"Thermal-cycle tests: help !", 2000.
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Article : [ART199]

Info : REPONSE 25 © 2002 IEE, le 06/05/2002.

Titre : Thermal-cycle tests: help !, 2000.

Cité dans : [DIV334]  Recherche sur les mots clés power cycling of power device, mai 2002.
Auteur : Clifford, T. (Lockheed Martin, Sunnyvale, CA, USA)

Source : Circuits Assembly (Sept. 2000) vol.11, no.9, p.62, 64, 66, 68, 70. 0 refs.
Published : Miller Freeman
Price : CCCC 1054-0407/2000/$2.00+0.25
ISSN : 1054-0407
SICI : 1054-0407(200009)11:9L.62:TCTH;1-D
Document_Type : Journal
Treatment_Code : Practical
Info : Country of Publication : United States
Language : English
Stockage :
Switches :
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Abstract :
Accelerated thermal-cycle tests are run to predict the life of solder
joints. Thermal-cycle tests are expensive and difficult, but necessary.
Developers need statistically sound results to make crucial decisions, and
buyers need credible and understandable information before a purchase.
Literature and marketing Web sites are filling with thermal-cycle data
that are often questionable due to the wide range of test specimens,
conditions and the scarcity of details. Not every detail can be reported,
as certain details could be proprietary. However, test protocols and basic
facts, such as components and substrates, test conditions, failure
definition and detection, data reduction and metrics, must be reported.
When performing thermal cycle tests and using the data collected,
standardized test conditions should be implemented, and systematic
reporting of testing details should be used. This article emphasizes
solder connections from package to PCB, but the comments also apply to
interconnects within the package, to power-cycling tests, and to any life
test measured in hours or cycles. Also note that failure does not mean not
meeting specifications or an out-of-control process. It means only a
cracked solder joint in an accelerated life test.

Accession_Number : 2000:6746719 INSPEC

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