L.R. FOX, J.W. SOFIA, M.C. SHINE, "Investigation of solder fatigue acceleration factors", IEEE Transactions on Components, Hybrids, and Manufacturing Technology, June 1985, Vol. CHMT-8, No.2, pp. 275-282.
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Titre : L.R. FOX, J.W. SOFIA, M.C. SHINE, Investigation of solder fatigue acceleration factors, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, June 1985, Vol. CHMT-8, No.2, pp. 275-282.

Cité dans : [DATA035] Recherche sur les mots clés thermal + fatigue + semiconductor et reliability + thermal + cycle, mars 2004.
Cité dans :[SHEET344]
Auteur : Fox, L.R.
Auteur : Sofia, J.W.
Auteur : Shine, M.C. (Digital Equipment Corp., Andover, MA, USA)

Source : IEEE Transactions on Components, Hybrids, and Manufacturing Technology
Date : June 1985
Volume : CHMT-8
Numéro : 2
Pages : 275 - 282
Références : 24 refs.
Price : CCCC 0148-6411/85/0600-0275$01.00
ISSN : 0148-6411
Conference: IEEE CHMT Symposium. Tokyo, Japan, 1-3 Oct 1984
Sponsor(s): IEEE; Inst. Electron. & Commun. Eng. Japan; Inst. Electr. Eng. Japan; et al
Document_Type : Conference Article; Journal
Treatment_Code : Experimental
Info : Country of Publication : United States
Language : English
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Abstract :
Solder fatigue was investigated experimentally for effects of the strain loading waveform in isothermal mechanical fatigue, and frequency and strain range in true thermal cycling. Rapid strain loading followed by a long hold period at constant strain was found to be very damaging compared to constant rate cycling at the same peak amplitude and period. Thermal cycle fatigue data showed a stronger dependence on cycle period and weaker dependence on strain range than reported results in isothermal mechanical fatigue. Implications of the experimental findings are discussed with regard to solder joint fatigue and accelerated life testing of leaded chip carriers. A simple finite element model of a 68 post molded leaded chip carrier was analyzed to examine expected stress loading of the solder joints under typical operating conditions. Transient thermal stress loading and low stress creep of the solder joint are discussed in light of this model and known creep properties of the solder. It is shown that during typical operating cycles, the total creep strain can account for the majority of plastic or nonrecoverable strain.

Accession_Number : 1986:2571199 INSPEC

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