construction. Results are also given for comparative tests on early-vintage MIBs fabricated using polyimides materials and fluoroborate-copper PTH plating.

Accession_Number : 1971:294659 INSPEC

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